Abstract: The control device of an exhaust sensor includes a processor. The processor is configured to control supply of power to the heater. The processor is configured to start the supply of power to the heater at a predetermined timing before a starter for cranking the internal combustion engine is turned on and increase power supplied to the heater when the starter is turned on.

Abstract: The semiconductor device includes a first semiconductor component including a first circuit section and an interconnection connected to the first circuit section, and a second semiconductor component including a second circuit section and a third circuit section and stacked on the first semiconductor component. The interconnection is electrically connected to a first connecting portion and a second connecting portion of a plurality of connecting portions for electrically connecting the first semiconductor component and the second semiconductor component. The second circuit section is electrically connected to the interconnection via the first connecting portion. The third circuit section is electrically connected to the interconnection via the second connecting portion.

Abstract: Semiconductor memory device includes: a first and second member each extending in a first direction in a boundary part between a first and second block region and arranged in the first direction; a support pillar arranged between the first and second member at the boundary part; conductive layers separated from one another and arranged in a third direction and split by the first and second member, and the support pillar into a first and second portion; and a memory pillar penetrating through the conductive layers. The support pillar includes a lower and upper pillar. A side face of the lower pillar and an extension of a side face of the upper pillar are displaced from each other in a plane based on a second and the third direction.

Abstract: According to one embodiment, a processing device acquires an image, a coordinate, and dialog data communicated between a first device and a second device. The first device is used by a first person performing a task, and the second device is used by a second person. The processing device extracts at least one of a plurality of the coordinates based on the dialog data. The processing device associates the extracted at least one of the plurality of coordinates with the task.

Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.

Abstract: A routing structure includes: a protector disposed on a sliding door of a vehicle; an electric wire connecting a vehicle body and the sliding door of the vehicle; a rotating member rotatably supported by the protector, the rotating member having a cylindrical shape through which the electric wire is inserted; and a shielding member that follows rotation of the rotating member while sliding with respect to the protector, in which the protector has a routing path through which the electric wire drawn out from the rotating member towards the sliding door is routed, and the shielding member is disposed closer to the vehicle body than to the electric wire in the routing path and covers the electric wire from a space on the vehicle body side.

Abstract: An occupant state detection system includes an occupant monitoring apparatus, an occupant state detection apparatus, and a determination apparatus. The occupant state detection apparatus includes one or more processors and one or more memories. The one or more processors cooperate with one or more programs included in the one or more memories to receive occupant monitoring data from the occupant monitoring apparatus and determination data from the determination apparatus. On the basis of the determination data, the one or more processors make assignment of a part to be monitored, of an occupant in a vehicle, to be monitored by the occupant monitoring apparatus, to detect a physical state of the occupant.

Abstract: According to one embodiment, there is provided a semiconductor device including a support, multiple first chips, a first sealing portion, a second chip, multiple first terminals and a second terminal. The multiple first chips are stacked on the support. The first sealing portion seals multiple first chips and has a recessed portion including a bottom surface separated from multiple first chips on a surface opposite to the support. The second chip is disposed in the recessed portion and has a function different from a function of the first chips. The multiple first terminals correspond to multiple first chips, each of multiple first terminals extending in a stacking direction from a surface of the first chip opposite to the support and penetrating the first sealing portion. The second terminal is disposed on a surface of the second chip opposite to the support.

Abstract: A routing structure includes a protector in which an electric wire connecting a vehicle body and a sliding member is routed in a routing path and a rotary member arranged in the routing path, having a cylindrical portion through which the electric wire is inserted, and rotatably supported by the protector. The routing path has a first opening through which the electric wire is drawn out toward the vehicle body. The rotary member is pivotally rotated between a first rotational position and a second rotational position. The first rotational position is a rotational position in which the cylindrical portion is directed toward the sliding member at a first position in a sliding direction. The second rotational position is a rotational position in which the cylindrical portion is directed toward the sliding member at a second position.

Abstract: A main circuit of a switching power supply apparatus includes a switching element, and a rectifier element structured to conduct complementarily with the switching element. The snubber capacitor and the snubber diode are provided in series, on a path parallel to the rectifier element. The snubber switching element is connected in parallel with the snubber diode. The control circuit controls the switching element and the snubber switching element. The control circuit turns on the snubber switching element prior to turn-on of the switching element, and turns off the snubber switching element at the same time as or prior to turn-off of the switching element.

Abstract: An igniter holding structure includes, an igniter provided with an ignition portion and a conductive pin, a first resin portion provided between the igniter and an attachment portion and holds the igniter such that the ignition portion and a distal end of the conductive pin are located opposite each other, and a second resin portion provided in a circumferential wall portion of the attachment portion and forming a connector insertion portion on an inner side of the circumferential wall portion, the connector insertion portion being a space into which a connector connected to the conductive pin can be inserted and the second resin portion being provided separated from the first resin portion on the inner side of the circumferential wall portion in a manner that an exposed surface, which is made of metal and exposed to the connector insertion portion, is formed in the circumferential wall portion.

