Patents by Inventor Kazuhisa Kobayashi

Kazuhisa Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190314777
    Abstract: Microfluidic devices, systems, and methods for mixing a solution are disclosed, comprising a microfluidic device (100) having a first chamber (110) connected via a connection channel to a second chamber (116) that in operation is only in fluidic communication with the first chamber of the device (100). In the method, solution in the first chamber (110) is forced into the second chamber (116), compressing the air trapped within the second chamber (116), and then that solution is returned to the first chamber (110). On return to the first chamber (110), the solution exits the connecting channel (115) and causes mixing in the first chamber (110).
    Type: Application
    Filed: August 31, 2017
    Publication date: October 17, 2019
    Inventors: Zhi Li, Yu Liu, Henry G. Wada, Daisuke Eto, Chen Li, Kazuhisa Kobayashi, Warren Wu
  • Patent number: 8012676
    Abstract: It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required. A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support: (I) a reducing substance, (II) a water-soluble phosphorus oxo acid compound, (III) a water-soluble halogen compound, (IV) warm water of 55° C. or higher.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: September 6, 2011
    Assignee: Mitsubishi Paper Mills Limited
    Inventors: Takenobu Yoshiki, Shigeki Shino, Kazuhisa Kobayashi
  • Patent number: 7749620
    Abstract: The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus and a process for preparing an electromagnetic wave shielding material which comprises exposing a light-sensitive material having a physical development nuclei layer and a silver halide emulsion layer on a transparent substrate in this order, precipitating metal silver with an optional fine line pattern onto the physical development nuclei layer by physical development, then, removing a layer provided on the physical development nuclei layer, and subjecting to plating a metal with the use of the physically developed metal silver as a catalytic nucleus.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: July 6, 2010
    Assignees: Fujimori Kogyo Co., Ltd., Mitsubishi Paper Mills Limited
    Inventors: Taro Yoshida, Atsushi Suzuki, Yasuo Tsubai, Kazuhisa Kobayashi
  • Publication number: 20100098584
    Abstract: [Objective] To control the temperatures of reagents and samples in a clinical analysis apparatus, without causing the apparatus to become large or complex. [Constitution] A clinical analysis apparatus is equipped with a measuring section. The measuring section includes: a dispensing station, at which reagents and samples are dispensed into microchips having micro flow channels formed therein; a detecting station, for detecting measurement target substances included in the samples; and the like. The microchips are continuously rotated relative to the dispensing station, the detecting section, and the like from the upstream side to the downstream side of processes to be administered, to perform measurement repeatedly. A temperature controlling section controls the temperatures of the microchips prior to the microchips being moved to the detecting station, and the measurement target substances included in the samples which are dispensed into the microchips are measured.
    Type: Application
    Filed: October 15, 2009
    Publication date: April 22, 2010
    Applicants: FUJIFILM Corporation, Wako Pure Chemical Industries, Ltd.
    Inventors: Kazuhisa Kobayashi, Yoshihiro Seto, Masayoshi Hayashi, Tatsuo Kurosawa, Tomohisa Kawabata
  • Publication number: 20090233237
    Abstract: It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required. A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support: (I) a reducing substance, (II) a water-soluble phosphorus oxo acid compound, (III) a water-soluble halogen compound, (IV) warm water of 55° C. or higher.
    Type: Application
    Filed: June 22, 2007
    Publication date: September 17, 2009
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Takenobu Yoshiki, Shigeki Shino, Kazuhisa Kobayashi
  • Publication number: 20070144253
    Abstract: A liquid surface detector is constituted of an oscillator that outputs an alternating current signal at a frequency of 130 kHz, and a modulator circuit for modulating the alternating current signal with a capacitance index signal that indicates a change in capacitance. The capacitance changes with movement of a suction probe relative to a cup containing a liquid. An output signal of the modulator is filtered and amplified by a first filtering circuit that passes a frequency component of 130 kHz through it. Through a wave detector circuit and a second filtering circuit that passes a frequency component of 2 kHz, a signal corresponding to the capacitance index signal is detected from an output of the first filtering circuit, and is compared with a reference signal, to detect that the probe gets into contact with the liquid surface.
