Patents by Inventor Kazuo Kobayashi
Kazuo Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210217950Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: ApplicationFiled: March 31, 2021Publication date: July 15, 2021Inventors: Hiroto Sugahara, Kazuo Kobayashi
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Patent number: 10978634Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: GrantFiled: May 20, 2019Date of Patent: April 13, 2021Assignee: Brother Kogyo Kabushiki KaishaInventors: Hiroto Sugahara, Kazuo Kobayashi
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Publication number: 20210010158Abstract: Provided are a silicon carbide epitaxial growth device capable of fostering epitaxial growth on a silicon carbide substrate. Mounting a wafer holder loaded with a silicon carbide substrate and a tantalum carbide member to a turntable in a susceptor, and supplying a growth gas, a doping gas, and a carrier gas into the susceptor by heating by induction heating coils placed around the susceptor, thereby epitaxial growth is fostered, and stable and proper device characteristics are obtained, moreover, the yield in a manufacturing step of the silicon carbide epitaxial wafer is significantly improved.Type: ApplicationFiled: April 29, 2020Publication date: January 14, 2021Applicant: Mitsubishi Electric CorporationInventors: Masashi SAKAI, Shinichiro KATSUKI, Kazuo KOBAYASHI, Yasunari HINO
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Publication number: 20190280182Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: ApplicationFiled: May 20, 2019Publication date: September 12, 2019Inventors: Hiroto Sugahara, Kazuo Kobayashi
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Patent number: 10340439Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: GrantFiled: March 4, 2016Date of Patent: July 2, 2019Assignee: Brother Kogyo Kabushiki KaishaInventors: Hiroto Sugahara, Kazuo Kobayashi
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Publication number: 20170160012Abstract: A semiconductor annealing apparatus includes: a chamber; a tube provided inside the chamber; a wafer boat provided inside the tube so as to be able to advance into and retreat out of the tube; a loading area in which the wafer boat is positioned when the wafer boat retreats out of the tube; hydrocarbon supply means for supplying hydrocarbon gas into the tube; heating means for heating the inside of the tube; and oxygen supply means for supplying oxygen into the tube. The tube is made of sapphire or is made of SiC and formed by all-CVD, and wherein the wafer boat is made of sapphire or is made of SiC and formed by all-CVD.Type: ApplicationFiled: September 8, 2014Publication date: June 8, 2017Applicant: Mitsubishi Electric CorporationInventors: Kazuo KOBAYASHI, Masaaki IKEGAMI
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Patent number: 9505216Abstract: A liquid ejecting device has a fluid passage structure formed with multiple nozzles and multiple passages respectively communicating with the multiple nozzles. The fluid passage structure has a nozzle plate formed with the multiple nozzles, and a passage body laminated and bonded with the nozzle plate, the passage body being formed with multiple individual passages respectively communicating with the multiple nozzles, the passage body being formed with provided with multiple convex parts made of a material harder than the nozzle plate. The multiple convex parts protruding toward a nozzle plate side, and the multiple convex parts are covered by the nozzle plate. Further, the multiple convex parts protrude with respect to a liquid ejection surface on which ejection openings of the multiple nozzles arranged.Type: GrantFiled: August 14, 2015Date of Patent: November 29, 2016Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Shohei Koide, Atsushi Ito, Kazuo Kobayashi, Hiroaki Hiraide
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Patent number: 9455197Abstract: When a gate insulating film is formed on a silicon carbide substrate, the silicon carbide substrate is first oxidized with an oxidation reactant gas to form the gate insulating film on the surface of the silicon carbide substrate. The silicon carbide substrate on which the gate insulating film has been formed is nitrided with a nitriding reactant gas. The oxidation and the nitriding are performed continuously in the same diffusion furnace while a temperature of 1200° C. to 1300° C. inclusive is maintained.Type: GrantFiled: September 14, 2015Date of Patent: September 27, 2016Assignee: Mitsubishi Electric CorporationInventors: Hideaki Yuki, Kazuo Kobayashi, Yoichiro Tarui
