Abstract: A glass composition for protecting a semiconductor junction contains at least SiO2, B2O3, Al2O3, ZnO, and at least two oxides of alkaline earth metal selected from the group consisting of CaO, MgO and BaO, and substantially contains none of Pb, P, As, Sb, Li, Na and K.

Abstract: Provided is a method of manufacturing a semiconductor device which includes, in the following order: a first step of preparing a semiconductor element which includes a pn junction exposure portion; a second step of forming an insulation layer such that the insulation layer covers the pn junction exposure portion; and a third step of forming a glass layer on the insulation layer where a layer made of glass composition for protecting a semiconductor junction is formed on the insulation layer and, thereafter, the layer made of glass composition for protecting a semiconductor junction is baked.

Abstract: In an optical pickup device for use in recording and reproducing on an optical recording medium, such as a CD or DVD, banks are formed on both sides of an adhesive agent application position for adhering an optical device, such as a photodetector or a laser diode, in an optical pickup case. At this time, a bank on the side of an optical path is formed higher than a height of an outer bank, and an adhesive agent is poured between the banks, to adhere the optical pickup case and the optical device.

Abstract: In an optical pickup device for use in recording and reproducing on an optical recording medium, such as a CD or DVD, banks are formed on both sides of an adhesive agent application position for adhering an optical device, such as a photodetector or a laser diode, in an optical pickup case. At this time, a bank on the side of an optical path is formed higher than a height of an outer bank, and an adhesive agent is poured between the banks, to adhere the optical pickup case and the optical device.

Abstract: The optical pickup device includes a light-emitting element that emits light, an objective lens that converges light emitted by the light-emitting element on an external optical recording medium, a light-receiving element that receives the light returned from the optical recording medium via the objective lens, a holder that holds the light-emitting element or the light-receiving element, and a casing to which the holder is secured with an adhesive interposed therebetween. The holder has a holder's bonding surface to be bonded to the casing, while the casing has a case's bonding surface facing the holder's bonding surface and to be bonded to the holder. The holder's or casing's bonding surface is provided with adjoining sidewalls that have wall faces forming an angle with the holder's or casing's bonding surface. The holder and casing are adhesively secured to each other with a UV-curable adhesive applied on the holder's or casing's bonding surface.

Abstract: At least one of plural gears includes a tooth-side base portion and an opposite base portion that are disposed coaxially and connected to each other by connecting portions, the tooth-side base portion is formed in the shape of a ring and includes a tooth row on one peripheral surface thereof, and the opposite base portion faces a peripheral surface of the tooth-side base portion opposite to the peripheral surface of the tooth-side base portion on which the tooth row is formed. Protruding portions are formed on the peripheral surface of the tooth-side base portion facing the opposite base portion. The connecting portions extend from the protruding portions toward the peripheral surface of the opposite base portion facing the tooth-side base portion. A portion, which is connected to the tooth-side base portion, of each connecting portion and a peripheral surface-tangential direction of the tooth-side base portion form an acute angle.

Abstract: A glass composition for protecting a semiconductor junction contains at least SiO2, Al2O3, MO, and nickel oxide, and substantially contains none of Pb, P, As, Sb, Li, Na and K (M in MO indicates one of alkali earth metals).

Abstract: A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover film formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover film, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover film. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.

Abstract: Provided is a glass composition for protecting a semiconductor junction which contains at least SiO2, Al2O3, ZnO, CaO and 3 mol % to 10 mol % of B2O3, and substantially contains none of Pb, P, As, Sb, Li, Na and K. It is preferable that a content of SiO2 falls within a range of 32 mol % to 48 mol %, a content of Al2O3 falls within a range of 9 mol % to 13 mol %, a content of ZnO falls within a range of 18 mol % to 28 mol %, a content of CaO falls within a range of 15 mol % to 23 mol %, and a content of B2O3 falls within a range of 3 mol % to 10 mol %.

Abstract: A vaporizing apparatus includes a heating plate disposed in a container to heat and vaporize a liquid chemical, a gas supply unit configured to supply a carrier gas carrying the chemical vaporized by the heating plate, into the container, a first detecting unit configured to detect the supply of the carrier gas into the container, and a second detecting unit configured to detect the vaporization of the liquid chemical by the heating plate.

Abstract: A transparent cured film including organic fine particles having an ultraviolet absorbing group and an average particle diameter of 1 to 200 nm, the particles being dispersed in a matrix having an Si—O bond, and having a transmittance of visible light of 80% or more and a haze value of 10% or less. The coating composition can be produced, for example, from a coating composition containing (1) an alkoxysilane compound or polyalkoxysilane compound; (2) an aminosilane compound; (3) an epoxysilane compound; (4) a polymer ultraviolet absorber; (5) a curing catalyst; and (6) a solvent.

Abstract: A transparent cured film including organic fine particles having an ultraviolet absorbing group and an average particle diameter of 1 to 200 nm, the particles being dispersed in a matrix having an Si—O bond, and having a transmittance of visible light of 80% or more and a haze value of 10% or less. The coating composition can be produced, for example, from a coating composition containing (1) an alkoxysilane compound or polyalkoxysilane compound; (2) an aminosilane compound; (3) an epoxysilane compound; (4) a polymer ultraviolet absorber; (5) a curing catalyst; and (6) a solvent.

Abstract: Provided are novel ?-lipoic acid derivatives represented by the following formula (I), which have a tyrosinase inhibiting activity, a melanin production suppressing activity and an elastase inhibiting activity. (In the formula, M denotes a metal, and A denotes an amino acid which is bound via N.

Abstract: A novel ?-lipoic acid derivative represented by the following formula (I). It has a tyrosinase inhibiting activity, melanin production inhibitory activity, and elastase inhibiting activity. (I) (In the formula, M represents a metal and A denotes an amino acid residue bonded through the nitrogen atom.).

Abstract: A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.

Abstract: A transparent cured film including organic fine particles having an ultraviolet absorbing group and an average particle diameter of 1 to 200 nm, the particles being dispersed in a matrix having an Si—O bond, and having a transmittance of visible light of 80% or more and a haze value of 10% or less. The coating composition can be produced, for example, from a coating composition containing (1) an alkoxysilane compound or polyalkoxysilane compound; (2) an aminosilane compound; (3) an epoxysilane compound; (4) a polymer ultraviolet absorber; (5) a curing catalyst; and (6) a solvent.

Abstract: A cured film including: organic ultraviolet-absorbing particles having an average particle diameter of 1 to 200 nm; and inorganic ultraviolet-absorbing particles and/or colloidal silica having an average particle diameter of 1 to 200 nm; the particles being dispersed in a matrix having an Si—O bond.

Abstract: In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Abstract: A transparent cured film including organic fine particles having an ultraviolet absorbing group and an average particle diameter of 1 to 200 nm, the particles being dispersed in a matrix having an Si—O bond, and having a transmittance of visible light of 80% or more and a haze value of 10% or less. The coating composition can be produced, for example, from a coating composition containing (1) an alkoxysilane compound or polyalkoxysilane compound; (2) an aminosilane compound; (3) an epoxysilane compound; (4) a polymer ultraviolet absorber; (5) a curing catalyst; and (6) a solvent.