Patents by Inventor Kazuhiro Inoue

Kazuhiro Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8449712
    Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: May 28, 2013
    Assignee: Panasonic Corporation
    Inventors: Yoshimasa Inamoto, Hachiro Nakatsuji, Kazuhiro Inoue, Hiroyuki Tsuji
  • Publication number: 20130088676
    Abstract: A vertical alignment liquid crystal layer is sealed between a first substrate having a first electrode and a second substrate having a second electrode, each pixel region has a reflective region and a transmissive region, and a gap adjusting section is provided on one of sides of the first substrate and the second substrate which sets a thickness (gap) d of the liquid crystal layer which controls a phase difference of incident light to the liquid crystal layer so that a gap dr in the reflective region is smaller than a gap dt in the transmissive region. An alignment controller which divides alignment of the liquid crystal within a pixel region is provided in the pixel region on at least one of the sides of the first substrate and the second substrate. It is also possible to optimize by changing the gap in red, green, and blue.
    Type: Application
    Filed: November 28, 2012
    Publication date: April 11, 2013
    Inventors: Norio KOMA, Kazuyuki MAEDA, Masayuki KAMETANI, Kazuhiro INOUE, Masaaki AOTA
  • Patent number: 8399794
    Abstract: A first inert gas (5) is supplied into a reaction space (1) and a high-frequency power supply (4) applies a high-frequency electric field so that a primary plasma (6) composed of the first inert gas which has been made into the plasma is ejected from the reaction space. A mixed gas area (10) in which a mixed gas (8) having a second inert gas (12) as a main ingredient and a proper amount of a reactive gas (13) mixed is formed. The primary plasma collides into the mixed gas area to generate a secondary plasma (11) composed of the mixed gas which has been made into the plasma, and the secondary plasma is sprayed on a processed object (S) to carry out a plasma processing. Accordingly, the plasma processing is carried out in a wide range by an atmospheric pressure plasma generated by a small input power.
    Type: Grant
    Filed: May 28, 2007
    Date of Patent: March 19, 2013
    Assignee: Panasonic Corporation
    Inventors: Hiroyuki Tsuji, Kazuhiro Inoue
  • Patent number: 8378347
    Abstract: According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: February 19, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Satoshi Shimizu, Kazuhisa Iwashita, Teruo Takeguchi, Tetsuro Komatsu, Hiroaki Oshio, Tatsuo Tonedachi, Naoya Ushiyama, Kazuhiro Inoue, Gen Watari
  • Patent number: 8368614
    Abstract: An antenna apparatus includes: a ground plane; a plurality of conductive elements arranged substantially in parallel to a surface of the ground plane; a plurality of linear elements configured to connect the conductive elements to the ground plane; and an antenna configured to radiate a radio wave, wherein a plurality of openings to reflect the radio wave radiated from the antenna are formed in the ground plane under an arrangement region of the conductive elements.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: February 5, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Inoue, Makoto Higaki, Akiko Yamada
  • Patent number: 8345198
    Abstract: A vertical alignment liquid crystal layer is sealed between a first substrate having a first electrode and a second substrate having a second electrode, each pixel region has a reflective region and a transmissive region, and a gap adjusting section is provided on one of sides of the first substrate and the second substrate which sets a thickness (gap) d of the liquid crystal layer which controls a phase difference of incident light to the liquid crystal layer so that a gap dr in the reflective region is smaller than a gap dt in the transmissive region. An alignment controller which divides alignment of the liquid crystal within a pixel region is provided in the pixel region on at least one of the sides of the first substrate and the second substrate. It is also possible to optimize by changing the gap in red, green, and blue.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: January 1, 2013
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Norio Koma, Kazuyuki Maeda, Masayuki Kametani, Kazuhiro Inoue, Masaaki Aota
  • Patent number: 8334587
    Abstract: In at least one aspect, a semiconductor light emitting device may include a first lead, a second lead provided being apart from the first lead, a semiconductor light emitting element provided on the first lead, a wiring electrically connecting the semiconductor light emitting element and the second lead, a first resin being optically transparent to light from the semiconductor light emitting element, the first resin covering the semiconductor light emitting element, and a second resin provided on the first resin, the first lead and the second lead, and being optically transparent to light from the semiconductor light emitting element, wherein a part of the first lead which is covered with the second resin is symmetric with respect to a vertical line passing through the semiconductor light emitting element in a cross-sectional view cut along a plane, the plane passing the semiconductor light emitting element and being parallel with a direction to which the first lead is extended.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: December 18, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Inoue, Haruhiko Okazaki, Hiroyuki Nakashima