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Patent number: 9394412Abstract: A composite cured silicone powder comprising: (A) a cured silicone powder having an average particle size of 0.1 to 500 ?m, (B) an inorganic fine powder coated on the surface of said cured silicone powder and (C) a monohydric or polyhydric alcohol with a boiling point of at least 150° C. coating on the surface of component (A) and/or component (B). The composite cured silicone powder that has an excellent flowability, hydrophilicity, and dispersibility. And, this invention also relates to a production method of the composite, which is characterized by mixing components (A) to (C) under the condition of mechanical shearing.Type: GrantFiled: July 26, 2010Date of Patent: July 19, 2016Assignee: DOW CORNING TORAY CO., LTD.Inventors: Kazuo Kobayashi, Ryuji Tachibana, Tadashi Takimoto
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Publication number: 20160190425Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: ApplicationFiled: March 4, 2016Publication date: June 30, 2016Inventors: Hiroto Sugahara, Kazuo Kobayashi
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Publication number: 20160181160Abstract: When a gate insulating film is formed on a silicon carbide substrate, the silicon carbide substrate is first oxidized with an oxidation reactant gas to form the gate insulating film on the surface of the silicon carbide substrate. The silicon carbide substrate on which the gate insulating film has been formed is nitrided with a nitriding reactant gas. The oxidation and the nitriding are performed continuously in the same diffusion furnace while a temperature of 1200° C. to 1300° C. inclusive is maintained.Type: ApplicationFiled: September 14, 2015Publication date: June 23, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hideaki YUKI, Kazuo KOBAYASHI, Yoichiro TARUI
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Patent number: 9302467Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: GrantFiled: April 9, 2014Date of Patent: April 5, 2016Assignee: Brother Kogyo Kabushiki KaishaInventors: Hiroto Sugahara, Kazuo Kobayashi
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Publication number: 20160052269Abstract: A liquid ejecting device has a fluid passage structure formed with multiple nozzles and multiple passages respectively communicating with the multiple nozzles. The fluid passage structure has a nozzle plate formed with the multiple nozzles, and a passage body laminated and bonded with the nozzle plate, the passage body being formed with multiple individual passages respectively communicating with the multiple nozzles, the passage body being formed with provided with multiple convex parts made of a material harder than the nozzle plate. The multiple convex parts protruding toward a nozzle plate side, and the multiple convex parts are covered by the nozzle plate. Further, the multiple convex parts protrude with respect to a liquid ejection surface on which ejection openings of the multiple nozzles arranged.Type: ApplicationFiled: August 14, 2015Publication date: February 25, 2016Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventors: Shohei KOIDE, Atsushi ITO, Kazuo KOBAYASHI, Hiroaki HIRAIDE
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Patent number: 9159585Abstract: A method of manufacturing a semiconductor device according to the present invention includes the steps of (b) forming, on a back face of a dummy substrate and back faces of a plurality of semiconductor substrates, inorganic films having such thicknesses as to be resistant to a temperature of a thermal oxidizing treatment or a heat treatment and to sufficiently decrease an amount of oxidation or reducing gaseous species to reach the back faces of the dummy substrate and the plurality of semiconductor substrates, (c) disposing the dummy substrate and the plurality of semiconductor substrates in a lamination with surfaces turned in the same direction at an interval from each other, and (d) carrying out a thermal oxidizing treatment or post annealing over the surfaces of the semiconductor substrates in an oxidation gas atmosphere or a reducing gas atmosphere after the steps (b) and (c).Type: GrantFiled: November 4, 2013Date of Patent: October 13, 2015Assignee: Mitsubishi Electric CorporationInventors: Toshikazu Tanioka, Yoichiro Tarui, Kazuo Kobayashi, Hideaki Yuki, Yosuke Setoguchi
