Patents by Inventor Kazuhiro Takeshita
Kazuhiro Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20020134304Abstract: The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.Type: ApplicationFiled: March 21, 2002Publication date: September 26, 2002Applicant: TOKYO ELECTRON LIMITEDInventors: Shinji Kobayashi, Takahiro Kitano, Masateru Morikawa, Kazuhiro Takeshita, Yoshiyuki Kawafuchi
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Publication number: 20020136829Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.Type: ApplicationFiled: May 20, 2002Publication date: September 26, 2002Inventors: Takahiro Kitano, Masateru Morikawa, Masami Akimoto, Kazuhiro Takeshita
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Publication number: 20020124798Abstract: The present invention is a film forming unit for discharging a coating solution from a coating solution discharge nozzle toward a substrate to form a layer on a surface of the substrate, which has a supply flow path for supplying a cleaning fluid to a discharge flow path continuing to a discharging port of the coating solution discharge nozzle. When the cleaning fluid is positively supplied directly to the discharge flow path of the coating solution discharge nozzle, the supply pressure of the cleaning fluid as well as the capability of cleaning is added. Therefore, further effective cleaning is attained in compare with the conventional case where a coating solution discharge nozzle is simply dipped into a cleaning fluid. In consequence, even when the discharging port of the nozzle is minute, it is possible to perfectly remove the contamination. This allows the discharge pressure to remain constant so as to form a uniform coating layer on the substrate.Type: ApplicationFiled: December 15, 2000Publication date: September 12, 2002Applicant: Tokyo Electron LimitedInventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Publication number: 20020088393Abstract: A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.Type: ApplicationFiled: March 13, 2002Publication date: July 11, 2002Inventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Patent number: 6416583Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.Type: GrantFiled: June 9, 1999Date of Patent: July 9, 2002Assignee: Tokyo Electron LimitedInventors: Takahiro Kitano, Masateru Morikawa, Masami Akimoto, Kazuhiro Takeshita
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Patent number: 6383948Abstract: A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.Type: GrantFiled: December 13, 2000Date of Patent: May 7, 2002Assignee: Tokyo Electron LimitedInventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Publication number: 20010017103Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.Type: ApplicationFiled: April 26, 2001Publication date: August 30, 2001Applicant: TOKYO ELECTRON LIMITEDInventors: Kazuhiro Takeshita, Shinji Nagashima, Makoto Muramatsu, Yoji Mizutani, Kazutoshi Yano, Kyoshige Katayama
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Publication number: 20010003966Abstract: A discharge nozzle in a film forming apparatus of the present invention includes a substantially cylindrical support member and a thin plate or a thin plate portion supported on a face on a substrate side of the support member and closing the face on the substrate side, and a discharge port for discharging a coating solution is provided in the thin plate or the thin plate portion. It is possible to form a smaller discharge port in the thin plate or the thin plate portion by laser processing, punching, or the like than that obtainable by conventional injection molding processing. An amount of discharge and a discharge area on the substrate of the coating solution can be controlled more precisely.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Applicant: TOKYO ELECTRON LIMITEDInventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Publication number: 20010003968Abstract: The present invention is a film forming unit for forming a film on a substrate by supplying a coating solution on the substrate from a discharge nozzle, including moving means for moving the discharge nozzle, wherein the moving means comprises a supporting member for supporting the discharge nozzle, a moving member for moving the supporting member, a guide shaft passing through bearing portion which is formed in the supporting member, and an air supply mechanism for supplying air to a space between the bearing portion and the guide shaft.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Applicant: TOKYO ELECTRON LIMITEDInventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Publication number: 20010003964Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.Type: ApplicationFiled: December 13, 2000Publication date: June 21, 2001Inventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Publication number: 20010003967Abstract: An apparatus includes a holding portion for holding a substrate, a nozzle, provided to face the substrate held by the holding portion, for discharging a solution to the substrate, a driver for moving the nozzle along a surface of the substrate relatively with respect to the substrate while the solution is being discharged to the surface of the substrate from the nozzle, a mask unit covering a portion other than a film formation area of the substrate and including a mask member for catching the solution from the nozzle, and a cleaner provided in the mask unit. The coating solution can be supplied to the surface of the substrate in a way similar to a picture drawn with a single stroke of a brush. A cleaning unit for cleaning the mask member does not need to be provided separately, leading to the facilitation of cleaning and a reduction in space.Type: ApplicationFiled: December 14, 2000Publication date: June 21, 2001Inventors: Takahiro Kitano, Masateru Morikawa, Yukihiko Esaki, Nobukazu Ishizaka, Norihisa Koga, Kazuhiro Takeshita, Hirofumi Ookuma, Masami Akimoto