  • Patent number: 8319320
    Abstract: According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: November 27, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Inoue, Kazuhisa Iwashita, Teruo Takeuchi, Tatsuo Tonedachi, Hiroaki Oshio, Tetsuro Komatsu, Naoya Ushiyama
  • Patent number: 8319927
    Abstract: An orientation controller which divides a pixel into a plurality of different priority alignment regions and an additional orientation controller are provided in a pixel. The additional orientation controller is provided at least at an end of a pixel of a long-side alignment region formed along the long side of the pixel among the divided alignment regions, for example, around a center position of the long side of the pixel. The additional orientation controller can be realized, for example, by forming a cutout pattern in a side of a first electrode (pixel electrode) forming a part of the pixel. Because the alignment direction is also controlled by the additional orientation controller, the alignment of liquid crystal in this region is stabilized.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: November 27, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Norio Koma, Kazuhiro Inoue, Masashi Mitsui
  • Publication number: 20120273826
    Abstract: According to one embodiment, an LED package includes a first leadframe and a second leadframe mutually-separated, an LED chip and a resin body. The LED chip is provided above the first and second leadframes. One terminal of the LED chip is connected to the first leadframe. One other terminal is connected to the second leadframe. The resin body covers an entire upper surface, a portion of a lower surface, and a portion of an end surface of each of the first and second leadframes. The resin body covers the LED chip. Remaining portions of the lower surface and the end surface of each of the first and second leadframes are exposed on the resin body. First and second recesses are made between the remaining portions of the first and second leadframes. An inner surface of each of the first and second recesses is not covered with the resin body.
    Type: Application
    Filed: September 16, 2011
    Publication date: November 1, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mami Yamamoto, Kazuhiro Inoue, Satoshi Shimizu, Hidenori Egoshi, Yasunori Nagahata
  • Publication number: 20120194392
    Abstract: This antenna includes: a ground conductor part; and a radiation conductor part that is disposed substantially parallel to and a predetermined distance apart from the ground conductor part and has a feeding point to which a high-frequency signal is fed, in which surface roughness of a predetermined region of at least one of the ground conductor part and the radiation conductor part is equal to or less than twice skin depth at an operating frequency.
    Type: Application
    Filed: February 16, 2012
    Publication date: August 2, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro INOUE, Makoto HIGAKI, Akiko YAMADA, Shuichi OBAYASHI
  • Publication number: 20120132933
    Abstract: According to one embodiment, an LED module includes a substrate, an interconnect layer, an LED package, and a resin. The resin is provided on the substrate to cover the LED package. The resin has a refractive index higher than a refractive index of air. The resin is transmissive with respect to light emitted from the LED package. The LED package includes first and second leadframes, an LED chip, and a resin body. The first and second leadframes are disposed on a plane. An exterior form of the resin body is used as an exterior form of the LED package.
    Type: Application
    Filed: September 15, 2011
    Publication date: May 31, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Gen Watari, Kazuhiro Inoue
  • Publication number: 20120132931
    Abstract: According to one embodiment, an LED module includes a substrate, an interconnect layer, a light emitting diode (LED) package, and a reflection member. The interconnect layer is provided on the substrate. The LED package is mounted on the interconnect layer. The reflection member is provided on a region in the substrate where the LED package is not mounted and has a property of reflecting light emitted from the LED package. The LED package includes a first lead frame, a second lead frame, an LED chip, and a resin body. The first lead frame and the second lead frame are arranged apart from each other on the same plane. The LED chip is provided above the first lead frame and the second lead frame, with one terminal connected to the first lead frame and one other terminal connected to the second lead frame.
