Abstract: According to one embodiment, a data processor includes an interface section and a processor. The interface section is configured to acquire partial data relating to a control condition of a magnetic recording/reproducing device. The processor is configured to process the partial data. The processor is configured to derive a first data by processing the partial data with a first model based on characteristics of the partial data, a first resolution of the first data being higher than a partial resolution of the partial data. The processor is configured to derive a second data by processing the partial data with a second model based on the characteristic. The second model is different from the first model. A second resolution of the second data being higher than the partial resolution.

Abstract: According to one embodiment, a magnetic recording device includes a magnetic recording medium group and a magnetic head group. The magnetic recording medium group includes a first magnetic recording medium, a plurality of second magnetic recording media, and a plurality of third magnetic recording media. The magnetic head group includes a first magnetic head, a plurality of second magnetic heads, and a plurality of third magnetic heads. The first magnetic head is configured to record data on the first magnetic recording medium by a first method. One of the plurality of second magnetic heads is configured to record data on one of the plurality of second magnetic recording media by a second method different from the first method. One of the plurality of third magnetic heads is configured to record data on one of the plurality of third magnetic recording media by the second method.

Abstract: According to one embodiment, a magnetic recording device includes a magnetic recording medium group and a magnetic head group. The magnetic recording medium group includes a first magnetic recording medium, a plurality of second magnetic recording media, and a plurality of third magnetic recording media. The magnetic head group includes a first magnetic head, a plurality of second magnetic heads, and a plurality of third magnetic heads. The first magnetic head is configured to record data on the first magnetic recording medium by a first method. One of the plurality of second magnetic heads is configured to record data on one of the plurality of second magnetic recording media by a second method different from the first method. One of the plurality of third magnetic heads is configured to record data on one of the plurality of third magnetic recording media by the second method.

Abstract: A mask structure includes a screen mask having a penetrating portion with a predetermined pattern. The screen mask includes a mesh portion having an opening formed in a grid pattern, and a mask portion having the penetrating portion and being fixed to the mesh portion so as to face the substrate. The mask portion includes a core portion that retains the shape of the mask portion, and a seal portion made of an elastic material softer than the material of the core portion and contacting the substrate.

Abstract: Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Abstract: The film formation device includes an anode made of an insoluble porous body, an electrolyte membrane disposed between a substrate serving as an anode and a cathode, and a housing provided with an accommodation chamber for storing a plating solution containing metal ions between the anode and the electrolyte membrane. The film formation device further includes a diaphragm that covers a cathode side of the anode and is attached so as to be in contact with the cathode side of the anode. The diaphragm is permeable to water and hydrogen ions and impermeable to oxygen gas. The anode is attached so as to close the opening on the side opposite to the cathode side of the accommodation housing so that the cathode side is exposed to the accommodation chamber via the diaphragm and the side opposite to the cathode side is exposed to the outside of the accommodation housing.

Abstract: According to one embodiment, a light detector includes a junction region, a first insulating portion, and a quenching part. The junction region includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type. The second semiconductor region is provided on the first semiconductor region and forms a p-n junction surface with the first semiconductor region. The first insulating portion has an inclined surface inclined with respect to a first direction perpendicular to the p-n junction surface and includes void. The inclined surface is provided at a same height as at least a portion of the junction region and crosses the second direction from the junction region toward the first insulating portion. The quenching part is electrically connected to the second semiconductor region.

Abstract: A film formation apparatus includes an anode, a solid electrolyte membrane between the anode and a substrate, a power supply that applies voltage between the anode and the substrate as a cathode, and a liquid reservoir that holds the anode and the solid electrolyte membrane while separating them apart from each other, the liquid reservoir storing electrolyte solution including metal ions between the anode and the solid electrolyte membrane. The solid electrolyte membrane includes a central portion that comes in contact with the substrate and the electrolyte solution, and an outer edge portion outside the central portion. The apparatus includes a membrane tensioning mechanism to apply a tensile force to the central portion toward the outer edge portion while storing the heated electrolyte solution in the liquid reservoir, to elongate the central portion.

