Patents by Inventor Kazuki Kouno
Kazuki Kouno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123425Abstract: A carbon dioxide absorbent containing a polyamine compound (A) having an alicyclic hydrocarbon structure, wherein a content of the polyamine compound (A) is 60% by mass or more.Type: ApplicationFiled: December 14, 2021Publication date: April 18, 2024Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Yuki KAWASHIMA
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Patent number: 11945906Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.Type: GrantFiled: August 19, 2021Date of Patent: April 2, 2024Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kousuke Ikeuchi, Kazuki Kouno, Yuma Ohno, Emi Ota, Aoi Yokoo
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Publication number: 20240100473Abstract: A carbon dioxide absorbent containing an amine compound (A) having a heterocyclic structure (X) selected from the group consisting of an oxygen-containing heterocyclic structure and a sulfur-containing heterocyclic structure, a content of the amine compound (A) being 65% by mass or more.Type: ApplicationFiled: December 20, 2021Publication date: March 28, 2024Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Yuki KAWASHIMA, Ryo ASAI, Tomoaki KIRINO
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Patent number: 11939420Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 1.5 to 20.0 parts by mass, an epoxy resin composition, and an epoxy resin curing agent for an amine composition. In the formula (1), R1 is an alkyl group having 1 to 6 carbon atoms optionally having a hydroxy group, R2NHCH2—, where R2 represents an alkyl group having 1 to 6 carbon atoms, or a group represented by the following formula (1A), and p is a number of 0 to 2. In the formula (1A), R3 represents a hydrogen atom or NH2—.Type: GrantFiled: August 19, 2021Date of Patent: March 26, 2024Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yuma Ohno, Kazuki Kouno, Kousuke Ikeuchi, Emi Ota, Aoi Yokoo
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Publication number: 20230416450Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains metaxylylenediamine and paraxylylenediamine at a mass ratio of 99/1 to 51/49, an epoxy resin composition, and a paint and an adhesive containing these.Type: ApplicationFiled: September 10, 2021Publication date: December 28, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takuma HANAOKA, Kazuki KOUNO, Yuma OHNO
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Publication number: 20230416520Abstract: An epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol, as well as a gas barrier laminate and a packaging material in which the epoxy resin composition is used.Type: ApplicationFiled: October 6, 2021Publication date: December 28, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoko KOBAYASHI, Kazuki KOUNO, Ryoma HASHIMOTO
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Publication number: 20230383049Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.Type: ApplicationFiled: August 19, 2021Publication date: November 30, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Kousuke IKEUCHI, Yuma OHNO, Emi OTA, Aoi YOKOO
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Patent number: 11814471Abstract: Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.Type: GrantFiled: July 13, 2020Date of Patent: November 14, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki Kouno, Ryoma Hashimoto
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Publication number: 20230323017Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 1.5 to 20.0 parts by mass, an epoxy resin composition, and an epoxy resin curing agent for an amine composition. In the formula (1), R1 is an alkyl group having 1 to 6 carbon atoms optionally having a hydroxy group, R2NHCH2—, where R2 represents an alkyl group having 1 to 6 carbon atoms, or a group represented by the following formula (1A), and p is a number of 0 to 2. In the formula (1A), R3 represents a hydrogen atom or NH2—.Type: ApplicationFiled: August 19, 2021Publication date: October 12, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Yuma OHNO, Kazuki KOUNO, Kousuke IKEUCHI, Emi OTA, Aoi YOKOO
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Publication number: 20230323018Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.Type: ApplicationFiled: August 19, 2021Publication date: October 12, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kousuke IKEUCHI, Kazuki KOUNO, Yuma OHNO, Emi OTA, Aoi YOKOO
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Publication number: 20230059584Abstract: An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having from 14 to 24 carbons, a gas barrier laminate and a retort food packaging material using the epoxy resin composition, an odor-proofing or aroma-retaining packaging material, an odor-proofing or aroma-retaining method of sealing an article containing an odorous component or an aromatic component in the packaging material, a heat-shrinkable label, the production method of the heat-shrinkable label, a heat-shrunken label and a bottle having the heat-shrunken label, and a CO2 transmission prevention method.Type: ApplicationFiled: January 22, 2021Publication date: February 23, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Ryoma HASHIMOTO, Naoko KOBAYASHI
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Publication number: 20220332885Abstract: Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.Type: ApplicationFiled: July 13, 2020Publication date: October 20, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Ryoma HASHIMOTO
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Patent number: 11472906Abstract: An active energy ray-curable resin composition containing: a reaction product (X) of a component (A) and a component (B) below: (A) at least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine; (B) at least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (1) and derivatives of the unsaturated carboxylic acids: wherein, in the formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbon atoms, an aryl group having from 6 to 12 carbon atoms, or an aralkyl group having from 7 to 13 carbon atoms; (C) a compound having at least one group selected from the group consisting of a glycidyl group and an isocyanate group, and an ethylenically unsaturated bond-containing group; and (D) a phosphoric acid derivative having an ethylenically unsaturated bond-containing group.Type: GrantFiled: May 31, 2019Date of Patent: October 18, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Ryoma Hashimoto, Kazuki Kouno
