Patents by Inventor Kazuhito MIYAWAKI

Kazuhito MIYAWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210230041
    Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.
    Type: Application
    Filed: January 28, 2021
    Publication date: July 29, 2021
    Applicant: SCHOTT AG
    Inventors: Frank Gindele, Christian Rakobrandt, Kazuhito Miyawaki, Robert Hettler, Takahisa Uchida
  • Patent number: 10468801
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring; and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 5, 2019
    Assignee: SCHOTT Japan Corporation
    Inventors: Akira Okuno, Tetsushi Morikawa, Tarou Hirai, Kazuhito Miyawaki, Masahiro Taketomi, Yoshinaga Hamaguchi
  • Publication number: 20190036255
    Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring, and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.
    Type: Application
    Filed: August 8, 2017
    Publication date: January 31, 2019
    Inventors: Akira OKUNO, Tetsushi MORIKAWA, Tarou HIRAI, Kazuhito MIYAWAKI, Masahiro TAKETOMI, Yoshinaga HAMAGUCHI