Patents by Inventor Kazuhiro Inoue

Kazuhiro Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11145050
    Abstract: A pattern inspection apparatus includes an optical image acquisition mechanism to acquire optical image data of a plurality of regions from a substrate where a plurality of figure patterns are formed, a plurality of comparison circuits each of which performs one of die-to-die inspection processing for comparing the optical image data with each other and die-to-database inspection processing for comparing the optical image data with reference image data generated from design pattern data, and an inspection circuit to individually output, for each region of the plurality of regions, the optical image data of a region concerned to comparison circuits, whose number is variably set for each region, in the plurality of comparison circuits, and to control each comparison circuit, serving as an output destination of the optical image data in the plurality of comparison circuits, to perform one of the die-to-die inspection processing and the die-to-database inspection processing.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: October 12, 2021
    Assignee: NuFlare Technology, Inc.
    Inventors: Takafumi Inoue, Kazuhiro Nakashima, Manabu Isobe, Hiroteru Akiyama
  • Patent number: 11133191
    Abstract: The etching mask 80 for screen printing according to one embodiment of the present invention includes aliphatic polycarbonate. Further, the method of producing an oxide layer (the channel 44) according to one embodiment of the present invention includes: an etching-mask forming step of forming a pattern of the etching mask 80 including aliphatic polycarbonate; a contact step of, after the etching-mask forming step, contacting the oxide layer with a solution for dissolving a portion of the oxide layer (the channel 44) which is not protected by the etching mask 80; and a heating step of, after the contact step, heating the oxide layer (the channel 44) and the etching mask 80 to or above a temperature at which the etching mask 80 is decomposed.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: September 28, 2021
    Assignees: JAPAN ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Satoshi Inoue, Tatsuya Shimoda, Kazuhiro Fukada, Kiyoshi Nishioka, Nobutaka Fujimoto, Masahiro Suzuki
  • Publication number: 20210296526
    Abstract: A light emitting element includes: a semiconductor structure including: a substrate, an n-side nitride semiconductor layer located on the substrate, and a p-side nitride semiconductor layer located on the n-side nitride semiconductor layer, wherein a p-side nitride semiconductor side of the semiconductor structure is a light extraction face side, and an n-side nitride semiconductor side of the semiconductor structure is a mounting face side; a first protective layer located on and in direct contact with an upper face of the p-side nitride semiconductor layer in a region corresponding to the peripheral portion of the p-side nitride semiconductor layer; and a current diffusion layer located on and in direct contact with an upper face of the p-side nitride semiconductor layer in a region corresponding to the area inside of the peripheral portion. The current diffusion layer does not overlap the first protective layer in a top view.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Shun KITAHAMA, Yoshiki INOUE, Kazuhiro NAGAMINE, Junya NARITA
  • Publication number: 20210276132
    Abstract: A laser processing device includes a laser irradiation unit that performs processing on a workpiece by using a laser while scanning a workpiece surface to form a kerf, jet nozzles that respectively form jet flows flowing toward a bottom surface of the kerf on front and rear sides in a scanning direction of the laser, and an intake part that sucks, above injection ports of the jet nozzles, a gas in a region surrounded by the jet flows from the front and rear sides. In a state in which a certain region of the kerf is isolated by the jet flows, the gas is sucked from this region by the intake part. As a result, a suction force by the intake part can reach the bottom surface of the kerf.
    Type: Application
    Filed: January 26, 2021
    Publication date: September 9, 2021
    Inventors: Yoshinao KOMATSU, Kazuhiro YOSHIDA, Saneyuki GOYA, Akiko INOUE, Yasuyuki FUJIYA, Ryuichi NARITA
  • Publication number: 20210226001
    Abstract: A semiconductor device that includes a semiconductor substrate having a first main surface and a second main surface that face each other in a thickness direction, the first main surface containing a trench; an insulation layer on a surface of the trench; a first electrode layer on the insulation layer; a first dielectric layer on the first electrode layer; and a second electrode layer on the first dielectric layer, in which a thickness (L1) of the insulation layer, a thickness (L2) of the first electrode layer, and a thickness (L4) of the second electrode layer satisfy L1>L2>L4.
    Type: Application
    Filed: November 5, 2020
    Publication date: July 22, 2021
    Inventors: Koichi Nishita, Masaki Takeuchi, Yutaka Takeshima, Kazuhiro Inoue
  • Publication number: 20210226007
    Abstract: A semiconductor device that includes a semiconductor substrate having a first main surface and a second main surface facing each other in a thickness direction, the first main surface including a trench. The trench has a predetermined depth in the thickness direction and has a substantially wedge shape that has a first side surface and a second side surface that face each other and are not parallel to each other, and a first end surface and a second end surface that face each other and are substantially parallel to each other. The first side surface and the second side surface intersect each other at a line, or extension surfaces of the first side surface and the second side surface extended in the thickness direction intersect each other at a line, and the line extends in a first direction that does not align with a cleavage plane of the semiconductor substrate.
