Patents by Inventor Kazuhiro Mitamura
Kazuhiro Mitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230066512Abstract: A wiring substrate includes: a first insulating layer; a ground plane formed on the first insulating layer; a second insulating layer formed on the first insulating layer such that the ground plane is covered with the second insulating layer; a first signal wiring formed on the second insulating layer; a third insulating layer formed on the second insulating layer such that the first signal wiring is covered with the third insulating layer; and a second signal wiring formed on the third insulating layer and electrically connected with the first signal wiring. The first signal wiring is arranged in a region overlapping with a portion of a heat radiating plate. The second signal wiring is not arranged in the region. The ground plane has an opening portion located at a position overlapping with the first signal wiring. The opening portion is formed so as to extend along the first signal wiring.Type: ApplicationFiled: June 15, 2022Publication date: March 2, 2023Inventors: Keita TSUCHIYA, Shuuichi KARIYAZAKI, Kazuhiro MITAMURA
-
Patent number: 11462449Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.Type: GrantFiled: December 26, 2018Date of Patent: October 4, 2022Assignee: NISSAN MOTOR CO., LTD.Inventors: Hiroshi Sato, Yoshinori Murakami, Hidekazu Tanisawa, Shinji Sato, Fumiki Kato, Kazuhiro Mitamura, Yui Takahashi
-
Publication number: 20220044980Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.Type: ApplicationFiled: December 26, 2018Publication date: February 10, 2022Applicant: NISSAN MOTOR CO., LTD.Inventors: Hiroshi SATO, Yoshinori MURAKAMI, Hidekazu TANISAWA, Shinji SATO, Fumiki KATO, Kazuhiro MITAMURA, Yui TAKAHASHI
-
Patent number: 10259032Abstract: Metal foil base material placed on lower blade is first restricted under pressure by lower blade and pad and then cut by a shearing action based on an engagement of lower blade side cutting edge and upper blade side cutting edge. Resin face sheets are fixed to the top surface of lower blade and the pressing surface of pad, the face sheets having a larger friction coefficient than that of these surfaces. By frictional forces imparted by face sheets, metal foil base material is prevented from being dragged and moved by the pressing force of the upper blade prior to cutting. Consequently, the occurrence of “burr”, “roll-up”, and so forth is eliminated thereby ensuring a good cutting quality.Type: GrantFiled: July 17, 2014Date of Patent: April 16, 2019Assignee: Nissan Motor Co., Ltd.Inventors: Jun Ikeuchi, Kazuhiro Mitamura, Masaki Saito, Motoo Shimizu, Takeshi Iwata, Kuniyoshi Wakamatsu, Toshiaki Ohrui, Tomoya Baba
-
Patent number: 10259058Abstract: A workpiece cutting method basically includes providing a workpiece proximate to a first blade including a first cutting edge. The method further comprises moving a second blade including a second cutting edge in contact with the first blade such that the first and second cutting edges of the first and second blades cooperatively engage to cut the workpiece while maintaining the first and second cutting edges parallel to each other.Type: GrantFiled: June 10, 2011Date of Patent: April 16, 2019Assignee: Nissan Motor Co., Ltd.Inventors: Akihiro Shijo, Kazuhiro Mitamura, Akihiko Ikeda, Syunji Ueda, Hiroki Matsunae, Keisuke Yamamoto
-
Patent number: 10141248Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: GrantFiled: December 20, 2016Date of Patent: November 27, 2018Assignee: Renesas Electronics CorporationInventors: Akira Muto, Koji Bando, Yukihiro Sato, Kazuhiro Mitamura
-
Patent number: 9641102Abstract: For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.Type: GrantFiled: November 16, 2015Date of Patent: May 2, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Kazuhiro Mitamura, Koji Bando, Yukihiro Sato, Takamitsu Kanazawa
-
Publication number: 20170103940Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: ApplicationFiled: December 20, 2016Publication date: April 13, 2017Inventors: Akira MUTO, Koji BANDO, Yukihiro SATO, Kazuhiro MITAMURA
-
Patent number: 9530723Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: GrantFiled: September 22, 2015Date of Patent: December 27, 2016Assignee: Renesas Electronics CorporationInventors: Akira Muto, Koji Bando, Yukihiro Sato, Kazuhiro Mitamura
-
Publication number: 20160214266Abstract: Metal foil base material placed on lower blade is first restricted under pressure by lower blade and pad and then cut by a shearing action based on an engagement of lower blade side cutting edge and upper blade side cutting edge. Resin face sheets are fixed to the top surface of lower blade and the pressing surface of pad, the face sheets having a larger friction coefficient than that of these surfaces. By frictional forces imparted by face sheets, metal foil base material is prevented from being dragged and moved by the pressing force of the upper blade prior to cutting. Consequently, the occurrence of “burr”, “roll-up”, and so forth is eliminated thereby ensuring a good cutting quality.Type: ApplicationFiled: July 17, 2014Publication date: July 28, 2016Inventors: Jun Ikeuchi, Kazuhiro Mitamura, Masaki Saito, Motoo Shimizu, Takeshi Iwata, Kuniyoshi Wakamatsu, Toshiaki Ohrui, Tomoya Baba
-
Publication number: 20160163615Abstract: For example, a semiconductor device has a lead connected to a second portion of a chip mounting part on which a semiconductor chip to be a heat source is mounted and a lead connected to a third portion of the chip mounting part on which the semiconductor chip to be the heat source is mounted. Further, each of the leads has a protruding portion protruding from a sealing member. In this manner, it is possible to enhance a heat dissipation characteristic of the semiconductor device.Type: ApplicationFiled: November 16, 2015Publication date: June 9, 2016Inventors: Kazuhiro MITAMURA, Koji BANDO, Yukihiro SATO, Takamitsu KANAZAWA
