Patents by Inventor Kazumasa Kitamura

Kazumasa Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190152021
    Abstract: Through the following steps (a) and (b), the side surface of a grinding object is ground to manufacture a ground product having a smaller diameter than that of the grinding object. In the step (a), a cup type grinding stone is disposed such that the central axis is parallel offset from a state where the central axis is orthogonal to the central axis of the grinding object. In the step (b), the cup type grinding stone is axially rotated so that the cup type grinding stone grinds the side surface of the grinding object while the grinding object is axially rotated and moved in the axial direction. Thereby, the outer peripheral surface of the grinding object is finish-ground by the bottom grinding stone portion of the cup type grinding stone while the grinding object is rough-ground by the side grinding stone portion to obtain a ground product.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 23, 2019
    Applicant: NGK INSULATORS, LTD.
    Inventors: Kazumasa KITAMURA, Hirofumi HOSOKAWA, Nobuchika NOGUCHI
  • Patent number: 9947428
    Abstract: An atomic beam source includes a tubular cathode that includes an emission portion that includes an emission port through which an atomic beam can be emitted, a rod-shaped first anode disposed inside the cathode, and a rod-shaped second anode disposed inside the cathode and spaced from the first anode. At least one selected from the group consisting of a shape of the cathode, a shape of the first anode, a shape of the second anode, and a positional relationship between the cathode, the first anode, and the second anode is predetermined so that emission of sputter particles resulting from collision of cations, which have been generated by plasma between the first anode and the second anode, with at least one selected from the cathode, the first anode, and the second anode is reduced.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 17, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Hiroyuki Tsuji, Tomonori Takahashi, Yoshimasa Kondo, Kazumasa Kitamura, Takayoshi Akao, Tomoki Nagae
  • Patent number: 9935257
    Abstract: A production method for a composite substrate according to the present invention comprises (a) a step of mirror-polishing a piezoelectric-substrate side of a laminated substrate formed by bonding a piezoelectric substrate and a support substrate; (b) a step of performing machining using an ion beam or a neutral atom beam so that a thickness of an outer peripheral portion of the piezoelectric substrate is larger than a thickness of an inner peripheral portion and a difference between a largest thickness and a smallest thickness of the inner peripheral portion of the piezoelectric substrate is 100 nm or less over an entire surface; and (c) a step of flattening the entire surface of the piezoelectric substrate to remove at least a part of an altered layer formed by the machining using the ion beam or the neutral atom beam in the step (b).
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 3, 2018
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Publication number: 20170179371
    Abstract: A production method for a composite substrate according to the present invention comprises (a) a step of mirror-polishing a piezoelectric-substrate side of a laminated substrate formed by bonding a piezoelectric substrate and a support substrate; (b) a step of performing machining using an ion beam or a neutral atom beam so that a thickness of an outer peripheral portion of the piezoelectric substrate is larger than a thickness of an inner peripheral portion and a difference between a largest thickness and a smallest thickness of the inner peripheral portion of the piezoelectric substrate is 100 nm or less over an entire surface; and (c) a step of flattening the entire surface of the piezoelectric substrate to remove at least a part of an altered layer formed by the machining using the ion beam or the neutral atom beam in the step (b).
    Type: Application
    Filed: March 3, 2017
    Publication date: June 22, 2017
    Applicant: NGK INSULATORS, LTD.
    Inventors: Kazumasa KITAMURA, Tomoki NAGAE
  • Publication number: 20170154697
    Abstract: An atomic beam source 10 includes a tubular cathode 20 that includes an emission portion 30 that includes an emission port 32 through which an atomic beam can be emitted, a rod-shaped first anode 40 disposed inside the cathode 20, and a rod-shaped second anode 50 disposed inside the cathode 20 and spaced from the first anode 40. At least one selected from the group consisting of a shape of the cathode, a shape of the first anode, a shape of the second anode, and a positional relationship between the cathode, the first anode, and the second anode is predetermined so that emission of sputter particles resulting from collision of cations, which have been generated by plasma between the first anode and the second anode, with at least one selected from the cathode, the first anode, and the second anode is reduced.
