Patents by Inventor Kazuhisa Arai

Kazuhisa Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9627241
    Abstract: A resin sheet attaching method of attaching a resin sheet to a workpiece. The resin sheet attaching method includes a molecular weight reducing step of applying vacuum ultraviolet radiation to the front side of the resin sheet, thereby cutting an intermolecular bond in a surface region having a depth of tens of nanometers from the front side of the resin sheet to thereby reduce the molecular weight of the surface region and produce an adhesive force, and a resin sheet attaching step of attaching the front side of the resin sheet to the workpiece after performing the molecular weight reducing step.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: April 18, 2017
    Assignee: DISCO CORPORATION
    Inventor: Kazuhisa Arai
  • Patent number: 9400423
    Abstract: A manufacturing method for a photomask for wafer processing includes a step of forming a groove on the front side of a light shielding plate in an area where light is to be passed. The groove has a depth not reaching the back side of the light shielding plate. A uniting step applies a bonding agent capable of transmitting light to the front side of the light shielding plate after performing the groove forming step and next attaching a transparent plate through the bonding agent to the front side of the light shielding plate to thereby unite the light shielding plate and the transparent plate. A grinding step holds the transparent plate on a chuck table after performing the uniting step. The back side of the light shielding plate is ground until the groove is exposed to the back side of the light shielding plate.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: July 26, 2016
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai
  • Publication number: 20150093882
    Abstract: A wafer processing method of processing a wafer having a plurality of devices formed on the front side of the wafer, the devices being respectively formed in a plurality of separate regions defined by a plurality of crossing division lines. The wafer processing method includes a support member providing step of providing a support member on the back side of the wafer, the support member having substantially the same size as that of the wafer, and a dividing step of dicing the wafer from the front side thereof along the division lines after performing the support member providing step, thereby dividing the wafer into a plurality of chips.
    Type: Application
    Filed: September 17, 2014
    Publication date: April 2, 2015
    Inventor: Kazuhisa Arai
  • Publication number: 20150093688
    Abstract: A manufacturing method for a photomask for wafer processing includes a step of forming a groove on the front side of a light shielding plate in an area where light is to be passed. The groove has a depth not reaching the back side of the light shielding plate. A uniting step applies a bonding agent capable of transmitting light to the front side of the light shielding plate after performing the groove forming step and next attaching a transparent plate through the bonding agent to the front side of the light shielding plate to thereby unite the light shielding plate and the transparent plate. A grinding step holds the transparent plate on a chuck table after performing the uniting step. The back side of the light shielding plate is ground until the groove is exposed to the back side of the light shielding plate.
    Type: Application
    Filed: September 16, 2014
    Publication date: April 2, 2015
    Inventor: Kazuhisa Arai
  • Publication number: 20150013897
    Abstract: A resin sheet attaching method of attaching a resin sheet to a workpiece. The resin sheet attaching method includes a molecular weight reducing step of applying vacuum ultraviolet radiation to the front side of the resin sheet, thereby cutting an intermolecular bond in a surface region having a depth of tens of nanometers from the front side of the resin sheet to thereby reduce the molecular weight of the surface region and produce an adhesive force, and a resin sheet attaching step of attaching the front side of the resin sheet to the workpiece after performing the molecular weight reducing step.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 15, 2015
    Inventor: Kazuhisa Arai
  • Patent number: 8673743
    Abstract: A wafer is divided by setting the focal point of a laser beam inside the wafer at positions corresponding to division lines, thereby forming modified layers inside the wafer along the division lines. Each modified layer has a thickness ranging from the vicinity of the front side of the wafer to the vicinity of the back side of the wafer. An etching gas or an etching liquid is supplied to the wafer to erode the modified layers, thereby dividing the wafer into individual devices. The modified layers are not crushed, so fine particles are not generated in dividing the wafer. Accordingly, fine particles do not stick to the surface of each device and cause a reduction in quality. Further, since the modified layers are removed by etching, it is possible to prevent a reduction in die strength of each device due to the remainder of the modified layers.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: March 18, 2014
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai
  • Publication number: 20130059428
    Abstract: A wafer is divided by setting the focal point of a laser beam inside the wafer at positions corresponding to division lines, thereby forming modified layers inside the wafer along the division lines. Each modified layer has a thickness ranging from the vicinity of the front side of the wafer to the vicinity of the back side of the wafer. An etching gas or an etching liquid is supplied to the wafer to erode the modified layers, thereby dividing the wafer into individual devices. The modified layers are not crushed, so fine particles are not generated in dividing the wafer. Accordingly, fine particles do not stick to the surface of each device and cause a reduction in quality. Further, since the modified layers are removed by etching, it is possible to prevent a reduction in die strength of each device due to the remainder of the modified layers.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 7, 2013