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Publication number: 20220315694Abstract: Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are a gas barrier film and a laminate in which the epoxy resin composition is used.Type: ApplicationFiled: July 13, 2020Publication date: October 6, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Ryoma HASHIMOTO
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Publication number: 20220145118Abstract: The present invention provides: a composition which has a low viscosity, a high refractive index when being cured, and in which the precipitation of crystals is suppressed for a long time when stored at a low temperature; and a paint comprising the same. According to one embodiment of the present invention, provided is a composition which includes: a (meth)acrylate represented by general formula (1); and a compound represented by general formula (2), wherein the mass percentage of the content of the (meth)acrylate to the content of the compound represented by general formula (2) is 60:40 to 90:10 (exclusive of 60:40 and 90:10).Type: ApplicationFiled: April 16, 2020Publication date: May 12, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki KOUNO, Yasuo KUSUBE, Kazunori TANIGUCHI, Shohei NISHIDA
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Patent number: 11326073Abstract: The present invention provides: a composition which has a low viscosity, a high refractive index when being cured, and in which the precipitation of crystals is suppressed for a long time when stored at a low temperature; and a paint comprising the same. According to one embodiment of the present invention, provided is a composition which includes: a (meth)acrylate represented by general formula (1); and a compound represented by general formula (2), wherein the mass percentage of the content of the (meth)acrylate to the content of the compound represented by general formula (2) is 60:40 to 90:10 (exclusive of 60:40 and 90:10).Type: GrantFiled: April 16, 2020Date of Patent: May 10, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki Kouno, Yasuo Kusube, Kazunori Taniguchi, Shohei Nishida
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Patent number: 11078355Abstract: Provided is a resin composition which is capable of forming a molded body that has excellent surface hardness, transparency, hue and weather resistance, while exhibiting excellent wet heat resistance. A resin composition which contains a (meth)acrylic copolymer (A) and a polycarbonate-based resin (B), and wherein: the (meth)acrylic copolymer (A) contains an aromatic (meth)acrylate unit (a1), a methyl (meth)acrylate unit (a2) and a (meth)acrylate unit (a3) represented by formula (1); the mass ratio (a1)/(a2) is from 5/95 to 85/15; the content of the unit (a3) is 0.1-10 parts by mass relative to 100 parts by mass of the total of the units (a1) and (a2); and the unit (a1) is different from the unit (a3).Type: GrantFiled: September 25, 2017Date of Patent: August 3, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki Kouno, Hisayuki Kuwahara
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Publication number: 20210214479Abstract: An active energy ray-curable resin composition containing: a reaction product (X) of a component (A) and a component (B) below: (A) at least one selected from the group consisting of meta-xylylenediamine and para-xylylenediamine; (B) at least one selected from the group consisting of unsaturated carboxylic acids represented by the following general formula (1) and derivatives of the unsaturated carboxylic acids: wherein, in the formula (1), R1 and R2 each independently represent a hydrogen atom, an alkyl group having from 1 to 8 carbon atoms, an aryl group having from 6 to 12 carbon atoms, or an aralkyl group having from 7 to 13 carbon atoms; (C) a compound having at least one group selected from the group consisting of a glycidyl group and an isocyanate group, and an ethylenically unsaturated bond-containing group; and (D) a phosphoric acid derivative having an ethylenically unsaturated bond-containing group.Type: ApplicationFiled: May 31, 2019Publication date: July 15, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Ryoma HASHIMOTO, Kazuki KOUNO
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Patent number: 10920000Abstract: The present invention provides: a light diffusing agent which enables the achievement of a resin molded body having excellent light diffusibility, light transmission properties, surface hardness and the like; a resin composition which contains this light diffusing agent; and a molded body. One embodiment of the present invention provides a light diffusing agent which contains a copolymer that contains a (meth)acrylate constituent unit (A) represented by general formula (1) and a polyvalent vinyl constituent unit (B) that is copolymerizable with the constituent unit (A).Type: GrantFiled: January 20, 2017Date of Patent: February 16, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventor: Kazuki Kouno
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Patent number: 10752729Abstract: A coating film formed by curing of an epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent and a solvent, wherein the coating film contains the solvent in a ratio of 1% by mass or more and 20% by mass or less, and the epoxy resin curing agent is a reaction product of the following (A) and (B). (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine. (B) At least one selected from the group consisting of an unsaturated carboxylic acid represented by the following formula (1) and a derivative thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms, or an aryl group.Type: GrantFiled: June 1, 2016Date of Patent: August 25, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuki Kouno, Saeko Sato, Tomotaka Wada, Yuiga Asai