Patents by Inventor Kazuma Mitsuyama

Kazuma Mitsuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same
    Patent number: 8088635
    Abstract: There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light source, the light emitting device satisfying requirements in terms of current capacity flowed for light emission, dissipation of heat generated due to flow of a large current, resistance to thermal stress, strength of device and light emission efficiency, and a method for producing a light emitting device having a vertical geometry light emitting diode as the light source by using the package aggregate.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: January 3, 2012
    Assignee: C.I. Kasei Company, Limited
    Inventors: Hiroshi Fushimi, Kengo Nishiyama, Kouji Kudou, Itsuki Yamamoto, Kazuma Mitsuyama
  • Light emitting device and production method of same
    Patent number: 7999277
    Abstract: A light emitting device, and a production method thereof, is provided having for a light source thereof a vertical geometry light emitting diode, that allows a large current to flow through the vertical geometry light emitting diode and takes into consideration the dissipation of heat occurring at that time or the expansion and contraction of a metal member due to thermal stress caused by that heat.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: August 16, 2011
    Assignee: C. I. Kasei Company, Limited
    Inventors: Hiroshi Fushimi, Kengo Nishiyama, Kouji Kudou, Itsuki Yamamoto, Kazuma Mitsuyama
  • VERTICAL GEOMETRY LIGHT EMITTING DIODE PACKAGE AGGREGATE AND PRODUCTION METHOD OF LIGHT EMITTING DEVICE USING THE SAME
    Publication number: 20100187546
    Abstract: There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light source, the light emitting device satisfying requirements in terms of current capacity flowed for light emission, dissipation of heat generated due to flow of a large current, resistance to thermal stress, strength of device and light emission efficiency, and a method for producing a light emitting device having a vertical geometry light emitting diode as the light source by using the package aggregate.
    Type: Application
    Filed: October 16, 2007
    Publication date: July 29, 2010
    Inventors: Hiroshi Fushimi, Kengo Nishiyama, Kouji Kudou, Itsuki Yamamoto, Kazuma Mitsuyama
  • LIGHT EMITTING DEVICE AND PRODUCTION METHOD OF SAME
    Publication number: 20100038662
    Abstract: A light emitting device, and a production method thereof, is provided having for a light source thereof a vertical geometry light emitting diode, that allows a large current to flow through the vertical geometry light emitting diode and takes into consideration the dissipation of heat occurring at that time or the expansion and contraction of a metal member due to thermal stress caused by that heat.
    Type: Application
    Filed: November 7, 2007
    Publication date: February 18, 2010
    Inventors: Hiroshi Fushimi, Kengo Nishiyama, Kouji Kudou, Itsuki Yamamoto, Kazuma Mitsuyama
  • Light emitting diode package including base body with thermal via and light emitting diode using the same
    Patent number: 7489076
    Abstract: In a light emitting diode package or a light emitting diode, a cover body having an opening with a reflecting surface is attached on an upper portion of a base body on which a light emitting diode element is mounted. The base body is formed of alumina ceramics having a pore diameter of 0.10 to 1.25 ?m or a porosity of 10% or more, and a thermal via is formed in the base body. Accordingly, it is possible to improve luminance and heat radiating characteristics of the light emitting diode package and the light emitting diode which uses alumina ceramics.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: February 10, 2009
    Assignees: Kyoritsu Elex Co., Ltd., Toyoda Gosei Co., Ltd.
    Inventors: Kazuma Mitsuyama, Itsuki Yamamoto, Kouji Kudo, Nario Fukumoto, Hiroyuki Fukae, Kengo Nishiyama, Takumi Narita, Hiroaki Kawaguchi, Toshimasa Hayashi
  • Light emitting diode package and light emitting diode
    Publication number: 20070235746
    Abstract: In a light emitting diode package or a light emitting diode, a cover body having an opening with a reflecting surface is attached on an upper portion of a base body on which a light emitting diode element is mounted. The base body is formed of alumina ceramics having a pore diameter of 0.10 to 1.25 ?m or a porosity of 10% or more, and a thermal via is formed in the base body. Accordingly, it is possible to improve luminance and heat radiating characteristics of the light emitting diode package and the light emitting diode which uses alumina ceramics.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 11, 2007
    Inventors: Kazuma Mitsuyama, Itsuki Yamamoto, Kouji Kudo, Nario Fukumoto, Hiroyuki Fukae, Kengo Nishiyama, Takumi Narita, Hiroki Kawaguchi