Patents by Inventor Kazuki IMAGAWA

Kazuki IMAGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10796815
    Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: October 6, 2020
    Assignee: KYOCERA Corporation
    Inventor: Kazuki Imagawa
  • Patent number: 10457807
    Abstract: A composite resin material including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase, the other one thereof being present within the continuous phase, as organic resin particles having an average particle diameter of 1 ?m or less.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: October 29, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Kouki Okamura, Kazuki Imagawa
  • Publication number: 20190252090
    Abstract: There is provided an insulating material including a composite resin material comprising an organic resin and minute particles containing a metal element. The organic resin includes a resin material including polyester as a main backbone thereof and having an alkoxy group. The minute particles have an average particle size of greater than or equal to 0.5 nm but less than or equal to 50 nm. Such an insulating material is used as an insulating layer of a wiring member (wiring board, covered electric wire, etc.) including a conductor and the insulating layer which covers the conductor.
    Type: Application
    Filed: June 28, 2017
    Publication date: August 15, 2019
    Applicant: KYOCERA Corporation
    Inventor: Kazuki IMAGAWA
  • Publication number: 20180148574
    Abstract: A composite resin material including: a first organic resin having a phenylene ether structure; and a second organic resin having a main skeleton composed of a polyester structure, one of the first organic resin and the second organic resin forming a continuous phase, the other one thereof being present within the continuous phase, as organic resin particles having an average particle diameter of 1 ?m or less.
    Type: Application
    Filed: June 10, 2016
    Publication date: May 31, 2018
    Applicant: KYOCERA Corporation
    Inventors: Kouki OKAMURA, Kazuki IMAGAWA
  • Publication number: 20180114643
    Abstract: A dielectric film includes an organic resin polymer, and an organic resin monomer. The organic resin polymer includes at least one of polyarylate and cycloolefin polymer, the organic resin monomer includes at least one of phenol monomer, sulfur monomer, and phosphorus monomer, and a total content of the organic resin monomer falls in a range of 0.01 to 7.6 parts by mass based on of 100 parts by mass the organic resin polymer.
    Type: Application
    Filed: February 23, 2016
    Publication date: April 26, 2018
    Applicant: KYOCERA Corporation
    Inventors: Akira OKOUCHI, Kazuki IMAGAWA