Abstract: The polyester resin composition of the present invention comprises (A) a thermoplastic polyester resin, (B) an olefinic polymer modified with at least one member selected from the group consisting of an unsaturated carboxylic acid and its derivative, and (C) an aliphatic ester having a molecular weight of 400 to 1,000. The polyester resin of the present invention may comprises: (D) a flame retardant, (E) an inorganic flame retardant auxiliary, and others. The thermoplastic polyester resin composition is useful for the fabrication of sliding members (particularly, gears). Polyester resin compositions with improved dimensional accuracy and sliding properties and shaped articles formed therefrom can be obtained from the resin composition of the present invention.

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract: To obtain an injection-molded article of a resin composition blended with a thermoplastic resin and a liquid-crystal polymer, which is excellent in mechanical strengths, etc., by forming the liquid-crystal polymer into fibers during molding. The molded article, wherein the liquid-crystal polymer (B) capable of forming an anisotropic molten phase is present in the form of fiber having an average aspect ratio of 6 or higher in a matrix of the thermoplastic resin (A) not forming an anisotropic molten phase, is produced by injection-molding a thermoplastic resin composition obtained by blending 100 parts by weight of a resin component consisting of 99 to 50 parts by weight of the thermoplastic resin (A) not forming an anisotropic molten phase and 1 to 50 parts by weight of the liquid-crystal polymer (B) capable of forming an anisotropic molten phase with 0.01 to 1.0 part by weight of at least one compound (C) selected from the group consisting of phosphoric acid, phosphorous acid and metal salts thereof.

Abstract: The present invention provides a liquid crystal polymer composition wherein the low coefficient of linear expansion is attained without significantly deteriorating mechanical properties by incorporating plural fibrous fillers or a fibrous filler and a particulate filler with liquid crystal polymer in a specified ratio.

Abstract: A thermoplastic resin composition comprising a thermoplastic resin (A) not forming an anisotropic melt phase and a liquid crystal polymer (B) capable of forming an anisotropic melt phase, an injection molding method thereof and an injection molded article capable of providing a thin molded article having excellent mechanical strength. A thermoplastic resin composition (C) comprises 99 to 50 wt. % of the thermoplastic resin (A) and 1 to 50 wt. % of the liquid crystal polymer (B). The liquid crystal polymer (B) is microscopically dispersed in an island form in the matrix phase of the thermoplastic resin (A) so that when the composition (C) is heat-treated at a temperature not lower than the melting point of the liquid crystal polymer (B) under a non-load state and is then cooled, the liquid crystal polymer (B) has a weight average particle diameter within the range of 10 to 40 micrometers and at least 80 wt. % thereof has a particle diameter within the range of 0.5 to 60 micrometers.

Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or short fibers dispersed in said semi-cured thermosetting resin, and if necessary, a carrier film attached or bound to said prepreg is suitable for producing multilayer printed circuit boards of reduced thinness, high wiring density and high connection reliability with high productivity and low production cost.

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract: Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.

Abstract: An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.

Abstract: An epoxy resin film which is so strong as to have a tensile strength of not less than 10 MPa and an elongation of not less than 5% is formed by using a substantially linear high molecular weight epoxy resin which is synthesized by polymerizing a difunctional epoxy resin having two epoxy groups per molecule and a dihydric phenol in an aprotic polar solvent, in the presence of a solvent, at a reaction temperature ranging from 80.degree. to 130.degree. C., the difunctional epoxy resin and the dihydric phenol being used in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1 and a proportion of the total of them of at most 50% by weight based on the total of them and the aprotic polar solvent.

Abstract: Long fiber-reinforced normally solid polyamide resin compositions and molded articles formed thereof include a polyamide base resin, between 5 to 80% by weight of reinforcing fibers having a length of at least 3 mm, and between 0.01 to 3% by weight of a processing aid. The processing aid is a lithium salt of a fatty acid or a metal salt of a fatty acid having 22 to 32 carbon atoms. The compositions are preferably in the form of a generally cylindrical pellet having a length of 3 to 50 mm such that the reinforcing fibers are substantially as long as the pellet in which they are incorporated, and are oriented parallel to one another along the longitudinal axis of the pellet.

Abstract: A semiconductor chip is attached to the upper surface of a bed formed of a metallic plate. Lead terminals are connected to terminal portions of the semiconductor chip by bonding wires. A plurality of bridge-shaped projections are formed on the lower surface of the bed, by punching a material which constitutes the bed. The portions including the bed, semiconductor chip and projections are molded and sealed with mold resin. In this case, the mold resin is filled in the space defined by the bridge portions which constitute the projections.