    Type: Application
    Filed: February 10, 2017
    Publication date: June 1, 2017
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hiroyuki TSUJI, Tomonori TAKAHASHI, Yoshimasa KONDO, Kazumasa KITAMURA, Takayoshi AKAO, Tomoki NAGAE
  • Patent number: 9616637
    Abstract: A die for forming a honeycomb structure, including: a second plate-shaped portion that is formed of iron and the like and has back holes; and a first plate-shaped portion that is formed of tungsten carbide based cemented carbide and has cavities communicating with the back holes and slits communicating with the cavities, with the first plate-shaped portion having a first layer arranged in the second plate-shaped portion side and a second layer arranged on the first layer, the cavities are opened on both sides of the first layer, and the slits are opened on both sides of the second layer.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: April 11, 2017
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Hirofumi Hosokawa, Tomoki Nagae
  • Publication number: 20150266155
    Abstract: A grinding apparatus 10 includes a controller 11 for controlling the entire apparatus, a grinding motor 14, a base metal 15 to be rotated by the grinding motor 14, and a grinding wheel 16 fixed to the base metal 15. In a grinding step, the grinding apparatus 10 is used and a surface 19 of an object to be polished 18 is ground with the grinding wheel 16 rotating at a peripheral speed of 10 m/s or less. In the grinding step, the surface 19 of the object to be polished 18 is preferably ground with the grinding wheel 16 rotating at a peripheral speed of 0.5 m/s or more. In the grinding step, a surface of alumina, sapphire, silicon carbide, or gallium nitride is ground as the object to be polished.
    Type: Application
    Filed: May 27, 2015
    Publication date: September 24, 2015
    Inventors: Kazumasa KITAMURA, Tomoki NAGAE
  • Patent number: 9033764
    Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished is placed on a polishing pad over the boundary between the first polishing region and the second polishing region, the first polishing region has grooves and the second polishing region has grooves different from those of the first polishing region, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished is polished by rotating the polishing pad and the object to be polished.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: May 19, 2015
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Publication number: 20150083325
    Abstract: Disclosed is a die for forming a honeycomb structure, including: a second plate-shaped portion that is formed of iron and the like and has back holes; and a first plate-shaped portion that is formed of tungsten carbide based cemented carbide and has cavities communicating with the back holes and slits communicating with the cavities, wherein the first plate-shaped portion has a first layer arranged in the second plate-shaped portion side and a second layer arranged on the first layer, the cavities 11 are opened on both sides of the first layer, and the slits are opened on both sides of the second layer.
    Type: Application
    Filed: December 1, 2014
    Publication date: March 26, 2015
    Inventors: Kazumasa KITAMURA, Hirofumi HOSOKAWA, Tomoki NAGAE
  • Publication number: 20150086670
    Abstract: Disclosed is a die for forming a honeycomb structure, including: a second plate-shaped portion that has a second bonded surface, where a back hole for introducing a forming raw material is formed; and a first plate-shaped portion that has a first bonded surface, where a slit communicating with the back hole to form a forming raw material is formed, and a cavity communicating with the back hole and the slit is formed in the first bonded surface side, wherein the first plate-shaped portion is arranged on the second plate-shaped portion, an open end of the cavity on the first bonded surface has a diameter different from that of an open end of the back hole on the second bonded surface, and the open end of the cavity on the first bonded surface is arranged inside the open end of the back hole on the second bonded surface.
    Type: Application
    Filed: December 1, 2014
    Publication date: March 26, 2015
    Inventors: Kazumasa KITAMURA, Hirofumi HOSOKAWA, Tomoki NAGAE
  • Publication number: 20120179858
    Abstract: A memory card of the present embodiment includes a memory section configured to have a non-volatile semiconductor memory cell, an erasure setting section whose physical state changes irreversibly and a memory controller configured to perform total erasure processing of erasing all data stored in the memory section according to the physical state of the erasure setting section.
    Type: Application
    Filed: September 7, 2011
    Publication date: July 12, 2012
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Toshiyuki MIYASHITA, Kazumasa Kitamura
  • Patent number: 8178815
    Abstract: In a molding die machining electrode, slit grooves of a molding die are machined with a slit groove forming part having a substantially circular outer circumference by arranging hexagonal erected wall parts in a row; while the inner circumference of a slit groove forming part overlaps with the erected wall parts in the outer circumference of the slit groove forming part, the outside slit grooves are machined with the slit groove forming part having a substantially circular outer circumference. The further outside slit grooves are machined with the slit groove forming part of the third electrode. A plurality of the slit groove forming parts are radially divided and overlapping portions between the plurality of the slit groove forming parts are formed substantially coaxially with a molded body. The areas of the slit groove forming parts are designed to nearly similar values, suppressing the difference in wear of the electrodes.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: May 15, 2012
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Publication number: 20120064803
    Abstract: The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. An object to be polished 20 is placed on a polishing pad 10 over the boundary between the first polishing region 11 and the second polishing region 12, the first polishing region 11 has grooves and the second polishing region 12 has grooves different from those of the first polishing region 11, and either one of the two regions being formed on a region on the center side, and the other on the outer side in a radial direction on the surface of the polishing pad; and the object to be polished 20 is polished by rotating the polishing pad 10 and the object to be polished 20.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 15, 2012
    Applicant: NGK Insulators, Ltd.
