Abstract: A film capacitor device includes a film stack with metal strips including adjacent metal strips in 180° opposite orientations in a direction in which the metal strips continuously extend, metal-sprayed electrodes on a pair of end faces of the film stack, and conductors extending continuously in a stacking direction on a pair of end faces (cut surfaces) different from the pair of end faces on which the metal-sprayed electrodes are located.

Abstract: A film capacitor includes a stack including at least one dielectric film and a plurality of metal films, the at least one dielectric film including a polyarylate film, wherein each of the at least one of dielectric film and each of the plurality of metal films are alternately stacked in a stacking direction, each of the plurality of metal films deposited on each of the at least one dielectric film by vapor deposition, cover films on two first side surfaces, the two first side surfaces facing each other in a first direction, the first direction orthogonal to the stacking direction, the cover films containing a polyester hot-melt resin, and metal-sprayed electrodes on two second side surfaces, the two second side surfaces facing each other in a second direction, the second direction perpendicular to the first direction and orthogonal to the stacking direction.

Abstract: A film capacitor device includes a film stack with metal strips including adjacent metal strips in 180° opposite orientations in a direction in which the metal strips continuously extend, metal-sprayed electrodes on a pair of end faces of the film stack, and conductors extending continuously in a stacking direction on a pair of end faces (cut surfaces) different from the pair of end faces on which the metal-sprayed electrodes are located.

Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.

Abstract: A composite resin material including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase, the other one thereof being present within the continuous phase, as organic resin particles having an average particle diameter of 1 ?m or less.

Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.

Abstract: A composite resin material including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase, the other one thereof being present within the continuous phase, as organic resin particles having an average particle diameter of 1 ?m or less.

Abstract: A dielectric film includes an organic resin polymer, and an organic resin monomer. The organic resin polymer includes at least one of polyarylate and cycloolefin polymer, the organic resin monomer includes at least one of phenol monomer, sulfur monomer, and phosphorus monomer, and a total content of the organic resin monomer falls in a range of 0.01 to 7.6 parts by mass based on of 100 parts by mass the organic resin polymer.