Patents by Inventor Kazuhiro Yoshikawa

Kazuhiro Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9572256
    Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: February 14, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Kazuhiro Yoshikawa, Takashi Kariya
  • Patent number: 9514876
    Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: December 6, 2016
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Kazuhiro Yoshikawa, Haruhiko Morita
  • Patent number: 9508483
    Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: November 29, 2016
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Kazuhiro Yoshikawa, Haruhiko Morita
  • Publication number: 20160327105
    Abstract: A disc brake apparatus that holds brake pads (46) and is capable of holding a caliper body (30) in a part of the support is provided with a support in which pairs of torque receiving parts (16, 18) provided in both sides in a braking force tangential direction and connecting parts (20) respectively connecting together the torque receiving parts (16, 18) are provided in both sides in an axial-direction of a rotor. In the support, at least one of the torque receiving parts (16, 18) is capable of being divided. The support (12) includes an open part capable of inserting and removing the brake pads (46) in the braking force tangential direction by dividing the torque receiving parts.
    Type: Application
    Filed: February 6, 2015
    Publication date: November 10, 2016
    Inventors: Toshifumi MAEHARA, Kazuhiro YOSHIKAWA
  • Patent number: 9478343
    Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: October 25, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Yasuhiko Mano, Kazuhiro Yoshikawa
  • Publication number: 20160263481
    Abstract: A player character is caused to perform an action in accordance with an input. Action points that allow the player character to perform an action in a virtual world during a player turn are set, and a point is subtracted from the action points in accordance with the action of the player character during the player turn. The player turn is ended, and an opponent turn is started. Then, in causing the player character to perform an action, if the action points remain at a time of the end of the player turn, the player character is caused to automatically perform an action on a non-player character in the opponent turn.
    Type: Application
    Filed: March 11, 2015
    Publication date: September 15, 2016
    Inventors: Hitoshi YAMAGAMI, Kazuhiro YOSHIKAWA, Yuya ISHII, Susumu ISHIHARA
  • Publication number: 20160263479
    Abstract: A first player character or a second player character is caused to perform an action by operating the first player character or the second player character in accordance with an input, and a player character as an action target for performing an action corresponding to the input is switched. Further, a position and/or a direction of a virtual camera are set in accordance with a position and/or a direction, in a virtual world, of the player character set as the action target, and the position and/or the direction of the virtual camera are changed in accordance with the action of the player character. An image of the virtual world viewed from the virtual camera set for the player character as the action target is displayed on a display apparatus. Then, the action target can be switched to the second player character as during the operation on the first player character as the action target in the same player turn.
    Type: Application
    Filed: March 11, 2015
    Publication date: September 15, 2016
    Inventors: Hitoshi YAMAGAMI, Kazuhiro YOSHIKAWA, Yuya ISHII, Susumu ISHIHARA
  • Publication number: 20160217911
    Abstract: An inductor component includes a resin insulating layer having an opening portion, a first coil formed on a first surface of the resin insulating layer such that the first coil is surrounding the opening portion, a second coil that is formed on a second surface of the resin insulating layer on the opposite side with respect to the first surface such that the second coil is surrounding opening portion, a via conductor formed through the resin insulating layer such that the via conductor is connecting the first coil and the second coil, and a magnetic body structure having an opening portion magnetic body filling the opening portion of the resin insulating layer, a first surface magnetic body covering the first coil, and a second surface magnetic body covering the second coil.
    Type: Application
    Filed: January 22, 2016
    Publication date: July 28, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuhiko MANO, Kazuhiro YOSHIKAWA, Haruhiko MORITA, Takashi KARIYA
  • Patent number: 9366301
    Abstract: A disk brake friction pad assembly includes lining assemblies which are oscillatably inserted into the guide hole portions of a guide plate to transmit a braking torque from plate engagement portions to the guide plate and are urged toward the guide plate by spring members, and a link plate for applying pressure from a torque receiving plate to the multiple lining assemblies and also for holding a clearance between the guide plate and torque receiving plate.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: June 14, 2016
    Assignee: AKEBONO BRAKE INDUSTRY CO., LTD.
