Abstract: A semiconductor device includes a first pad, a second pad, a first output driver provided for the first pad and configured to output a first transmission signal to the first pad, a second output driver provided for the second pad and configured to output a second transmission signal to the second pad, a register that stores first and second calibration values, a first reference resistor for the first pad and having a resistance value that is set according to the first calibration value, a second reference resistor for the second pad and having a resistance value that is set according to the second calibration value, a first setting circuit configured to calibrate a resistance value of the first output driver using the first reference resistor, and a second setting circuit configured to calibrate a resistance value of the second output driver using the second reference resistor.

Abstract: A semiconductor memory device includes an output pin configured for connection with a memory controller, an output circuit configured to output through the output pin a voltage signal that changes over time in accordance with one or more bits of data to be output to the memory controller, and a control circuit configured to temporarily change a drive capability of the output circuit each time a voltage signal corresponding to one bit of the data is output through the output pin.

Abstract: A heating device includes: a baseplate; a faceplate provided above the baseplate, the faceplate including a film heater configured to heat a wafer mounted on an upper surface of the faceplate; a sleeve provided between the baseplate and the faceplate, the sleeve including a sleeve body having a vertical through-hole; and a support bolt penetrating the through-hole in the sleeve to support the faceplate on the baseplate, in which a distance from a central axis of the through-hole in the sleeve to a flat surface of an outer portion of the sleeve is less than a distance from the central axis of the through-hole to a locking surface of an inner portion of the sleeve.

Abstract: A heating device includes: a baseplate; a faceplate provided above the baseplate, the faceplate including a film heater configured to heat a wafer mounted on an upper surface of the faceplate; a sleeve provided between the baseplate and the faceplate, the sleeve including a sleeve body having a vertical through-hole; and a support bolt penetrating the through-hole in the sleeve to support the faceplate on the baseplate, in which a distance from a central axis of the through-hole in the sleeve to a flat surface of an outer portion of the sleeve is less than a distance from the central axis of the through-hole to a locking surface of an inner portion of the sleeve.

Abstract: A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

Abstract: A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

Abstract: A stage for a substrate temperature control apparatus having high reliability at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage is used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.

Abstract: The antenna includes a power-feeding radiation electrode and a non-power-feeding radiation electrode are provided adjacent to each other with a gap therebetween on the flexible substrate, which also is bendable. The power-feeding radiation electrode is used to perform antenna operation in a basic mode in which resonant operation is performed at a basic frequency and antenna operation in a high-order mode in which resonant operation is performed at a frequency higher than the basic frequency. The power-feeding radiation electrode includes a loop path configured such that the power-feeding radiation electrode first extends in a direction away from a power-feeding end and an open end is bent toward the power-feeding end. The non-power-feeding radiation electrode has one end serving as a ground-side end and the other end serving as an open end.

Abstract: The antenna includes a power-feeding radiation electrode and a non-power-feeding radiation electrode are provided adjacent to each other with a gap therebetween on the flexible substrate, which also is bendable. The power-feeding radiation electrode is used to perform antenna operation in a basic mode in which resonant operation is performed at a basic frequency and antenna operation in a high-order mode in which resonant operation is performed at a frequency higher than the basic frequency. The power-feeding radiation electrode includes a loop path configured such that the power-feeding radiation electrode first extends in a direction away from a power-feeding end and an open end is bent toward the power-feeding end. The non-power-feeding radiation electrode has one end serving as a ground-side end and the other end serving as an open end.

Abstract: A stage for a substrate temperature control apparatus having high responsibility at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage for a substrate temperature control apparatus is a stage to be used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.

Abstract: A dielectric resonance element resonating in the TE01 ? mode and a protrusion portion disposed in a direction perpendicular to the bottom surface of the dielectric resonance element are integrally molded, and the side face at the outer periphery of the protrusion portion is tilted such that the area on the bottom-surface side of the dielectric resonance element is larger than the area of the lower surface of the protrusion portion. Because of such a structure, the magnetic field of the dielectric resonance element spreads to the tilted portion of the side face at the outer periphery of the protrusion portion and around the tilted portion of the side face, and the magnetic field distribution increases under the dielectric resonance element. Even if an input-output electrode is disposed at a location away from the protrusion portion, the input-output electrode is strongly coupled to the dielectric resonance element, resulting in a sufficient coupling.