    Type: Application
    Filed: October 14, 2020
    Publication date: July 22, 2021
    Inventors: Koichi Nishita, Masaki Takeuchi, Yutaka Takeshima, Kazuhiro Inoue
  • Publication number: 20210226000
    Abstract: A semiconductor device that includes a semiconductor substrate; a first capacitance section on the semiconductor substrate, the first capacitance section including a first electrode layer, a first dielectric layer, and a second electrode layer; a second capacitance section on the semiconductor substrate, the second capacitance section including a third electrode layer, a second dielectric layer, and a fourth electrode layer; a first external electrode; a second external electrode; a first lead wire led out from the first capacitance section to the first external electrode and having an inductance L1; and a second lead wire led out from the second capacitance section to the second external electrode and having an inductance L2, wherein an electrostatic capacity C1 of the first capacitance section and an electrostatic capacity C2 of the second capacitance section are different, and L1/L2=0.8 to 1.2.
    Type: Application
    Filed: October 8, 2020
    Publication date: July 22, 2021
    Inventors: Koichi Nishita, Masaki Takeuchi, Yutaka Takeshima, Kazuhiro Inoue
  • Patent number: 10842211
    Abstract: The purpose of the present invention is to provide a heat-retaining article exhibiting excellent heat retention. This heat-retaining article (1) is configured so as to be provided with a first sheet (12), a second sheet (13), and a filler material (15) positioned between the first sheet (12) and the second sheet (13), and is characterized by being equipped with a plurality of joining sections (11) for joining the first sheet (12) and the second sheet (13) to one another, and in that the plurality of joining sections (11) are separated from one another and form a dot pattern.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: November 24, 2020
    Assignee: GOLDWIN INC.
    Inventors: Kazuhiro Inoue, Hirotatsu Shibata
  • Patent number: 10656524
    Abstract: A substrate on which exposure processing has not been performed is carried into a placement cooling unit and cooled. The cooled substrate is held and carried out from the placement cooling unit by a transport device. In the case where an exposure device is able to receive the substrate, the substrate that has been carried out from the placement cooling unit is transported to the exposure device by the transport device. In the case where the exposure device is unable to receive the substrate, the substrate that has been carried out from the platform cooling unit is carried into a cooling buffer unit by the transport device. In the cooling buffer unit, a temperature of the substrate is maintained. After the exposure device becomes able to receive the substrate, the substrate is carried out from the cooling buffer unit and transported to the exposure device by the transport device.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 19, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Koji Nishiyama, Kazuhiro Inoue
  • Patent number: 10615103
    Abstract: Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: April 7, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Kazuhiro Inoue
  • Patent number: 10505260
    Abstract: An antenna device includes a finite ground plane that includes a linear side, a first conductor plate that faces the finite ground plane and includes a side corresponding to the side of the finite ground plane and having a length of substantially a ? wavelength or less, and a conductor line that includes one end connected to the side of the first conductor plate and the other end short-circuited to one end portion of the side of the finite ground plane. The antenna device further includes a second conductor plate that faces the finite ground plane, includes a side corresponding to the side of the finite ground plane and having a length of substantially a ? wavelength or less, and is arranged to be adjacent to the first conductor plate to perform capacitive coupling with the first conductor plate and a feed line that includes one end connected to the side of the second conductor plate and the other end connected to the other end portion of the side of the finite ground plane.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 10, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuhiro Inoue, Takafumi Ohishi, Makoto Higaki
  • Patent number: 10447349
    Abstract: A wireless communication system includes a first tag installed on a ground outside a track for a running train, the first tag being driven by wirelessly received power, a second tag installed outside a side face of the train and above the first tag, the side face extending in a running direction, the second tag being driven by wirelessly received power, a wireless communicator which is installed in the train and performs wireless communication with the first tag and the second tag, and an antenna which is installed in the train and has a gain in directions of the first tag and the second tag.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: October 15, 2019
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takahiro Sekiguchi, Noritaka Deguchi, Tatsuma Hirano, Makoto Higaki, Kazuhiro Inoue
  • Publication number: 20190295933
    Abstract: Provided is a semiconductor device according to an embodiment including a first electrode terminal containing copper, a second electrode terminal containing copper, a semiconductor chip provide the first electrode terminal and provided inside the first electrode terminal, a metal member provided on the semiconductor chip, protruding to an outside of the semiconductor chip in at least two directions, electrically connected to the second electrode terminal, and containing copper, and a mold resin surrounding the semiconductor chip.
