Abstract: The screen printing apparatus includes two screen printers 11A and 11B each including a substrate introduction portion 12 by which a substrate 4 is introduced from the upstream side of the component mounting line 3, a printing portion 13 which performs a screen printing to the introduced substrate 4, a substrate discharge portion 14 by which the substrate 4 subjected to the screen printing is discharged to the downstream side, and a substrate moving stage 15 which receives the introduced substrate 4 so as to position the substrate 4 with respect to the printing portion 13 and to move the substrate 4 subjected to the screen printing to the substrate discharge portion 14. The two substrate introduction portions 12, the two printing portions 13, and the two substrate discharge portions 14 are arranged symmetrically to each other with respect to a perpendicular symmetrical plane S extending in a transportation direction of the substrate 4 in the component mounting line 3, respectively.

Abstract: In a component mounting line 1 (a component mounting system) which includes substrate transport paths La, Lb, Lc which transport plural types of substrates 3 in a predetermined direction and a plurality of component mounter heads 10 which are provided along the substrate transport paths La, Lb, Lc for mounting sequentially components P on the plural types of substrates 3 which are transported by the substrate transport paths La, Lb, Lc, objects on which components are to be mounted by each movable component mounter head 10 are limited to one type of substrates 3 which are determined to be associated with that particular movable component mounter head 10.

Abstract: In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven and the linear motor are disposed such that a position P of thrust generated by the linear motor for driving the transfer beam 8 in the Y direction approximately corresponds to a central position D1 of inertial resistance of the object to be driven comprising movable portions such as transfer beam 8, loading head 9, and transfer plate 12. Accordingly, twisting moment applied to the transfer beam 8 due to inertial force is eliminated in acceleration/deceleration, and loading position accuracy is ensured and a component life can be lengthened.

Abstract: In estimating a curved surface model by approximating the shape of the board surface of a circuit board, auxiliary measurement spots are set other than measurement spots on the board surface, eligibility as a sampling displacement magnitude in estimating a curved surface model is determined according to a difference in a displacement magnitude from a work reference surface. When the sampling displacement magnitude is determined to be ineligible, a new measurement spot is reset. By this operation, a local increase and decrease in the displacement magnitude due to a discontinuity of the board surface exerts no influence on the estimation of the curved surface model, and the curved surface model approximated more closely to the shape of the actual board surface is estimated, leading to an improvement in the work quality with the working height adjusted to the proper height.

Abstract: In a Y linear driving mechanism 6 for moving an X linear driving mechanism 8 in a direction Y by a linear motor comprising a stator 16 and a moving element 17, there is provided a drive transmission portion which is connected to the moving element 17 so as to transmit a driving force of the moving element 17, acting in the direction Y, through a moving plate 18 and a connecting member 25. A first air gap G1 is formed between the moving element 17 and the moving plate 18, and a second air gap G2 is formed between the moving plate 18 and the connecting member 25. With this construction, the transfer of heat from the moving element 17 is interrupted in an operating condition, so that troubles, caused by the thermal expansion and contraction due to heat generated by the linear motor, can be prevented.

Abstract: An electronic parts mounting apparatus which holds an electronic part with a mounting head, photographs the electronic part by a line camera 11, processes an image of the electronic part photographed by the line camera to recognize a position of the electronic part by using a recognition unit 16, positions the electronic part to a substrate in accordance with the position recognition result, and mounts the electronic part on the substrate. Offset values which are pre-stored for each recognition system associated with its own light source, a light source for transmission illumination 15a or a light source for reflection illumination 15b, are used for offset values used when a position correction is made, at the time of positioning, based on the position recognition result.

Abstract: A mounting head unit for an electronic component for making a pick-up operation of the electronic component and loading operation thereof is removably attached to a head mounting bracket of an electronic component mounting device. Each mounting head unit is provided with a control board for controlling the a mounting mechanism including a plurality of unit mounting heads each equipped with an adsorption nozzle for holding the electronic component. In the mounting operation, on the basis of the operation command from a main unit control section for controlling the entire operation of the electronic component mounting device, the control board controls the operation of each of the unit mounting heads. In this way, the replacement of wirings in replacing the mounting head can be easily made and the time delay in signal processing can be removed to realize the high speed operation.

Abstract: In a linear driving mechanism which is arranged in electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven and the linear motor are disposed such that a position P of thrust generated by the linear motor for driving the transfer beam 8 in the Y direction approximately corresponds to a central position D1 of inertial resistance of the object to be driven comprising movable portions such as transfer beam 8, loading head 9, and transfer plate 12. Accordingly, twisting moment applied to the transfer beam 8 due to inertial force is eliminated in acceleration/deceleration, and loading position accuracy is ensured and a component life can be lengthened.

