Abstract: A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.

Abstract: A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.

Abstract: A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.

Abstract: A plurality of structures of condenser microphones is fabricated in a single condenser microphone array chip. The condenser microphone array chip includes a substrate having a plurality of openings serving as air cavities, a first insulating layer formed in the outer periphery of the openings, a first electrode layer stretched over each of the openings, a second insulating layer formed above the first electrode layer in the outer periphery of the openings, a second electrode layer formed above the second insulating layer relative to the first electrode layer via an air gap therebetween. The structures are connected via a plurality of bridges and separated via a plurality of channels therebetween. The channels circumvent the bridges so that at least the second insulating layer is partially removed from the channels. The bridges are formed using the second electrode layer serving as wiring for electrically connecting the structures of condenser microphones.

Abstract: A plurality of structures of condenser microphones is fabricated in a single condenser microphone array chip. The condenser microphone array chip includes a substrate having a plurality of openings serving as air cavities, a first insulating layer formed in the outer periphery of the openings, a first electrode layer stretched over each of the openings, a second insulating layer formed above the first electrode layer in the outer periphery of the openings, a second electrode layer formed above the second insulating layer relative to the first electrode layer via an air gap therebetween. The structures are connected via a plurality of bridges and separated via a plurality of channels therebetween. The channels circumvent the bridges so that at least the second insulating layer is partially removed from the channels. The bridges are formed using the second electrode layer serving as wiring for electrically connecting the structures of condenser microphones.

Abstract: A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.