    Type: Application
    Filed: July 5, 2018
    Publication date: September 26, 2019
    Inventor: Kazuhiro Inoue
  • Publication number: 20180116317
    Abstract: The purpose of the present invention is to provide a heat-retaining article exhibiting excellent heat retention. This heat-retaining article (1) is configured so as to be provided with a first sheet (12), a second sheet (13), and a filler material (15) positioned between the first sheet (12) and the second sheet (13), and is characterized by being equipped with a plurality of joining sections (11) for joining the first sheet (12) and the second sheet (13) to one another, and in that the plurality of joining sections (11) are separated from one another and form a dot pattern.
    Type: Application
    Filed: January 12, 2016
    Publication date: May 3, 2018
    Applicants: GOLDWIN INC., GOLDWIN TECHNICAL CENTER INC.
    Inventors: Kazuhiro Inoue, Hirotatsu Shibata
  • Patent number: 9912416
    Abstract: A communication device includes a ground unit, a dielectric plate, a communication circuit, a conductor, and a capacitance element. The ground unit has a reference potential applied to the ground unit. The dielectric plate is provided on the ground unit. The communication circuit is provided on the dielectric plate and performs a transmission and a reception of a signal. The conductor is connected to the communication circuit. An end of the capacitance element is connected to the conductor. An another end of the capacitance element is connected to the ground unit. A capacitance of the capacitance element is smaller than a capacitance formed between the conductor and the ground unit. The capacitance of the capacitance element is bigger than a capacitance formed between the conductor and the ground unit being caused by a human body touching or approximating to the conductor.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: March 6, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takafumi Ohishi, Kazuhiro Inoue
  • Publication number: 20180052393
    Abstract: A substrate on which exposure processing has not been performed is carried into a placement cooling unit and cooled. The cooled substrate is held and carried out from the placement cooling unit by a transport device. In the case where an exposure device is able to receive the substrate, the substrate that has been carried out from the placement cooling unit is transported to the exposure device by the transport device. In the case where the exposure device is unable to receive the substrate, the substrate that has been carried out from the platform cooling unit is carried into a cooling buffer unit by the transport device. In the cooling buffer unit, a temperature of the substrate is maintained. After the exposure device becomes able to receive the substrate, the substrate is carried out from the cooling buffer unit and transported to the exposure device by the transport device.
    Type: Application
    Filed: July 27, 2017
    Publication date: February 22, 2018
    Inventors: Koji NISHIYAMA, Kazuhiro INOUE
  • Patent number: 9853195
    Abstract: A light-emitting device includes a semiconductor light-emitting element, for example, a light emitting diode. A first metal member includes a first metal plate and a first metal layer between the semiconductor light-emitting element and a first surface of the first metal plate. An insulating layer contacts a second surface of the first metal plate. The second surface is in a second plane that intersects a first plane of the first surface.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: December 26, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuki Akamatsu, Yoshio Noguchi, Masahiro Ogushi, Teruo Takeuchi, Toshihiro Kuroki, Hidenori Egoshi, Takashi Arakawa, Kazuhiro Inoue, Toshihiro Komeya
  • Publication number: 20170310368
    Abstract: A wireless communication system includes a first tag installed on a ground outside a track for a running train, the first tag being driven by wirelessly received power, a second tag installed outside a side face of the train and above the first tag, the side face extending in a running direction, the second tag being driven by wirelessly received power, a wireless communicator which is installed in the train and performs wireless communication with the first tag and the second tag, and an antenna which is installed in the train and has a gain in directions of the first tag and the second tag.
    Type: Application
    Filed: July 6, 2017
    Publication date: October 26, 2017
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takahiro SEKIGUCHI, Noritaka DEGUCHI, Tatsuma HIRANO, Makoto HIGAKI, Kazuhiro INOUE
  • Publication number: 20170141457
    Abstract: An antenna device includes a substrate, and a linear conductive element disposed on the substrate, the linear conductive element having a loop shape in line symmetry with respect to a first straight line and a second straight line perpendicular to the first straight line, respectively, an electrical length between intersection points of the linear conductive element and the first straight line is an integer multiple of a wavelength in a resonance frequency.
    Type: Application
    Filed: January 27, 2017
    Publication date: May 18, 2017
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takafumi OHISHI, Kazuhiro INOUE
  • Publication number: 20170111124
    Abstract: A communication device includes a ground unit, a dielectric plate, a communication circuit, a conductor, and a capacitance element. The ground unit has a reference potential applied to the ground unit. The dielectric plate is provided on the ground unit. The communication circuit is provided on the dielectric plate and performs a transmission and a reception of a signal. The conductor is connected to the communication circuit. An end of the capacitance element is connected to the conductor. An another end of the capacitance element is connected to the ground unit. A capacitance of the capacitance element is smaller than a capacitance formed between the conductor and the ground unit. The capacitance of the capacitance element is bigger than a capacitance formed between the conductor and the ground unit being caused by a human body touching or approximating to the conductor.
    Type: Application
    Filed: December 27, 2016
    Publication date: April 20, 2017
    Inventors: Takafumi OHISHI, Kazuhiro INOUE