Patents by Inventor Kazuki Denpoh

Kazuki Denpoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050274321
    Abstract: A plasma processing apparatus for converting a processing gas into a plasma by a high frequency power in a processing chamber and performing a plasma processing on a substrate mounted on a mounting table includes a ring portion disposed to surround the substrate on the mounting table, and a temperature control unit for establishing a temperature difference between the ring portion and the substrate, such that the ring portion is at least 50° C. higher than the substrate. Further, the processing gas generates chlorine radicals, and the temperature control unit is at least one of a heating unit for heating the ring portion and a cooling unit for cooling the mounting table.
    Type: Application
    Filed: June 8, 2005
    Publication date: December 15, 2005
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tomoaki Ukei, Kimihiro Higuchi, Tatsuo Matsudo, Kazuki Denpoh
  • Publication number: 20040261946
    Abstract: A plasma processing apparatus having a focus ring, enables the efficiency of cooling of the focus ring to be greatly improved, while preventing an increase in cost thereof. The plasma processing apparatus is comprised of a susceptor which has an electrostatic chuck and the focus ring. A wafer W to be subjected to plasma processing is mounted on the electrostatic chuck. The focus ring has a dielectric material portion and a conductive material portion. The dielectric material portion forms a contact portion disposed in contact with the electrostatic chuck. The conductive material portion faces the electrostatic chuck with the dielectric material portion therebetween.
    Type: Application
    Filed: April 21, 2004
    Publication date: December 30, 2004
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shosuke Endoh, Noriyuki Iwabuchi, Shigeaki Kato, Tomoya Okubo, Jun Hirose, Koichi Nagakura, Chishio Koshimizu, Kazuki Denpoh
  • Patent number: 6828243
    Abstract: A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compensation ring member 32 is made such thin as one to three times mean free path of treatment gas molecules, thereby suppressing heat transfer between a susceptor 30 and a second compensation ring member 33. A base of a second compensation ring member, through a layer of conductive silicone rubber 34, is made to come into an intimate contact with an upper surface of a susceptor 30, thus helping to cool.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 7, 2004
    Assignee: Tokyo Electron Limited
    Inventor: Kazuki Denpoh
  • Publication number: 20030062128
    Abstract: A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compensation ring member 32 is made such thin as one to three times mean free path of treatment gas molecules, thereby suppressing heat transfer between a susceptor 30 and a second compensation ring member 33. A base of a second compensation ring member, through a layer of conductive silicone rubber 34, is made to come into an intimate contact with an upper surface of a susceptor 30, thus helping to cool.
    Type: Application
    Filed: November 15, 2002
    Publication date: April 3, 2003
    Inventor: Kazuki Denpoh
  • Patent number: 6514347
    Abstract: A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compensation ring member 32 is made such thin as one to three times mean free path of treatment gas molecules, thereby suppressing heat transfer between a susceptor 30 and a second compensation ring member 33. A base of a second compensation ring member, through a layer of conductive silicone rubber 34, is made to come into an intimate contact with an upper surface of a susceptor 30, thus helping to cool.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: February 4, 2003
    Assignee: Tokyo Electron Limited
    Inventor: Kazuki Denpoh
  • Publication number: 20010015262
    Abstract: A compensation ring 31 disposed to surround a periphery of a wafer W on a susceptor 30 is concentrically divided into an inside first compensation ring member 32 and an outside second compensation ring member 33. A width of a first compensation ring member 32 is made such thin as one to three times mean free path of treatment gas molecules, thereby suppressing heat transfer between a susceptor 30 and a second compensation ring member 33. A base of a second compensation ring member, through a layer of conductive silicone rubber 34, is made to come into an intimate contact with an upper surface of a susceptor 30, thus helping to cool.
    Type: Application
    Filed: February 14, 2001
    Publication date: August 23, 2001
    Inventor: Kazuki Denpoh
  • Patent number: 5853803
    Abstract: A method of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: December 29, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Tatsuya Iwasaki, Takenobu Matsuo, Kazuki Denpoh, Eiji Yamaguchi
  • Patent number: 5718763
    Abstract: A apparatus of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.
    Type: Grant
    Filed: April 4, 1995
    Date of Patent: February 17, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Kiyohisa Tateyama, Kimio Motoda, Tatsuya Iwasaki, Takenobu Matsuo, Kazuki Denpoh, Eiji Yamaguchi