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Patent number: 6248168Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.Type: GrantFiled: December 14, 1998Date of Patent: June 19, 2001Assignee: Tokyo Electron LimitedInventors: Kazuhiro Takeshita, Shinji Nagashima, Makoto Muramatsu, Yoji Mizutani, Kazutoshi Yano, Kyoshige Katayama
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Publication number: 20010000198Abstract: A gas flow regulating surface portion 37a is the farthest from the front surface of a wafer W in the middle between a peripheral portion of the wafer W and a center portion of a sealing vessel. The gas flow regulating portion 37a protrudes to the front surface of the wafer W in the vicinity of a center portion that surrounds an exhausting opening 35a. In other words, a convex portion 37c is formed in a peripheral area of the gas flow regulating surface portion 37a that surrounds the exhausting opening 35a. Since treatment gas flows along the front surface of the gas flow regulating portion 37a, treatment gas equally contacts the wafer W in the radius direction of the wafer W. Thus, a film with equal thickness is formed.Type: ApplicationFiled: December 14, 2000Publication date: April 12, 2001Applicant: TOKYO ELECTRON LIMITEDInventors: Kazuhiro Takeshita, Shinji Nagashima, Yoji Mizutani, Kyoshige Katayama
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Patent number: 6197385Abstract: A coating unit, an aging unit, and a solvent substituting unit are adjacently disposed. The waiting time period after a wafer is loaded to the coating unit until the coating process of the coating process is started, is adjusted so that the staying time period of the wafer in the coating unit becomes longer than the staying time period of the wafer in the aging unit and the staying time period of the wafer in the solvent substituting unit (whichever longer). The staying time period of the wafer in the coating unit is designated as a rate determiner. Thus, after the coating solution is coated to the wafer, the wafer is quickly conveyed to the next process. Consequently, since the solvent can be suppressed from evaporating, an excellent thin film can be obtained.Type: GrantFiled: February 3, 1999Date of Patent: March 6, 2001Assignee: Tokyo Electron LimitedInventors: Kazuhiro Takeshita, Shinji Nagashima, Yoji Mizutani
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Patent number: 6190459Abstract: A gas flow regulating surface portion 37a is the farthest from the front surface of a wafer W in the middle between a peripheral portion of the wafer W and a center portion of a sealing vessel. The gas flow regulating portion 37a protrudes to the front surface of the wafer W in the vicinity of a center portion that surrounds an exhausting opening 35a. In other words, a convex portion 37c is formed in a peripheral area of the gas flow regulating surface portion 37a that surrounds the exhausting opening 35a. Since treatment gas flows along the front surface of the gas flow regulating portion 37a, treatment gas equally contacts the wafer W in the radius direction of the wafer W. Thus, a film with equal thickness is formed.Type: GrantFiled: December 15, 1998Date of Patent: February 20, 2001Assignee: Tokyo Electron LimitedInventors: Kazuhiro Takeshita, Shinji Nagashima, Yoji Mizutani, Kyoshige Katayama
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Patent number: 5048878Abstract: A striker for a lid of a fuel inlet chamber, which is remotely controllable through a control cable. The striker comprises a lock pin, a spring and an inner cable of the control cable. The lock pin is movable in the axial direction thereof and rotatable around a rotational axis, and the rotation of the lock pin can be locked to an aimed position. The lock pin is urged to be projected inside the fuel inlet chamber by the spring. The inner cable is used for withdrawing the lock pin backward.Type: GrantFiled: January 17, 1990Date of Patent: September 17, 1991Assignee: Nippon Cable System Inc.Inventors: Kazuhiro Takeshita, Tatsuo Chiura
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Patent number: 4776970Abstract: A lubricant for paper coating compositions. The lubricant is an aqueous dispersion of an ester compound of the formula (I): ##STR1## wherein R is an alkyl or alkenyl group having 3 or more carbon atoms or an alkyl or alkenyl group having a hydroxyl group, and R' is an alkyl or alkenyl group having 4 or more carbon atoms, provided that the total number of carbon atoms of R and R' is 15 or more. The lubricant is made by emulsifying or dispersing the ester compound with a high-speed agitation emulsifying device or piston-type high pressure emulsifying device in the presence of water and nonionic and anionic surfactants or the salt of a copolymer of an .alpha.,.beta.-unsaturated dibasic acid or its monoester with styrene.Type: GrantFiled: November 19, 1986Date of Patent: October 11, 1988Assignee: San Nopco LimitedInventors: Yoshihiro Hayashi, Takeshi Okubo, Kazuhiro Takeshita, Akinori Higuchi
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Patent number: 4389299Abstract: The present application discloses a sputtering device comprising a target electrode having a target and a flat magnet located under the target and constituted by an annular magnetic pole having one polarity and a magnetic pole having the other polarity located inside the annular magnetic pole, a substrate disposed oppositely to the target, a ring electrode for electric field for generating an electric field on the magnet at right angle thereto, an electron beam emitting filament disposed adjacent the target, and an anode electrode for guiding an electron from the filament over the target.According to the present invention, the target material can be effectively deposited to the substrate and efficiently act on the formation of a film.Type: GrantFiled: June 22, 1981Date of Patent: June 21, 1983Assignee: Osaka Vacuum Chemical Co., Ltd.Inventors: Ryuichi Adachi, Isao Yamada, Kazuhiro Takeshita