Abstract: Ceramic cavities 1a and 1b have upper and lower open faces and contain dielectric cores 2a and 2b formed integrally therein. The ceramic cavities 1a and 1b are sandwiched between upper and lower panels 3 and 4 at the upper and lower open faces, respectively, of the ceramic cavities 1a and 1b via grounding plates 5a and 5b and grounding plates 6a and 6b, respectively, and the upper and lower panels 3 and 4 are fixed by screws. Based on this structure, a problem of an unreliable joint part between an open face of a ceramic cavity and a metal panel connected directly to each other by soldering and the problem of increase of the number of components of a structure in which a printed circuit board is mounted to the open face of the ceramic cavity by using grounding plates can be overcome, even when the ceramic cavity has an open face formed in a complex shape.

Abstract: A dielectric filter that has attenuation poles on both the low frequency side and the high frequency side of its pass band, without using two dielectric resonators. The dielectric filter includes a cavity in which a conductive layer is formed, and a cross-shaped dielectric resonator disposed within the cavity, the dielectric resonator having at least three resonant modes, and coupling loops being coupled to the dielectric resonator. A coupling loop couples to a resonant mode at a first stage, among the resonant modes of the dielectric resonator, and also couples to resonant mode at a third stage in approximately negative-phase with respect to the first stage.

Abstract: Ceramic cavities 1a and 1b have upper and lower open faces and contain dielectric cores 2a and 2b formed integrally therein. The ceramic cavities 1a and 1b are sandwiched between upper and lower panels 3 and 4 at the upper and lower open faces, respectively, of the ceramic cavities 1a and 1b via grounding plates 5a and 5b and grounding plates 6a and 6b, respectively, and the upper and lower panels 3 and 4 are fixed by screws. Based on this structure, a problem of an unreliable joint part between an open face of a ceramic cavity and a metal panel connected directly to each other by soldering and the problem of increase of the number of components of a structure in which a printed circuit board is mounted to the open face of the ceramic cavity by using grounding plates can be overcome, even when the ceramic cavity has an open face formed in a complex shape.

Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.

Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.

Abstract: A dielectric filter in which a desirable amount of coupling is obtainable, and the positions of an input coupling unit and an output coupling unit can be easily arranged. The dielectric filter includes a shield case, a dielectric resonator disposed inside the shield case, a supporting base for supporting the dielectric resonator, the input coupling unit, and the output coupling unit. Both the input coupling unit and the output coupling unit are coupled to the dielectric resonator. The output coupling unit is a probe with an open-circuited end, extending on a side where the supporting base of the dielectric resonator is disposed.

Abstract: Ceramic cavities 1a and 1b have upper and lower open faces and contain dielectric cores 2a and 2b formed integrally therein. The ceramic cavities 1a and 1b are sandwiched between upper and lower panels 3 and 4 at the upper and lower open faces, respectively, of the ceramic cavities 1a and 1b via grounding plates 5a and 5b and grounding plates 6a and 6b, respectively, and the upper and lower panels 3 and 4 are fixed by screws. Based on this structure, a problem of an unreliable joint part between an open face of a ceramic cavity and a metal panel connected directly to each other by soldering and the problem of increase of the number of components of a structure in which a printed circuit board is mounted to the open face of the ceramic cavity by using grounding plates can be overcome, even when the ceramic cavity has an open face formed in a complex shape.

Abstract: A method and an apparatus for exactly and automatically adjusting the characteristics of a dielectric filter in a short time period. The characteristic parameters of a dielectric filter are measured, electric parameters of a designed equivalent circuit of the filter are calculated with the use of characteristic parameters, characteristic adjusting portions of the dielectric filter are adjusted, while at the same time, adjustment functions indicating the variation amounts of electric parameters with respect to adjusting amounts are calculated with the use of the electric parameters and the adjusting amounts which have been changed by the above adjustment. Then, in accordance with simultaneous equations involving adjustment functions, an adjusting amount is calculated with the use of a difference between a present electric parameter and a desired electric parameter, thereby effecting an adjustment which is for example 50%.

Abstract: A band elimination dielectric filter in which the non loaded Q is increased by substantially eliminating the actual current flowing in a shield cavity, and the height is reduced. The band elimination dielectric filter includes a conductive shield cavity 11, a dielectric resonator 12 which is arranged in the shield cavity 11 and in which electrodes 18 are formed on two surfaces opposite to each other; and an external coupling 13 which is arranged in the shield cavity and connected to the dielectric resonator 12.