Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Abstract: A six-degree-of-freedom articulated robot mechanism includes a three-degree-of-freedom translation unit for adjusting the position. The translation unit includes an orientation maintaining mechanism which has a rotation articulation of the direct drive type connecting a drive motor directly to an arm, and a link mechanism. A three-degree-of-freedom rotation unit for adjusting the orientation includes three rotation articulators of the direct drive type connecting a drive motor directly to a table, and the axes of the three rotation articulators intersect one another at one point.