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Patent number: 9153505Abstract: A method for manufacturing an SiC semiconductor device according to the present invention includes the steps of (a) implanting an impurity into a surface layer of an SiC substrate at a concentration of 1×1020 cm?3 or higher, (b) forming a graphite film on a surface of the SiC substrate after the step (a), (c) activating the impurity by annealing the SiC substrate after the step (b), (d) removing the graphite film after the step (c), (e) oxidizing the surface of the SiC substrate to form an oxide film after the step (d), (f) removing the oxide film, and (g) measuring resistance of the SiC substrate by a four-point probe method after the step (f).Type: GrantFiled: April 25, 2014Date of Patent: October 6, 2015Assignee: Mitsubishi Electric CorporationInventor: Kazuo Kobayashi
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Publication number: 20150072448Abstract: A method for manufacturing an SiC semiconductor device according to the present invention includes the steps of (a) implanting an impurity into a surface layer of an SiC substrate at a concentration of 1×1020 cm?3 or higher, (b) forming a graphite film on a surface of the SiC substrate after the step (a), (c) activating the impurity by annealing the SiC substrate after the step (b), (d) removing the graphite film after the step (c), (e) oxidizing the surface of the SiC substrate to form an oxide film after the step (d), (f) removing the oxide film, and (g) measuring resistance of the SiC substrate by a four-point probe method after the step (f).Type: ApplicationFiled: April 25, 2014Publication date: March 12, 2015Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Kazuo KOBAYASHI
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Patent number: 8945265Abstract: A compressor compressing a fluid including lubricating oil includes, on the discharge side thereof, a first separation chamber for separating the lubricating oil by generating a swirling flow in the fluid. The first separation chamber includes: a circumferential wall; an inflow port that is formed in the circumferential wall and causes the fluid to flow into the first separation chamber; and a guiding plate extending from the circumferential wall. The guiding plate extends so as to face the inflow port in a direction where the fluid flows from the inflow port into the first separation chamber, and so as to deflect the fluid flow from the inflow port to guide it along an inner circumferential surface of the circumferential wall.Type: GrantFiled: February 17, 2012Date of Patent: February 3, 2015Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Akihiro Nakashima, Shinichi Sato, Akio Saiki, Kazuo Kobayashi
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Publication number: 20140333701Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.Type: ApplicationFiled: April 9, 2014Publication date: November 13, 2014Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventors: Hiroto Sugahara, Kazuo Kobayashi
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Patent number: 8882482Abstract: A compressor has auxiliary and main oil reservoir chambers that retain lubricant oil that is separated from refrigerant in an oil separation chamber. A part of the auxiliary oil reservoir chamber is defined by a peripheral wall of the oil separation chamber. An introducing passage for introducing lubricant oil in the oil separation chamber to the auxiliary oil reservoir chamber is formed in the peripheral wall. The inlet of the introducing passage opens to the oil separation chamber on the inner surface of the peripheral wall. The outlet of the introducing passage opens to the auxiliary oil reservoir chamber. The main oil reservoir chamber is located below the auxiliary oil reservoir chamber in the direction of gravity. A drain port for draining lubricant oil in the auxiliary oil reservoir chamber to the main oil reservoir chamber is formed in a bottom wall of the auxiliary oil reservoir chamber.Type: GrantFiled: July 25, 2012Date of Patent: November 11, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Tsubasa Mitsui, Shinichi Sato, Kazuo Kobayashi, Akio Saiki, Akihiro Nakashima, Shinsuke Asou
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Patent number: 8829141Abstract: This invention relates to a silicone oil emulsion that contains cross-linked silicone particles in drops of silicone oil which have an average particle diameter of 0.1 to 500 ?m and are dispersed in water, wherein the silicone oil contains epoxy groups, acryl groups, methacryl groups, silicon-bonded alkoxy groups, or silicon-bonded hydroxyl groups but is free of silicon-bonded hydrogen atoms and alkenyl groups, said cross-linked silicone particles is formed by a hydrosilation reaction. Furthermore, this invention also relates to a silicone oil composition obtained by removing water from said emulsion.Type: GrantFiled: September 14, 2010Date of Patent: September 9, 2014Assignee: Dow Corning Toray Co., Ltd.Inventors: Yoshitsugu Morita, Kazuo Kobayashi