    Type: Application
    Filed: March 22, 2011
    Publication date: May 31, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuhiro Inoue, Kazuhisa Iwashita, Teruo Takeuchi, Gen Watari, Tetsuro Komatsu, Tatsuo Tonedachi
  • Publication number: 20120126266
    Abstract: According to one embodiment, an illumination apparatus includes an LED (Light Emitting Diode) module, a light guide plate, and a support body. The support body supports the LED module and the light guide plate. A reflective surface of the support body is provided between a portion supporting the LED module and a portion supporting the light guide plate. The reflective surface is reflective with respect to the light emitted from the LED package. The LED module is tilted relative to the reflective surface with the LED package mounting surface being toward the reflective surface. An angle between the LED module and the reflective surface is less than 90°.
    Type: Application
    Filed: September 15, 2011
    Publication date: May 24, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Gen Watari, Kazuhiro Inoue
  • Publication number: 20120080674
    Abstract: According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
    Type: Application
    Filed: November 4, 2011
    Publication date: April 5, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Satoshi Shimizu, Kazuhisa Iwashita, Teruo Takeguchi, Tetsuro Komatsu, Hiroaki Oshio, Tatsuo Tonedachi, Naoya Ushiyama, Kazuhiro Inoue, Gen Watari
  • Publication number: 20120069285
    Abstract: A vertical alignment liquid crystal layer is sealed between a first substrate having a first electrode and a second substrate having a second electrode, each pixel region has a reflective region and a transmissive region, and a gap adjusting section is provided on one of sides of the first substrate and the second substrate which sets a thickness (gap) d of the liquid crystal layer which controls a phase difference of incident light to the liquid crystal layer so that a gap dr in the reflective region is smaller than a gap dt in the transmissive region. An alignment controller which divides alignment of the liquid crystal within a pixel region is provided in the pixel region on at least one of the sides of the first substrate and the second substrate. It is also possible to optimize by changing the gap in red, green, and blue.
    Type: Application
    Filed: November 23, 2011
    Publication date: March 22, 2012
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Norio KOMA, Kazuhiro INOUE, Kazuyuki MAEDA, Masaaki AOTA, Masayuki KAMETANI
  • Patent number: 8089596
    Abstract: A vertical alignment liquid crystal layer is sealed between a first substrate having a first electrode and a second substrate having a second electrode, each pixel region has a reflective region and a transmissive region, and a gap adjusting section is provided on one of sides of the first substrate and the second substrate which sets a thickness (gap) of the liquid crystal layer which controls a phase difference of incident light to the liquid crystal layer so that a gap in the reflective region is smaller than a gap in the transmissive region. An alignment controller which divides alignment of the liquid crystal within a pixel region is provided in the pixel region on at least one of the sides of the first substrate and the second substrate. It is also possible to optimize by changing the gap in red, green, and blue.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: January 3, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Norio Koma, Kazuhiro Inoue, Kazuyuki Maeda, Masaaki Aota, Masayuki Kametani
  • Patent number: D656110
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: March 20, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Satoshi Shimizu, Mami Yamamoto, Kazuhisa Iwashita, Kazuhiro Inoue, Teruo Takeuchi
  • Patent number: D656469
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: March 27, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Satoshi Shimizu, Mami Yamamoto, Kazuhisa Iwashita, Kazuhiro Inoue, Teruo Takeuchi
  • Patent number: D658606
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: May 1, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Satoshi Shimizu, Kazuhisa Iwashita, Tatsuo Tonedachi, Kazuhiro Inoue, Teruo Takeuchi