    Inventor: Kazuhiro Yoshikawa
  • Patent number: 9357660
    Abstract: A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 31, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Kazuhiro Yoshikawa, Liyi Chen, Toshiki Furutani
  • Patent number: 9338898
    Abstract: A method-of producing a printed wiring board comprises: forming a via-hole for interlayer connection in a laminate in which a copper foil for laser processing comprises a copper foil and an easily soluble laser absorption layer provided on a surface of the copper foil which has a higher etching rate to a copper etchant than the copper foil and absorbs an infrared laser beam and another conductor layer is laminated through an insulating layer, directly irradiating the infrared laser beam on the easily soluble laser absorption layer; and removing the easily soluble laser absorption layer from the surface of the copper foil in a desmear step of removing a smear in a via-hole and/or a microetching step as a pretreatment of an electroless plating step is adopted.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 10, 2016
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Joji Fujii, Hiroaki Tsuyoshi, Hiroto Iida, Kazuhiro Yoshikawa, Mitsuyoshi Matsuda
  • Patent number: 9307645
    Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: April 5, 2016
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yasuhiko Mano, Kazuhiro Yoshikawa, Takashi Kariya
  • Patent number: 9287034
    Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: March 15, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasuhiko Mano, Kazuhiro Yoshikawa, Takashi Kariya
  • Publication number: 20160055924
    Abstract: To more reliably supply cooling water to a reactor pressure vessel and a reactor containment vessel using a back-up building if a severe accident should occur, a boiling water type nuclear power plant includes a nuclear reactor building including a reactor containment vessel, and an external building, which is installed independently outside the nuclear reactor building and which has an anti-hazard property. The external building has a power source and an operating panel independent of the nuclear reactor building. The boiling water type nuclear power plant includes a water injection pump installed inside the external building, an alternative water injection pipe performing water injection at least on a reactor pressure vessel or the reactor containment vessel in the nuclear reactor building from the water injection pump, and a valve connected to the alternative water injection pipe, making it possible to perform alternative water injection if a severe accident occurs.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 25, 2016
    Inventors: Yuriko ONISHI, Kazuhiro YOSHIKAWA, Takashi SUMIKAWA
  • Publication number: 20160042861
    Abstract: A printed wiring board includes a core substrate having a cavity, an inductor component positioned in the cavity of the substrate, a first buildup layer formed on first surface of the substrate, and a second buildup layer formed on second surface of the substrate. The inductor component includes an insulating layer having first openings and a second opening formed between the first openings, conductive through holes formed in the first openings, respectively, a magnetic body formed in the second opening, a first interconnect formed on first surface of the insulating layer and connecting the conductive through holes on the first surface of the insulating layer, and a second interconnect formed on second surface of the insulating layer and connecting the conductive through holes on the second surface of the insulating layer, and the first interconnect, second interconnect and conductive through holes are positioned to form a spiral structure.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 11, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuhiko MANO, Toshihiko ONOGI, Kazuhiro YOSHIKAWA, Yuki TANAKA, Haruhiko MORITA, Takashi KARIYA
  • Patent number: 9257217
    Abstract: An inductor element has a support layer, a first conductive layer formed on the support layer and having a first inductor pattern and a first pad at one end of the first inductor pattern, a first insulation layer formed on the support layer and first conductive layer and including a magnetic material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor pattern and a second pad at one end of the second inductor pattern, and a via conductor formed through the first insulation layer and connecting the first and second conductive layers. The magnetic material layer is covering at least part of the first inductor pattern, the resin layer is covering the first pad and has opening exposing at least part of the first pad, and the via conductor is formed in the opening of the first insulation layer.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: February 9, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Kazuhiro Yoshikawa, Yasuhiko Mano
  • Patent number: 9248376
    Abstract: Based on operation information obtained from an operating device for pointing to a position on a screen of a display device, a pointing position to which the operating device points is repeatedly calculated. Next, a change amount of the pointing position is calculated. Then, whether or not the change amount of the pointing position meets a first condition is determined. As a result, when it is determined that the change amount of the pointing position meets the first condition, predetermined processing is executed for the pointing position or a position specified based on the pointing position.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: February 2, 2016
    Assignee: NINTENDO CO., LTD.
    Inventors: Kazuhiro Yoshikawa, Hitoshi Yamagami, Toshio Noguchi
  • Patent number: 9240505
    Abstract: A method of etching capable of rapidly and flatly performing wet etching on a Si substrate using fluonitric acid represented by HF(a)HNO3(b)H2O(c) (where the unit of a, b and c is wt % and a+b+c=100). The etching rate of an SiO2 layer with the highly concentrated fluonitric acid is significantly lowered by the appropriate selection of its composition as compared with the etching rate of the Si substrate, and etch the Si substrate until the SiO2 layer is exposed. In this way, it is possible to rapidly etch the Si substrate and significantly enhance the flatness of the etched surface.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: January 19, 2016
    Assignee: TOHOKU UNIVERSITY
    Inventors: Tadahiro Ohmi, Tomotsugu Ohashi, Kazuhiro Yoshikawa, Tatsuro Yoshida, Teppei Uchimura, Kazuki Soeda, Shigetoshi Sugawa
  • Publication number: 20150336771
    Abstract: In an elevator refurbishing method in which a hydraulic elevator in which a hydraulic jack is installed in an equipment installation zone is refurbished into a machine-roomless elevator that uses a two-to-one (2:1) roping method, the equipment installation zone being a region inside a hoistway on either a left side or a right side of a car when viewed from directly above, at least one guide rail from a pair of counterweight guide rails is installed in the equipment installation zone while leaving the hydraulic jack in position, the hydraulic jack is removed from the hoistway, the hoisting machine is installed in a lower portion of the equipment installation zone using a space that is created by removal of the hydraulic jack, and a car return sheave and a counterweight return sheave are installed on an upper portion of the counterweight guide rails.
    Type: Application
    Filed: March 4, 2013
    Publication date: November 26, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuhiro YOSHIKAWA, Hideki MIYAHARA, Kazuhiro SASAKI, Yoshinao TAKAHASHI
  • Patent number: 9190337
    Abstract: There is provided an etching method. A temperature at a plurality of predetermined positions on an upper surface of an Si substrate is measured during the etching processing. The etching processing includes supplying an etching solution to the upper surface of the Si substrate. An exothermic reaction occurs in the etching processing. The upper surface is heated or cooled depending on the measured value.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: November 17, 2015
    Assignee: TOHOKU UNIVERSITY
    Inventors: Takeshi Sakai, Tatsuro Yoshida, Kazuhiro Yoshikawa, Shigetoshi Sugawa