Patents by Inventor Kazuo Ogata

Kazuo Ogata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10511727
    Abstract: A communication device includes a communication unit, a communication function allocation unit, a communication status determination unit, and a communication control unit. The communication unit performs communications with another communication device using a plurality of communication paths. The communication function allocation unit allocates communication functions to each of the communication paths in the communication unit. The communication status determination unit determines a communication status for each of the communication paths. The communication control unit controls communications for each of the communication paths in accordance with allocation by the communication function allocation unit and a determination result of the communication status determination unit.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: December 17, 2019
    Assignee: Olympus Corporation
    Inventors: Yoshihisa Ogata, Keito Fukushima, Kazuo Kanda, Osamu Nonaka
  • Patent number: 10382690
    Abstract: An information acquiring device for acquiring information data of an object includes: a condition detecting unit configured to detect use condition data of the information acquiring device; and a file generating unit configured to generate a file in which the information data, the use condition data, and information on response characteristics of the condition detecting unit are associated with one another. A method for acquiring information executed by an information acquiring device includes: acquiring information data of an object and storing the information data in a storage unit; detecting use condition data of the information acquiring device and storing the use condition data in the storage unit; and reading the information data and the use condition data from the storage unit, and generating a file in which the information data and the use condition data are associated with information on response characteristics in detecting the use condition data.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: August 13, 2019
    Assignee: Olympus Corporation
    Inventors: Toshikazu Hayashi, Toshihiro Ogata, Kazuo Kanda, Hideaki Yoshida, Osamu Nonaka
  • Patent number: 10310466
    Abstract: An increase in communication traffic at the time of transmission of commands of controlling power consumption of individual buildings can be suppressed so as to be low.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: June 4, 2019
    Assignee: Hitachi Systems, Ltd.
    Inventors: Kazuo Hashimoto, Yuji Ogata, Fumio Enmei, Minoru Kaneko
  • Publication number: 20190043778
    Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.
    Type: Application
    Filed: December 26, 2015
    Publication date: February 7, 2019
    Inventors: Zhizhong TANG, Shinobu KOURAKATA, Kazuo OGATA, Paul R. START, Syadwad JIAN, William Nicholas LABANOK, Wei HU, Peng LI, Douglas R. YOUNG, Gregory S. CONSTABLE, John J. Beatty, Pardeep K. BHATTI, Luke J. GARNER, Aravindha R. ANTONISWAMY
  • Patent number: 9806408
    Abstract: An antenna of the present invention includes a laminate body including a conductor core, an insulator layer, and a conductor pattern. The conductor pattern is a conductor layer formed of a conducting body disposed on a radially outer side of the insulator layer. The conductor core and the conductor pattern are connected to each other in such a manner that a current is made to flow in a direction from the conductor core to the conductor pattern or in a direction opposite thereto so as to coincide with a power supply direction.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: October 31, 2017
    Assignee: SK-Electronics Co., Ltd.
    Inventors: Shiro Sugimura, Kazuo Ogata, Shoji Hashimoto
  • Publication number: 20160372398
    Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
    Type: Application
    Filed: September 1, 2016
    Publication date: December 22, 2016
    Applicant: INTEL CORPORATION
    Inventors: Shinobu Kourakata, Kazuo Ogata
  • Patent number: 9460982
    Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
    Type: Grant
    Filed: December 6, 2015
    Date of Patent: October 4, 2016
    Assignee: Intel Corporation
    Inventors: Shinobu Kourakata, Kazuo Ogata
  • Publication number: 20160086871
    Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
    Type: Application
    Filed: December 6, 2015
    Publication date: March 24, 2016
    Applicant: Intel Corporation
    Inventors: Shinobu Kourakata, Kazuo Ogata
  • Patent number: 9236323
    Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: January 12, 2016
    Assignee: Intel Corporation
    Inventors: Shinobu Kourakata, Kazuo Ogata
  • Publication number: 20150380808
    Abstract: An antenna of the present invention includes a laminate body including a conductor core, an insulator layer, and a conductor pattern. The conductor pattern is a conductor layer formed of a conducting body disposed on a radially outer side of the insulator layer. The conductor core and the conductor pattern are connected to each other in such a manner that a current is made to flow in a direction from the conductor core to the conductor pattern or in a direction opposite thereto so as to coincide with a power supply direction.
    Type: Application
    Filed: October 8, 2013
    Publication date: December 31, 2015
    Inventors: Shiro Sugimura, Kazuo Ogata, Shoji Hashimoto
  • Patent number: 9215346
    Abstract: The image forming apparatus reads an original conveyed in the image forming apparatus, analyzes a feature value of information about an original image on the read original, generates an image to overwrite the original image with, using image data having the feature value obtained based on an analysis result, sets a predetermined area on the original image, and overwrites the predetermined area on the original image with the generated image.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: December 15, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hikaru Uchidate, Yuji Takayama, Tomoyuki Saiki, Go Araki, Kazuo Ogata, Hiroko Katsuyama, Ichiro Yasumaru
  • Patent number: 8863383
    Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: October 21, 2014
    Assignee: Intel Corporation
    Inventor: Kazuo Ogata
  • Publication number: 20140239482
    Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Inventors: Shinobu Kourakata, Kazuo Ogata
  • Publication number: 20130308166
    Abstract: The image forming apparatus reads an original conveyed in the image forming apparatus, analyzes a feature value of information about an original image on the read original, generates an image to overwrite the original image with, using image data having the feature value obtained based on an analysis result, sets a predetermined area on the original image, and overwrites the predetermined area on the original image with the generated image.
    Type: Application
    Filed: May 7, 2013
    Publication date: November 21, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hikaru Uchidate, Yuji Takayama, Tomoyuki Saiki, Go Araki, Kazuo Ogata, Hiroko Katsuyama, Ichiro Yasumaru
  • Publication number: 20120114859
    Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
    Type: Application
    Filed: January 20, 2012
    Publication date: May 10, 2012
    Inventor: Kazuo Ogata
  • Patent number: 8136244
    Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: March 20, 2012
    Assignee: Intel Corporation
    Inventor: Kazuo Ogata
  • Publication number: 20090229127
    Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
    Type: Application
    Filed: March 11, 2008
    Publication date: September 17, 2009
    Inventor: Kazuo Ogata
  • Patent number: 7554198
    Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: June 30, 2009
    Assignee: Intel Corporation
    Inventors: Kazuo Ogata, Tsuyoshi Fukuo, Seiji Ishiyama, Tetsuhide Koh
  • Publication number: 20080001270
    Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Inventors: Kazuo Ogata, Tsuyoshi Fukuo, Seiji Ishiyama, Tetsuhide Koh
  • Publication number: 20070231970
    Abstract: An embodiment of the present invention is a technique to fabricate a package. A lower die is attached to a substrate. A stacked-die assembly having a spacer made of a cured mold compound is formed between the lower die and an upper die. The stacked-die assembly is encapsulated using the cured mold compound.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventors: Tsuyoshi Fukuo, Tetsuhide Koh, Seiji Ishiyama, Kazuo Ogata