Patents by Inventor Kazushi Hyakumura

Kazushi Hyakumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230124650
    Abstract: An optical system that relays light to a machining lens to be used for machining on a workpiece includes a spatial light modulator and a second lens arranged between the spatial light modulator and the machining lens, a distance D from the second lens to a machining lens pupil is D = f2 - Mf2, and a distance D1 from the spatial light modulator to the second lens is D1 = f2 - f2/M, and the spatial light modulator has a conjugate relation with the machining lens pupil of the machining lens, where f2 is a focal length of the second lens, and M is a projection magnification from the spatial light modulator to the machining lens pupil of the machining lens.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 20, 2023
    Applicant: Tokyo Seimitsu Co., Ltd.
    Inventor: Kazushi HYAKUMURA
  • Patent number: 11065722
    Abstract: A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 20, 2021
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Kazushi Hyakumura
  • Publication number: 20200114473
    Abstract: A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.
    Type: Application
    Filed: October 8, 2019
    Publication date: April 16, 2020
    Inventor: Kazushi HYAKUMURA
  • Patent number: 10322467
    Abstract: A height position of a surface of a wafer can be detected accurately and stably without being affected by variation in a thin film formed on the surface of the wafer. An AF (autofocus) device irradiates the surface of the wafer W with an AF laser beam, detects reflection light thereof for each wavelength with a detection optical system. An AF signal processing unit outputs a displacement signal indicating displacement of the surface of the wafer to a control unit on the basis of a detection result of the detection optical system. Moreover, the AF device includes a focus optical system disposed in an irradiation optical path which is an optical path from the light source unit to a light converging lens. The focus optical system adjusts a light converging point of the AF laser beam in a wafer thickness direction.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: June 18, 2019
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventor: Kazushi Hyakumura
  • Publication number: 20170320165
    Abstract: A height position of a surface of a wafer can be detected accurately and stably without being affected by variation in a thin film formed on the surface of the wafer. An AF (autofocus) device irradiates the surface of the wafer W with an AF laser beam, detects reflection light thereof for each wavelength with a detection optical system. An AF signal processing unit outputs a displacement signal indicating displacement of the surface of the wafer to a control unit on the basis of a detection result of the detection optical system. Moreover, the AF device includes a focus optical system disposed in an irradiation optical path which is an optical path from the light source unit to a light converging lens. The focus optical system adjusts a light converging point of the AF laser beam in a wafer thickness direction.
    Type: Application
    Filed: July 27, 2017
    Publication date: November 9, 2017
    Inventor: Kazushi HYAKUMURA
  • Patent number: 9685355
    Abstract: A laser dicing device includes a laser light source, an AF light source, a light path of the processing laser light and a light path of the AF laser light being partially shared with each other, a condenser lens arranged on the shared light path between the first laser light and the second laser light, an AF signal processing unit that generates a focus error signal based on reflected light of the AF laser light reflected by the surface of the wafer, a controller that moves the condenser lens such that a distance between the condenser lens and the surface of the wafer is made constant based on the focus error signal, and a focus lens group that adjusts the position of the condensing point of the AF laser light in a state where the position of the condensing point of the processing laser light is fixed.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: June 20, 2017
    Assignee: TOKYO SEIMITSU CO., LTD.
    Inventor: Kazushi Hyakumura
  • Publication number: 20160372349
    Abstract: A laser dicing device includes a laser light source, an AF light source, a light path of the processing laser light and a light path of the AF laser light being partially shared with each other, a condenser lens arranged on the shared light path between the first laser light and the second laser light, an AF signal processing unit that generates a focus error signal based on reflected light of the AF laser light reflected by the surface of the wafer, a controller that moves the condenser lens such that a distance between the condenser lens and the surface of the wafer is made constant based on the focus error signal, and a focus lens group that adjusts the position of the condensing point of the AF laser light in a state where the position of the condensing point of the processing laser light is fixed.