-
Publication number: 20160148859Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: ApplicationFiled: September 22, 2015Publication date: May 26, 2016Inventors: Akira MUTO, Koji BANDO, Yukihiro SATO, Kazuhiro MITAMURA
-
Publication number: 20160087729Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.Type: ApplicationFiled: December 7, 2015Publication date: March 24, 2016Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Kazuhiro MITAMURA, Shigeru MORIBAYASHI, Ryuta YAGINUMA
-
Patent number: 9236954Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.Type: GrantFiled: September 10, 2013Date of Patent: January 12, 2016Assignee: Renesas Electronics CorporationInventors: Kazuhiro Mitamura, Shigeru Moribayashi, Ryuta Yaginuma
-
Publication number: 20140070120Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.Type: ApplicationFiled: September 10, 2013Publication date: March 13, 2014Applicant: Renesas Electronics CorporationInventors: Kazuhiro MITAMURA, Shigeru MORIBAYASHI, Ryuta YAGINUMA
-
Publication number: 20130074665Abstract: A workpiece cutting method basically includes providing a workpiece proximate to a first blade including a first cutting edge. The method further comprises moving a second blade including a second cutting edge in contact with the first blade such that the first and second cutting edges of the first and second blades cooperatively engage to cut the workpiece while maintaining the first and second cutting edges parallel to each other.Type: ApplicationFiled: June 10, 2011Publication date: March 28, 2013Applicant: NISSAN MOTOR CO., LTD.Inventors: Akihiro Shijo, Kazuhiro Mitamura, Akihiko Ikeda, Syunji Ueda, Hiroki Matsunae, Keisuke Yamamoto
-
Patent number: 8328436Abstract: An optical module includes a receptacle for receiving an optical connector attached to a distal end of an optical fiber, and a lens body having a contact surface coming into contact with the distal end of the optical fiber when the receptacle receives the optical connector. The lens body has the contact surface and an opposing surface opposing the contact surface, and further has a columnar base held by the receptacle, a lens portion formed on the opposing surface integrally with the base, and a flat portion. The lens portion is surrounded by the flat portion and is off-centered with respect to the base.Type: GrantFiled: March 19, 2010Date of Patent: December 11, 2012Assignees: Renesas Electronics Corporation, Sei Optifrontier Co., Ltd.Inventors: Kazuhiro Mitamura, Shigeru Moribayashi, Junichi Shimizu, Hideyuki Yamada, Shunsuke Okamoto, Masahiko Takeda, Shigeki Asahi, Hiroki Itakura
-
Publication number: 20120057828Abstract: An optical transmission module includes a stem, a semiconductor laser element mounted over the stem, a cap fixed to the stem and hermetically sealing the semiconductor laser element, and an optical isolator arranged on an optical path of light emitted from the semiconductor laser element. The cap includes a tubular body, one end side of which is fixed to the stem, and a light transmitting section located on the optical path while closing an opening on the other end side of the body, and fixed to the body so as to keep hermeticity with the body. The optical isolator is arranged inside an area hermetically sealed by the cap.Type: ApplicationFiled: August 19, 2011Publication date: March 8, 2012Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Kazuhiro MITAMURA, Hideyuki YAMADA
-
Patent number: 7874741Abstract: An optical module includes a lens-containing optically-transmissive member and a receptacle. The receptacle includes: an optical connector-inserting section; a fixing section for fixing the member; and an device-installing section for installing a semiconductor device serving as a light emitting device or a light receiving device. The fixing section communicates with the device-installing section. The member includes a main body and a lens. The main body includes a first section and a second section, the first section having a first outer diameter, which is substantially equal to a internal diameter of said fixing section, and said second section having a second outer diameter, which is smaller than the first outer diameter, and at least containing an end of said main body in a side of the device-installing section.Type: GrantFiled: January 8, 2010Date of Patent: January 25, 2011Assignee: Renesas Electronics CorporationInventors: Kazuhiro Mitamura, Hideyuki Yamada
-
Patent number: 7861489Abstract: A preform having edges overlapped and jointed, two outer members for forming outer surfaces of a hydroformed product, and reinforcement members for forming reinforcement ribs that divide a hollow cross section of the hydroformed product, including a joint formed by, when more than three sheet materials for forming the outer members and the reinforcement members are overlapped together, welding a first sheet material on a surface of the overlapped sheet materials to a second sheet material positioned inside the first sheet material, and a space disposed and aligned with a joint plane between the second sheet material and a third sheet material located inside the second sheet material during the welding process.Type: GrantFiled: May 12, 2009Date of Patent: January 4, 2011Assignee: Nissan Motor Co., Ltd.Inventors: Kazuto Ueno, Hajime Minagawa, Shinji Ooe, Kazuhiro Mitamura, Satoru Majima, Takashi Haraoka, Masaaki Yoshitome, Hideto Kanafusa, Tomoaki Watari, Tomoyuki Hirota