Abstract: A semiconductor device includes a semiconductor chip having a first face and a second face on an opposite side to the first face, and including semiconductor elements arranged on the first face. Columnar electrodes are arranged above the first face, and electrically connected to any of the semiconductor elements. A first member is located around the columnar electrodes above the first face. An insulant covers the columnar electrodes and the first member. The first member is harder than the columnar electrodes and the insulant. The first member and the columnar electrodes are exposed from a surface of the insulant.

Abstract: According to one embodiment, there is provided a semiconductor device including a support, multiple first chips, a first sealing portion, a second chip, multiple first terminals and a second terminal. The multiple first chips are stacked on the support. The first sealing portion seals multiple first chips and has a recessed portion including a bottom surface separated from multiple first chips on a surface opposite to the support. The second chip is disposed in the recessed portion and has a function different from a function of the first chips. The multiple first terminals correspond to multiple first chips, each of multiple first terminals extending in a stacking direction from a surface of the first chip opposite to the support and penetrating the first sealing portion. The second terminal is disposed on a surface of the second chip opposite to the support.

Abstract: An igniter holding structure includes, an igniter provided with an ignition portion and a conductive pin, a first resin portion provided between the igniter and an attachment portion and holds the igniter such that the ignition portion and a distal end of the conductive pin are located opposite each other, and a second resin portion provided in a circumferential wall portion of the attachment portion and forming a connector insertion portion on an inner side of the circumferential wall portion, the connector insertion portion being a space into which a connector connected to the conductive pin can be inserted and the second resin portion being provided separated from the first resin portion on the inner side of the circumferential wall portion in a manner that an exposed surface, which is made of metal and exposed to the connector insertion portion, is formed in the circumferential wall portion.

Abstract: A semiconductor device includes a semiconductor chip having a first face and a second face on an opposite side to the first face, and including semiconductor elements arranged on the first face. Columnar electrodes are arranged above the first face, and electrically connected to any of the semiconductor elements. A first member is located around the columnar electrodes above the first face. An insulant covers the columnar electrodes and the first member. The first member is harder than the columnar electrodes and the insulant. The first member and the columnar electrodes are exposed from a surface of the insulant.

Abstract: A solar radiation shielding member includes a low radiation film sheet having a first dielectric film, a first metal film, a second dielectric film, a second metal film, a third dielectric film, a third metal film and a fourth dielectric film laminated in order of mention on a transparent substrate. The first dielectric film has: a dielectric layer A arranged directly above the transparent substrate and containing silicon and nitrogen; and a dielectric layer B arranged on the dielectric layer A and containing titanium and oxygen. The dielectric layer A has an optical thickness of 12 to 86 nm. The first, second and third dielectric films have respective crystalline dielectric layers as top layers thereof. The crystalline dielectric layers each have an optical thickness of 5 to 54 nm. The first, second and third metal films are Ag films directly below which the crystalline dielectric layers are arranged, respectively.

Abstract: A submergence data detection device includes a vehicle data acquisition unit configured to acquire vehicle data including at least acceleration data and estimation data for acquiring a drive power value and a traveling resistance value, and a submergence data detection unit configured to detect submergence data based on the vehicle data by a detection method including comparison of a threshold value set according to a calculated value of an acceleration of the vehicle calculated from the drive power value and the traveling resistance value with an actual value of the acceleration, and adjust the detection method according to whether or not a traveling state indicated by the vehicle data corresponds to a first state, in which reliability of the calculated value of the acceleration is degraded, such that detection accuracy of the submergence data in the first state is improved.

Abstract: The movable apparatus includes a holding body and a movable body. The holding body includes a first opening portion and an internal space, and is constituted of one part. The movable body includes an internal body and a first movable shaft portion. The internal body is stored in the internal space of the holding body, and has such a size that the internal body is prevented from exiting the first opening portion even if the first opening portion is elastically deformed. The first movable shaft portion is capable of being moved integrally with the internal body, and is exposed to outside of the holding body from inside of the holding body through the first opening portion.

Abstract: The object of the invention is to obtain a solar radiation shielding member that has a good visible light transmittance and shows no redness when viewed from the front and when obliquely viewed, without impairing the solar radiation transmittance. A solar radiation shielding member, wherein a first dielectric film, a first metal film, a second dielectric film, a second metal film, a third dielectric film, a third metal film, and a fourth dielectric film are stacked on a transparent substrate; the first dielectric film comprises at least two dielectric layers containing a layer having a refractive index of 2.4 or greater, and the first dielectric film as a whole has a refractive index in a range of 1.8-2.

Abstract: A road surface condition estimation device includes a control circuit, an acquisition circuit and an estimation circuit. The control circuit is configured to control a driving device that is able to independently drive a plurality of wheels. The acquisition circuit is configured to acquire detection results of a plurality of wheel speed sensors that detects rotation speeds of the plurality of wheels respectively. The estimation circuit is configured to calculate a slip ratio for each driving wheel, based on a detection result of a first wheel speed sensor and a detection result of a second wheel sensor. The estimation circuit is configured to estimate a friction coefficient for each region on a road surface that corresponds to the driving wheel, based on the slip ratio.