Patents by Inventor Kazuki Tomota

Kazuki Tomota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING METHOD FOR LAMINATE, LAMINATE, MANUFACTURING METHOD FOR DEVICE, AND DEVICE, AND COMPOSITION FOR FORMING POLYIMIDE-CONTAINING PRECURSOR PORTION
    Publication number: 20240339368
    Abstract: There is provided a manufacturing method for a bonded body, comprising: preparing a substrate A having a surface on which a wiring line terminal is provided; forming a polyimide-containing precursor portion on the surface of the substrate A, where the wiring line terminal is provided on the surface of the substrate A; preparing a substrate B having a surface on which a wiring line terminal is provided; and bonding the surface of the substrate A, where the polyimide-containing precursor portion is provided on the surface of the substrate A, to the surface of the substrate B, where the wiring line terminal is provided on the surface of the substrate B, wherein a difference between a cyclization rate of a polyimide in the polyimide-containing precursor portion before the bonding of the surface of the substrate A and a cyclization rate of a polyimide in a polyimide-containing portion formed at a bonded portion after the bonding of the surface of the substrate A is 5% or more.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 10, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Atsushi NAKAMURA, Kosuke Yamashita, Kazuki Tomota