    Applicant: DISCO CORPORATION
    Inventor: Kazuhisa ARAI
  • Patent number: 8142259
    Abstract: A grinding machine includes a holding table adapted to hold a workpiece, a grinding unit operative to grind the workpiece held on the holding piece, and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving away from the workpiece. The grinding unit includes a porous pad having fine pores opposed to the workpiece, a gel-like slurry storing portion provided on the porous pad so as to store a gel-like slurry therein, and a water supply unit to supply water between the porous pad and the workpiece. The porous pad contains relatively larger superabrasives at least at an outer circumferential portion. The fine pores of the porous pad have a diameter greater than that of relatively small superabrasives contained in the gel-like slurry.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: March 27, 2012
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai
  • Patent number: 7816264
    Abstract: A wafer processing method having a step of reducing the thickness of a wafer in only a device forming area where semiconductor chips are formed by grinding and etching the back side of the wafer to thereby form a recess on the back side of the wafer. At the same time, an annular projection is formed around the recess to thereby ensure the rigidity of the wafer. Accordingly, handling in shifting the wafer from the back side recess forming step to a subsequent step of forming a back side rewiring layer can be performed safely and easily.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: October 19, 2010
    Assignee: Disco Corporation
    Inventors: Keiichi Kajiyama, Kazuhisa Arai
  • Patent number: 7727810
    Abstract: A method of dividing a wafer having a plurality of areas, which are sectioned by the streets formed on the front surface in a lattice pattern and a plurality of devices, which are formed in the sectioned areas, along streets, the method comprising a first cutting step for holding the front surface of the wafer on a chuck table of a cutting machine and forming a first groove having a depth that is about half of the thickness of the wafer, along the streets from the rear surface of the wafer; a second cutting step for holding the rear surface of the wafer on a chuck table and forming a second groove which does not reach the first groove, along the streets from the front surface of the wafer; and a dividing step for breaking an uncut portion between the first groove and the second groove by exerting external force along the streets of the wafer, on which the first grooves and the second grooves have been formed.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: June 1, 2010
    Assignee: Disco Corporation
    Inventors: Kazuhisa Arai, Masatoshi Nanjo
  • Patent number: 7704769
    Abstract: An optical device manufacturing method including the steps of: forming a groove with a depth corresponding to a finish thickness of the heat sink in a heat sink material at a position corresponding to an associated one of the streets sectioning the plurality of optical devices; joining the optical device layer of the optical device wafer to the heat sink material via a joining metal layer; cutting and dividing the optical device wafer along the streets into individual optical devices; sticking a protection member to the rear surface of the substrate of the optical device wafer; and grinding the rear surface of the heat sink material to expose the grooves to the rear surface to thereby divide the heat sink material into heat sinks corresponding to associated individual optical devices.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: April 27, 2010
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai
  • Patent number: 7687375
    Abstract: A lamination device manufacturing method for manufacturing a lamination device using a reinforced wafer formed with an annular reinforced portion, includes a wafer lamination step in which a rear surface of the reinforced wafer corresponding to the device area is faced to and joined to the front surface of an underlying wafer with corresponding streets aligned with each other, thus forming a lamination wafer; an electrode connection step in which a via-hole is formed at a position where an electrode is formed in each of the devices of the reinforced wafer constituting part of the lamination wafer, so as to reach a corresponding electrode formed in each of the devices of the underlying wafer, and the via-hole is filled with a conductive material to connect the electrodes; and a division step in which after the electrode connection step is executed, the lamination wafer is cut along the streets and divided into individual lamination devices.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: March 30, 2010
    Assignee: Disco Corporation
    Inventors: Kazuhisa Arai, Akihito Kawai
  • Publication number: 20100003805
    Abstract: A semiconductor device fabrication method for dividing a semiconductor wafer into individual devices along a plurality of streets.
    Type: Application
    Filed: June 18, 2009
    Publication date: January 7, 2010
    Applicant: DISCO CORPORATION
    Inventor: Kazuhisa Arai
  • Publication number: 20090298264
    Abstract: On the back surface of the chip of which a front surface is formed with an electronic circuit, an adhesive film of a shape and dimensions corresponding to at least the back surface of the chip is adhered to obtain the semiconductor chip with the entire back surface covered with the adhesive film. Such a semiconductor chip is obtained by forming a division groove in the front surface of a semiconductor wafer to be divided into plural chips, grinding a back surface of the wafer until the division groove appears to divide the wafer into plural chips, adhering the adhesive film and a dicing tape on the entire back surface of the wafer, and stretching the dicing tape to cut the adhesive film along the division groove.
