Abstract: A biocompatible glass substrate with through electrodes includes a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal that are provided by penetrating the glass plate. A biocompatible electronic device using this is the biocompatible electronic device including a biocompatible glass substrate with through electrode having a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal provided by penetrating the glass plate, and an electric/electronic device sealed onto the above described glass plate and is electrically connected to the above described through electrodes, and has bumps for connection on the through electrodes of the biocompatible electronic device.

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring; and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.

Abstract: A terminal that can be simply joined in the atmosphere; an electrical apparatus including the terminal; and a method of attaching a terminal to a housing made of a metal material by which a passivation film is readily formed on a surface thereof are provided. A terminal can be fixedly adhered to a housing, and includes: a metal outer ring; a lead penetrating through the metal outer ring, and an insulating material providing sealing between the metal outer ring and the lead. The metal outer ring has a joint edge to be joined to the housing. A coating layer turning into a liquid phase at a temperature lower than a melting temperature of the housing is provided at least in the joint edge.