Abstract: Provided is a film forming apparatus for forming a metal film capable of replacing an electrolyte membrane at a proper timing along with further degradation in the electrolyte membrane. The film forming apparatus includes a housing for containing a plating solution, the housing having an electrolyte membrane removably attached thereto; a replacement mechanism configured to replace the electrolyte membrane attached to the housing; a detecting device configured to detect a state of the electrolyte membrane or a state of the surface of the substrate after film formation; and a control device configured to control replacement of the electrolyte membrane. The control device determines whether there is degradation in the electrolyte membrane based on a result of detection by the detecting device, and if it is determined that the electrolyte membrane is degraded, causes the replacement mechanism to replace the electrolyte membrane.

Abstract: According to one embodiment, a light detector includes a plurality of elements. Each of the elements includes a first semiconductor region, a second semiconductor region, and a third semiconductor region. The second semiconductor region is located on the first semiconductor region and has a higher first-conductivity-type impurity concentration than the first semiconductor region. The third semiconductor region is located on the second semiconductor region. The elements are arranged at a first period in a second direction crossing a first direction. The first direction is from the first semiconductor region toward the second semiconductor region. A quenching part is electrically connected with the third semiconductor region. Multiple lenses are located respectively on the elements. One of the lenses is positioned on one of the elements. A refracting layer is located between the elements and the lenses. The refracting layer has a first thickness.

Abstract: According to one embodiment, a data processor includes an interface section and a processor. The interface section is configured to acquire partial data relating to a control condition of a magnetic recording/reproducing device. The processor is configured to process the partial data. The processor is configured to derive a first data by processing the partial data with a first model based on characteristics of the partial data, a first resolution of the first data being higher than a partial resolution of the partial data. The processor is configured to derive a second data by processing the partial data with a second model based on the characteristic. The second model is different from the first model. A second resolution of the second data being higher than the partial resolution.

Abstract: A mask structure includes a screen mask having a penetrating portion with a predetermined pattern. The screen mask includes a mesh portion having an opening formed in a grid pattern, and a mask portion having the penetrating portion and being fixed to the mesh portion so as to face the substrate. The mask portion includes a core portion that retains the shape of the mask portion, and a seal portion made of an elastic material softer than the material of the core portion and contacting the substrate.

Abstract: It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining.

Abstract: A method for manufacturing a wiring board in which the adhesion between an underlayer and a seed layer is improved. A diffusion layer in which an element forming the underlayer and an element forming a coating layer are mutually diffused is formed between the underlayer and a wiring portion of the coating layer by irradiating the wiring portion with a laser beam. A seed layer is formed by removing a portion excluding the wiring portion of the coating layer from the underlayer. A metal layer is formed by disposing a solid electrolyte membrane between an anode and the seed layer and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from an insulating substrate.

Abstract: First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

Abstract: According to one embodiment, a photomask includes a plurality of unit regions arranged in a first direction and a second direction crossing the first direction. Each of the unit regions includes a first region having a first light-shielding rate, and a second region having a second light-shielding rate different from the first light-shielding rate. The second region is provided around the first region. The unit regions include a first unit region and a second unit region having same size each other. A distance between the first unit region and a center of a range in which the unit regions are arranged is different from a distance between the second unit region and the center. A light-shielding rate of the first unit region is different from a light-shielding rate of the second unit region.

Abstract: According to one embodiment, a light detection device includes a first region, a second region, a first electrode, and a second electrode. The first region includes a plurality of first semiconductor light detection elements, and a plurality of first lenses respectively located on the plurality of first semiconductor light detection elements. The second region includes a plurality of second semiconductor light detection elements. No lens is located directly above the plurality of second semiconductor light detection elements. The first electrode is electrically connected with the plurality of first semiconductor light detection elements. The second electrode is electrically connected with the plurality of second semiconductor light detection elements.

Abstract: A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

Abstract: The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched.

Abstract: A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.