Abstract: An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

Abstract: In a Y linear driving mechanism 6 for moving an X linear driving mechanism 8 in a direction Y by a linear motor comprising a stator 16 and a moving element 17, there is provided a drive transmission portion which is connected to the moving element 17 so as to transmit a driving force of the moving element 17, acting in the direction Y, through a moving plate 18 and a connecting member 25. A first air gap G1 is formed between the moving element 17 and the moving plate 18, and a second air gap G2 is formed between the moving plate 18 and the connecting member 25. With this construction, the transfer of heat from the moving element 17 is interrupted in an operating condition, so that troubles, caused by the thermal expansion and contraction due to heat generated by the linear motor, can be prevented.

Abstract: An electronic parts mounting apparatus which holds an electronic part with a mounting head, photographs the electronic part by a line camera 11, processes an image of the electronic part photographed by the line camera to recognize a position of the electronic part by using a recognition unit 16, positions the electronic part to a substrate in accordance with the position recognition result, and mounts the electronic part on the substrate. Offset values which are pre-stored for each recognition system associated with its own light source, a light source for transmission illumination 15a or a light source for reflection illumination 15b, are used for offset values used when a position correction is made, at the time of positioning, based on the position recognition result.

Abstract: A component mounter has two or more feeder carriages and two or more mounting heads corresponding to the feeder carriages. The mounting heads pick up components from each feeder carriage. A transfer device is able to pass components requiring transfer between the mounting heads. The transfer of components enables the mounter to be used efficiently by transferring components to a different mounting head when the operation of one of the mounting heads stops.

Abstract: A mounting head unit for an electronic component for making a pick-up operation of the electronic component and loading operation thereof is removably attached to a head mounting bracket of an electronic component mounting device. Each mounting head unit is provided with a control board for controlling the a mounting mechanism including a plurality of unit mounting heads each equipped with an adsorption nozzle for holding the electronic component. In the mounting operation, on the basis of the operation command from a main unit control section for controlling the entire operation of the electronic component mounting device, the control board controls the operation of each of the unit mounting heads. In this way, the replacement of wirings in replacing the mounting head can be easily made and the time delay in signal processing can be removed to realize the high speed operation.

Abstract: An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

Abstract: A component mounting method for picking up components with a mounting head having multiple suction nozzles, and mounting these components on a mounting target after recognition. Components picked up integrally move against a component recognizer disposed on a movement route of the head for scanning and recognizing each component. During scanning, the slowest speed in scanning speeds required for recognizing each component is used. This eliminates a approaching time needed for switching speed during scanning of each component, thus reducing the total recognition time to improve mounting efficiency.

Abstract: Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.

Abstract: The cycle time for mounting electronic components supplied from a tray can be shortened. An electronic component feeder (16) for mounting electronic components has a plurality of height levels (L1, L2, and L3) and can move tables (19, 20, 21) horizontally at the respective levels (L1, L2, and L3). A plurality of conveyers (22, 23, 24) are provided for the respective tables to move them to a pickup stage (A) from a standby stage (B). Transfer head (13) includes nozzles (14a, 14b, 14c) for attracting electronic components by suction, and an upward-downward moving mechanism which moves the nozzles in accordance with the height level of each tray on the pickup stage (A). Since the trays are arranged at the different height levels at the pickup stage position, the conveyers can be moved independently and the transfer heads can individually move the nozzles between the position at which each nozzle picks up electronic components and another position at which the nozzle does not interfere with the pickup operation.

Abstract: An apparatus and method for improving the productivity and accuracy of mounting electronic components on a substrate. The mounting apparatus includes a line-sensor for image recognition, a carriage head 20 having plural nozzles 21a, 21b and 21c aligned along a predetermined axis. The carriage head 20 is transferred along the direction of the aligned nozzles and above the line-sensor 33 of a recognition member 30. The line-sensor 33 takes images in sequence of the electronic components (chip) vacuum chucked by each nozzle 21a, 21b and 21c in order to recognize positions of the chips 12. Then, based on the recognition results, position deviations of the chips 12 with regard to X, Y and .theta. directions are compensated, and the chips 12 are mounted onto specified coordinate spots of substrate 3. The recognition member 30 includes an adjusting means of rotation angle for crossing the longitudinal direction of line-sensor 33 with the transferring direction of nozzles 21a, 21b and 21c at right angles.