    Inventors: Kazumasa KITAMURA, Tomoki NAGAE
  • Patent number: 7997888
    Abstract: A die for forming a honeycomb structure is provided with back pores through which a forming material is introduced and slits through which the forming material is extruded into a lattice-like shape, and the die comprises a first plate-like member made of a super hard alloy containing tungsten carbide and a bonding agent and provided with the back pores extending in a thickness direction; and a second plate-like member bonded to the first plate-like member, made of the super hard alloy containing tungsten carbide and the bonding agent, and provided with the slits connected to the back pores, wherein the bonding agent is dispersed in a lesser amount in a bonded part between the first plate-like member and the second plate-like member than in the other part.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: August 16, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Publication number: 20100143529
    Abstract: Here is disclosed a die 1 for forming a honeycomb structure provided with back pores 4 through which a forming material is introduced and slits 5 through which the forming material is extruded into a lattice-like shape, and the die comprises a first plate-like member 2 made of a super hard alloy containing tungsten carbide and a bonding agent and provided with the back pores 4 extending in a thickness direction; and a second plate-like member 2 bonded to the first plate-like member 2, made of the super hard alloy containing tungsten carbide and the bonding agent, and provided with the slits 5 connected to the back pores 4, wherein the bonding agent is dispersed in a less amount in a bonded part 6 between the first plate-like member 2 and the second plate-like member 3 than in the other part.
    Type: Application
    Filed: November 24, 2009
    Publication date: June 10, 2010
    Applicant: NGK Insulators, Ltd.
    Inventors: Kazumasa KITAMURA, Tomoki NAGAE
  • Patent number: 7701319
    Abstract: An inductor element comprises: a ceramic base member; and a coil composed of a conductor having a shape complementary to the ceramic base member. In the inductor element, a prescribed plural number of steps are formed on at least an inner wall surface of the ceramic base member facing to the coil in one direction.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: April 20, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Yoshinori Yamaguchi
  • Patent number: 7677708
    Abstract: There is disclosed a small and thin ink jet head having an excellent productivity, in which Piezoelectric elements capable of developing a large displacement amount and a high displacement generation force can highly densely be arranged together with ink chambers and nozzles and in which generation of crosstalk is inhibited. A discharge device comprises a channel section in which a plurality of channels are formed, each channel having an introduction hole, a pressurizing chamber and a discharge hole; and an actuator section having a top plate, a pair of support walls arranged at opposite ends of the top plate and a plurality of piezoelectric elements hanging from the top plate, spread between the pair of support walls, arranged independently of one another and forming pairs with the channels.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: March 16, 2010
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Kazuhiro Yamamoto
  • Patent number: 7510461
    Abstract: A method for grinding a number of objects includes a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the grinding jig after completion of the grinding process, smoothly and precisely without damaging a number of the objects to be ground and without altering the arrangement pattern of the objects to be ground from the start through the end of the series of steps.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: March 31, 2009
    Assignee: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Katsuyuki Tsuneoka, Tomoki Nagae
  • Publication number: 20090081325
    Abstract: In a molding die machining electrode, slit grooves of a molding die are machined with a slit groove forming part having a substantially circular outer circumference by ranging hexagonal erected wall parts in a row; while the inner circumference of a slit groove forming part overlaps with the erected wall parts in the outer circumference of the slit groove forming part, the outside slit grooves are machined with the slit groove forming part having a substantially circular outer circumference. The further outside slit grooves are machined with the slit groove forming part of the third electrode. A plurality of the slit groove forming parts are radially divided and overlapping portions between the plurality of the slit groove forming parts are formed substantially coaxially with a molded body. The areas of the slit groove forming parts are designed to nearly similar values, suppressing the difference in wear of the electrodes.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 26, 2009
    Applicant: NGK Insulators, Ltd.
    Inventors: Kazumasa Kitamura, Tomoki Nagae
  • Patent number: 7402936
    Abstract: A piezoelectric/electrostrictive device is provided with a stationary portion, a thin-plate portion supported by the stationary portion, and piezoelectric/electrostrictive element formed by alternately laminating a plurality of electrodes and a plurality of piezoelectric/electrostrictive layers. The piezoelectric/electrostrictive device is produced by cutting a thin-plate body that composes the thin-plate portion afterward and a laminated body comprising the piezoelectric/electrostrictive layers and thereafter applying prescribed specific processing (for example, heat treatment) to the cut plane (the lateral end surfaces).
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: July 22, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Koji Ikeda, Yuya Kikuta, Nobuchika Noguchi, Kazumasa Kitamura, Kazuyoshi Shibata