    Type: Application
    Filed: September 26, 2006
    Publication date: June 28, 2007
    Inventor: Kazuhisa Kobayashi
  • Patent number: 7114936
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: October 3, 2006
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20060115636
    Abstract: The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus and a process for preparing an electromagnetic wave shielding material which comprises exposing a light-sensitive material having a physical development nuclei layer and a silver halide emulsion layer on a transparent substrate in this order, precipitating metal silver with an optional fine line pattern onto the physical development nuclei layer by physical development, then, removing a layer provided on the physical development nuclei layer, and subjecting to plating a metal with the use of the physically developed metal silver as a catalytic nucleus
    Type: Application
    Filed: July 11, 2003
    Publication date: June 1, 2006
    Inventors: Taro Yoshida, Atsushi Suzuki, Yasuo Tsubai, Kazuhisa Kobayashi
  • Patent number: 6648621
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: November 18, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20020090322
    Abstract: An incubator has a dry analysis element chamber in which a dry analysis element is accommodated and held a constant elevated temperature. A pressing member is disposed in the upper portion of the dry analysis element chamber and presses downward a dry analysis element inserted into the dry analysis element chamber and a guide member supports the pressing member for up-and-down movement along a guide surface. A heater heats the guide member to a predetermined temperature. The pressing member is in contact with the guide surface of the guide member to receive heat from the guide surface and is moved up and down along the guide surface in response to insertion and removal of the dry analysis element into and from the dry analysis element chamber.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 11, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Fumio Sugaya, Akihiro Komatsu, Kazuhisa Kobayashi
  • Patent number: 6416306
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: July 9, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Patent number: 6413069
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: July 2, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20010038162
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless A space around the apparatus can be effectively utilized.
    Type: Application
    Filed: May 29, 2001
    Publication date: November 8, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20010028129
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Application
    Filed: May 29, 2001
    Publication date: October 11, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20010022412
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Application
    Filed: May 29, 2001
    Publication date: September 20, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Publication number: 20010022413
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Application
    Filed: May 29, 2001
    Publication date: September 20, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Patent number: 6270331
    Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: August 7, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Shinpei Oono, Kazushi Miyazawa, Keiji Hanamoto, Takashi Tarutani, Takashi Matano, Kazuhisa Kobayashi, Hiroyuki Atake
  • Patent number: 6110316
    Abstract: In order to produce a decorative laminate by adhering a transfer printing sheet to the three-dimensional irregular surface of a base, solid particles (P) are caused to collide with the transfer printing sheet (S) from the back surface thereof with the transfer printing sheet (S) facing the irregular surface of the base (B), and the transfer printing sheet (S) is brought into pressure contact with the irregular surface of the base (B) by utilizing the collisional pressure, thereby transferring the transfer printing sheet (S) to the base (B). In the case where a thermally stretchable transfer printing sheet is used, it is better to conduct transfer printing by heating at least one of the base, the transfer printing sheet, the solid particles, and so on.
    Type: Grant
    Filed: October 16, 1998
    Date of Patent: August 29, 2000
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhisa Kobayashi, Mitsutoyo Miyakoshi, Masaru Okamoto, Haruo Miyashita, Hirohisa Yoshikawa, Haruo Ono, Reiko Kan, Kazuo Kitamura, Tutomu Ichihashi
  • Patent number: 6071456
    Abstract: A decoration sheet is retained on the cavity periphery by a sheet clamp in such a state that it is projected into a molding cavity of a female die. Then the decoration sheet is heated and softened by a curved hot platen, and thereafter it is drawn through suction ports of the female die to bring the sheet into close fit to the inner periphery of the molding cavity. The deformation amount of the decoration sheet heated and softened is decreased in premolding the sheet into the molding cavity surface of the female die. Therefore, distortion of the decoration sheet, appearance of wrinkles, and breakage thereof become little. Next, the female die and the male die are coupled with each other to effect die clamping, and a molten resin is poured to fill the molding cavity to effect injection molding.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: June 6, 2000
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Keiji Hanamoto, Takeshi Matano, Kazuhisa Kobayashi, Masayuki Shibata, Hiroyuki Atake
  • Patent number: 6045744
    Abstract: A foil-decorating injection molding method including using a foil-decorating injection molding machine with an injection mold having a male mold and a female mold. The female mold has a cavity surface for forming a cavity, and a parting surface having an outer peripheral section on which to hold a decorative sheet, and an inner peripheral section extending between the inner edge of the outer peripheral section of the parting surface and the edge of the cavity surface in a concavely curved shape to allow the expansion of a peripheral portion of the decorative sheet around a decorating portion of the same during preforming. This reduces local strains in the decorative portion of the sheet and ensures a uniform thickness distribution of the sheet to prevent breaking and creasing of the sheet.
    Type: Grant
    Filed: September 25, 1998
    Date of Patent: April 4, 2000
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuhisa Kobayashi, Masayuki Shibata, Hirohisa Yoshikawa