    Type: Application
    Filed: August 30, 2016
    Publication date: December 22, 2016
    Inventor: Kazushi HYAKUMURA
  • Patent number: 4999508
    Abstract: The optical film thickness measuring device comprises a spectral reflectance measuring device for measuring spectral reflectance of two layers of a two-layer optical film, a memory device for storing, as reflectance data theoretical values of optical thickness and refractive index of each layer of the two-layer optical film as well as those of reflectance of the two-layer optical film, a data selecting device for selectively reading out the reflectance data corresponding to the measuring wavelengths for measured values of spectral reflectance and a film thickness deciding means for determining thickness of each layer of the two-layer optical film on the basis of the selected reflectance data and the measured spectral reflectance. This optical film thickness measuring device is capable of quickly and accurately measuring thickness of each layer of two-layer optical films.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: March 12, 1991
    Assignee: Olympus Optical Co., Ltd.
    Inventor: Kazushi Hyakumura
  • Patent number: 4999509
    Abstract: The optical measuring device of film thickness consists of a spectral reflectance measuring device and a film thickness deciding device. The film thickness deciding device comprises a reflectance operating device, an evaluation function operating device, a global optimization device, a local optimization device, and settlement judging devices added to the global optimization device and the local optimization device respectively. A data selecting device may be interposed between the spectral reflectance measuring device and the film thickness deciding device. The optical measuring device of film thickness is capable of measuring thickness of individual layers of a multi-layer film simultaneously, speedily and accurately.
    Type: Grant
    Filed: March 26, 1990
    Date of Patent: March 12, 1991
    Assignee: Olympus Optical Co., Ltd.
    Inventors: Yorio Wada, Kazushi Hyakumura
  • Patent number: 4831276
    Abstract: In order to insure a high degree of precision of measurement with a simple structure, the apparatus for measuring reflectivity employs an objective lens, a half-mirror disposed rearwardly of the objective lens and a light source means disposed on one of the optical paths so split by the half-mirror for emitting an annular bundle of light. A fine aperture stop is disposed on the other optical path so split by the half-mirror. A light-responsive device is disposed rearwardly of the fine aperture stop, a memory is coupled to the light-responsive device and a mathematical operation device is connected to the memory. An indicating device is connected to the mathematical operation device. An annular bundle of light is collected onto an examination surface via the half-mirror and the objective lens, and that the reflection light produced at the examination surface is caused to impinge onto the light-responsive device via the objective lens, the half-mirror and the fine aperture stop.
    Type: Grant
    Filed: February 17, 1988
    Date of Patent: May 16, 1989
    Assignee: Olympus Optical Co., Ltd.
    Inventor: Kazushi Hyakumura
  • Patent number: 4232945
    Abstract: A behind-stop type photographic camera lens system designed for an aperture ratio of F/2.8, a field angle of 60.degree., a short total length less than 0.37 f and favorably corrected aberrations, and comprising a first positive meniscus lens component, a second positive meniscus lens component, a third negative lens component, a fourth cemented lens component consisting of a biconvex lens element and a negative lens element.
    Type: Grant
    Filed: August 7, 1978
    Date of Patent: November 11, 1980
    Assignee: Olympus Optical Co., Ltd.
    Inventor: Kazushi Hyakumura
  • Patent number: 4192579
    Abstract: A lens system for photographic cameras which has a very short total length and wherein aberrations are favorably corrected. Said lens system comprises a first positive meniscus lens component, a second biconcave lens component and a third cemented doublet component, and said lens system satisfying the conditions enumerated hereunder:(1) 0.23f<.SIGMA.d<0.3f(2) 0.55f<f.sub.1 <0.59f(3) -0.37f<f.sub.2 <-0.32f(4) n.sub.1 >1.71(5) n.sub.2 <1.67(6) .vertline.r.sub.7 .vertline.>4.8f(7) 0.26f <-r.sub.6 <0.34f(8) .vertline.r.sub.3 .vertline./r.sub.4 >6.0(9) .nu..sub.1 -.nu..sub.
    Type: Grant
    Filed: January 30, 1978
    Date of Patent: March 11, 1980
    Assignee: Olympus Optical Company Limited
    Inventor: Kazushi Hyakumura
  • Patent number: 4130349
    Abstract: A retrofocus type wide-angle lens system comprising five components of five lens elements including a front diverging lens group consisting only of a single lens element and a thick positive lens element arranged at the second stage, said lens system being so designed as to have a short total length and favorably correct various aberrations.
    Type: Grant
    Filed: April 5, 1977
    Date of Patent: December 19, 1978
    Assignee: Olympus Optical Co., Ltd.
    Inventor: Kazushi Hyakumura