Patents by Inventor Kazuki YAMAOKA

Kazuki YAMAOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367993
    Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: June 21, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke Inaba, Maiko Ariga, Kazuki Yamaoka
  • Patent number: 11283234
    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 22, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki Yamaoka, Maiko Ariga, Yusuke Inaba
  • Publication number: 20220007496
    Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA, Atsushi IZAWA, Kazuya NAGASHIMA
  • Publication number: 20210367398
    Abstract: An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Yusuke INABA
  • Publication number: 20210367399
    Abstract: An optical module includes: an optical element; and a thermoelectric module on which the optical element is mounted. Further, the thermoelectric module includes a first substrate, a second substrate disposed to face the first substrate, and a plurality of thermoelectric elements provided between the first substrate and the second substrate, and a pattern made of a material different from a material of the first substrate is formed on a surface of the first substrate opposite to a back surface of the first substrate facing the second substrate, and the optical element is mounted on the surface of the first substrate in association with the pattern.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20210364713
    Abstract: An optical module includes: a base having a predetermined product of a coefficient of linear expansion and a Young's modulus; a planar lightwave circuit element mounted on the base; and a warpage suppression component, which is mounted on a surface of the planar lightwave circuit element, the surface being on a side opposite to a side where the planar lightwave circuit element is mounted on the base, having a product of a coefficient of linear expansion and a Young's modulus that reduces warpage of the planar lightwave circuit element in accordance with warpage of the base depending on temperature change.
    Type: Application
    Filed: August 2, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA, Junichi HASEGAWA
  • Publication number: 20210364697
    Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Junichi HASEGAWA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20210320719
    Abstract: An optical module includes: a laser device; a wavelength detector; a modulator; a modulator driver; a coherent mixer; a photoelectric element; a transimpedance amplifier; and a casing. Further, the laser device is arranged such that the laser device outputs a laser light beam in a direction opposite to a side on which the optical output unit is arranged in the casing.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuya NAGASHIMA, Yozo ISHIKAWA, Atsushi IZAWA, Kazuki YAMAOKA
  • Publication number: 20210234331
    Abstract: An optical module includes: at least one optical element; a housing main body that houses therein the at least one optical element; and a plurality of lead pins that are provided to a side wall of the housing main body. Further, at least one of the lead pins is electrically connected to the at least one optical element, and the lead pins are lined up in a plurality of rows along a height direction of the side wall, and are arranged in such a manner that adjacent lead pins do not overlap each other in a top view.
    Type: Application
    Filed: April 13, 2021
    Publication date: July 29, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA
  • Patent number: 10978851
    Abstract: Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: April 13, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jun Miyokawa, Masakazu Miura, Kazuki Yamaoka
  • Publication number: 20200366054
    Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20200366053
    Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Yusuke INABA
  • Publication number: 20200366056
    Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yusuke INABA, Maiko ARIGA, Kazuki YAMAOKA
  • Publication number: 20200203917
    Abstract: An optical module includes a first optical function device that has an emission end and emits a light from the emission end; a second optical function device that has an entry end and an emission end, amplifies the light entering the entry end, and emits the amplified light from the emission end, wherein the light is emitted from the emission end of the first optical function device and enters the entry end; a first optical non-reciprocal device that is arranged between the emission end of the first optical function device and the entry end of the second optical function device, transmits a light in a first direction from the emission end of the first optical function device toward the entry end of the second optical function device, and blocks or attenuates a light in a second direction opposite to the first direction; and a second optical non-reciprocal device that is arranged on the emission end side of the second optical function device, transmits a light in a third direction outward from the emission end
    Type: Application
    Filed: March 3, 2020
    Publication date: June 25, 2020
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki YAMAOKA, Maiko ARIGA, Kazuaki KIYOTA, Yusuke INABA
  • Patent number: 10670819
    Abstract: A non-plated region is formed in a certain range from an end of a submount. The non-plated region is a portion where a plating layer is not provided, and thus a substrate of the submount is exposed. An intermediate layer is formed on the plating layer. Furthermore, a plating layer is formed on the intermediate layer. A semiconductor laser is formed on the plating layer. The position of an end of the semiconductor laser substantially coincides with the position of an end of the plating layer (the intermediate layer). That is, even in a case where there is a deviation between an end face of the intermediate layer and an end face of the semiconductor laser, the amount of this deviation is sufficiently smaller than the amount by which the intermediate layer is set back from an end face of the submount.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: June 2, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masakazu Miura, Jun Miyokawa, Kazuki Yamaoka, Hajime Mori
  • Patent number: 10566761
    Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: February 18, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masakazu Miura, Jun Miyokawa, Kazuki Yamaoka, Toshio Kimura
  • Patent number: 10551576
    Abstract: An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is ?22.5° to 22.5°, or 67.5° to 112.5°.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: February 4, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazuki Yamaoka, Jun Miyokawa, Masakazu Miura, Toshio Kimura
  • Publication number: 20190372303
    Abstract: Provided is a package for an optical device and an optical device module that can reduce or prevent damage occurrence in an optical fiber optically coupled to an optical device while ensuring a good airtightness. A package for an optical device includes a package main unit that accommodates an optical device; a pipe portion that is provided in the package main unit and through which an optical fiber optically coupled to the optical device is inserted; and a fixing portion that is provided in the package main unit and to which one end of the optical fiber is fixed, and the pipe portion includes a first pipe section having a base end fixed to the package main unit and a second pipe section joined to a tip of the first pipe section, having a higher thermal expansion coefficient than the first pipe section, to be sealed by a sealing material.
    Type: Application
    Filed: August 2, 2019
    Publication date: December 5, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Jun MIYOKAWA, Masakazu Miura, Kazuki Yamaoka
  • Publication number: 20190312414
    Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 10, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko Ariga, Yusuke Inaba, Kazuki Yamaoka, Toshio Sugaya
  • Publication number: 20190296524
    Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.
    Type: Application
    Filed: June 11, 2019
    Publication date: September 26, 2019
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko ARIGA, Yusuke INABA, Kazuki YAMAOKA