    Type: Application
    Filed: August 3, 2009
    Publication date: December 3, 2009
    Inventors: Kazuhisa Arai, Masaru Nakamura
  • Publication number: 20090280722
    Abstract: A grinding machine is provided which includes a holding table adapted to hold a workpiece; a grinding unit operative to grind the workpiece held on the holding piece; and a grinding unit transfer mechanism operative to shift the grinding unit in a direction coming close to or moving away from the workpiece. The grinding unit includes a porous pad having a large number of fine pores opposed to the workpiece held on the holding table, a gel-like slurry storing portion provided on the porous pad so as to store gel-like slurry therein, and a water supply unit operative to supply water between the porous pad and the workpiece. The porous pad contains superabrasives at least at an outer circumferential portion, and the fine pores of the porous pad each have a diameter greater than that of each of the superabrasives contained in the gel-like slurry.
    Type: Application
    Filed: April 13, 2009
    Publication date: November 12, 2009
    Applicant: DISCO CORPORATION
    Inventor: Kazuhisa Arai
  • Publication number: 20090233419
    Abstract: An optical device manufacturing method including the steps of: forming a groove with a depth corresponding to a finish thickness of the heat sink in a heat sink material at a position corresponding to an associated one of the streets sectioning the plurality of optical devices; joining the optical device layer of the optical device wafer to the heat sink material via a joining metal layer; cutting and dividing the optical device wafer along the streets into individual optical devices; sticking a protection member to the rear surface of the substrate of the optical device wafer; and grinding the rear surface of the heat sink material to expose the grooves to the rear surface to thereby divide the heat sink material into heat sinks corresponding to associated individual optical devices.
    Type: Application
    Filed: March 3, 2009
    Publication date: September 17, 2009
    Applicant: DISCO CORPORATION
    Inventor: Kazuhisa Arai
  • Publication number: 20090181519
    Abstract: A lamination device manufacturing method for manufacturing a lamination device using a reinforced wafer formed with an annular reinforced portion, includes a wafer lamination step in which a rear surface of the reinforced wafer corresponding to the device area is faced to and joined to the front surface of an underlying wafer with corresponding streets aligned with each other, thus forming a lamination wafer; an electrode connection step in which a via-hole is formed at a position where an electrode is formed in each of the devices of the reinforced wafer constituting part of the lamination wafer, so as to reach a corresponding electrode formed in each of the devices of the underlying wafer, and the via-hole is filled with a conductive material to connect the electrodes; and a division step in which after the electrode connection step is executed, the lamination wafer is cut along the streets and divided into individual lamination devices.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 16, 2009
    Applicant: DISCO CORPORATION
    Inventors: Kazuhisa Arai, Akihito Kawai
  • Patent number: 7498239
    Abstract: A wafer processing method is capable of easily handling even a thinly formed wafer during the processing thereof. An annular protective member is bonded to an outer circumferential excess region on an outer surface of the wafer, on which devices are not formed, and a rear surface is ground with the outer surface left in the mentioned condition. Since the outer circumference of the wafer is reinforced with the annular protective member, the handling of the wafer becomes easy even after the wafer becomes thinner due to a grinding operation.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: March 3, 2009
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai
  • Publication number: 20090017623
    Abstract: A wafer processing method having a step of reducing the thickness of a wafer in only a device forming area where semiconductor chips are formed by grinding and etching the back side of the wafer to thereby form a recess on the back side of the wafer. At the same time, an annular projection is formed around the recess to thereby ensure the rigidity of the wafer. Accordingly, handling in shifting the wafer from the back side recess forming step to a subsequent step of forming a back side rewiring layer can be performed safely and easily.
    Type: Application
    Filed: July 7, 2008
    Publication date: January 15, 2009
    Applicant: DISCO CORPORATION
    Inventors: Keiichi Kajiyama, Kazuhisa Arai
  • Patent number: 7278206
    Abstract: A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its terminals formed in very close proximity to one another, as on an interposer (1), have their heads made uniform in height by causing the terminals (4) to project from a surface of a board (2) coated with a resist film, and applying a cutting tool (19) to the surface of the board (2) having the terminals project therefrom to carry out lathe turning for the heads of the terminals (4), while having the terminal board held by a rotatable chuck table (17) and rotating the chuck table (17).
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: October 9, 2007
    Assignee: Disco Corporation
    Inventors: Kazuhisa Arai, Hideyuki Sando