Abstract: The present technology relates to a light detection device and an electronic apparatus capable of increasing sensitivity of a specific pixel. The light detection device includes a pixel array unit in which a plurality of pixels is regularly arranged, the plurality of pixels including a first pixel and a second pixel, the first pixel including at least a photodiode and one or more pixel transistors, the second pixel including at least a photodiode larger in size than the photodiode of the first pixel, in which the pixel transistor in the first pixel is shared by the first pixel and the second pixel. The present technology may be applied to image sensors and the like, for example.

Abstract: The base material for printed circuit board according to one aspect of the present disclosure is a base material for printed circuit board comprising a base film having an insulating property, a sintering layer inducing a plurality of copper particles and formed on at least one surface of the base film and an electroless copper plating layer formed on a surface of the sintering layer, the surface being on an opposite side to the base film, and filled in the sintering layer, and wherein a lightness L* of a surface of the electroless copper plating layer, the surface being on an opposite side to the sintering layer, is 45.0 or more and 85.0 or less, a chromaticity a* thereof is 5.0 or more and 25.0 or less, and a chromaticity b* thereof is 5.0 or more and 25.0 or less.

Abstract: According to one aspect of the present invention, a substrate for a printed circuit board includes: an insulating base film; and a metal layer that covers an entirety or a part of one or both surfaces of the base film, wherein the metal layer includes a sintered body layer of copper nanoparticles, and wherein the sintered body layer includes nitrogen atoms by greater than or equal to 0.5 atomic % and less than or equal to 5.0 atomic %.

Abstract: A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 ?m and less than or equal to 0.5 ?m.

Abstract: A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 ?m and less than or equal to 0.5 ?m.

Abstract: According to one aspect of the present disclosure, a base material for a printed circuit board includes: an insulating base film; a sintered body layer that is layered on at least one surface of the base film and that is formed of a plurality of sintered metal particles; and an electroless plating layer that is layered on a surface of the sintered body layer that is opposite to the base film, wherein an area rate of sintered bodies of the metal particles in a cross section of the sintered body layer is greater than or equal to 50% and less than or equal to 90%.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

Abstract: A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.

Abstract: A coating device according to an aspect of the present invention includes a travel module that causes a strip-shaped sheet to travel in a longitudinal direction, a coating module that coats a surface of the strip-shaped sheet with ink while the strip-shaped sheet travels, and a supply module that supplies the ink to the coating module. The coating module includes a slot-type coating head that is disposed above the strip-shaped sheet so as to span the strip-shaped sheet in a width direction. The slot-type coating head includes an ink storage part that widens toward the strip-shaped sheet in cross-sectional view and an ink supply path that communicates with an upper part of the ink storage part.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

Abstract: A key unit includes a grip case which includes at least a pair of synthetic resin case members joined to each other, and a mechanical key supported in the grip case and having a pivotable key head. A plurality of fitting projections are projectingly provided integrally on a metal holder ring held between the case members. The fitting projections are respectively fitted into a plurality of fitting holes provided in at least one of the case members. An engagement hook resiliently engaging with an engagement hole provided in the holder ring is projectingly provided integrally on one of the case members. This facilitates assembling and enhances assembly strength in attaching the metal holder ring to the grip case.

Abstract: A key unit includes a grip case which includes at least a pair of synthetic resin case members joined to each other, and a mechanical key supported in the grip case and having a pivotable key head. A plurality of fitting projections are projectingly provided integrally on a metal holder ring held between the case members. The fitting projections are respectively fitted into a plurality of fitting holes provided in at least one of the case members. An engagement hook resiliently engaging with an engagement hole provided in the holder ring is projectingly provided integrally on one of the case members. This facilitates assembling and enhances assembly strength in attaching the metal holder ring to the grip case.

Abstract: A key for an immobilizer, includes: a mechanical key part including a key plate capable of being inserted into a cylinder lock, and a key head coupled to one end of the key plate; and a grasping case which supports the key head so that the mechanical key part can be displaced between a housed position in which the entire mechanical key part is housed in the grasping case and a protruding position in which the key plate protrudes out of the grasping case. A transponder for transmitting a particular ID code signal to the cylinder lock is built in the key head. Thus, the cylinder lock can be unlocked by only the mechanical key part which has been fallen off from the grasping case.