Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.

Abstract: To provide a diaphragm and a diaphragm valve which solve a problem of deterioration of air-tightness due to insufficient tightening of a bolt and damage to the diaphragm due to over-tightening of the bolt, as well as reducing variations in performance such as durability of the diaphragm and simplifying tightening work. A diaphragm is provided with a through hole having a diameter larger than a diameter through which a bolt can be fitly inserted. A bolt insertion cylinder made of metal through which the bolt can be inserted is fitted in the through hole. A height of the bolt insertion cylinder is equal to or less than a height of the through hole.

Abstract: An electronic device casing includes a peripheral wall portion enclosing an outer circumference of a substrate provided with a connector, an opening portion formed in the peripheral wall portion to have an opening from which the connector is exposed to an exterior, an upper plate portion covering an upper part of the peripheral wall portion, and a protrusion portion protruding from an end part of the upper plate portion and covering an upper part of the connector exposed from the opening portion. The protrusion portion has a first end part connected to the upper plate portion, and a second end part opposite from the first end part in a protruding direction of the protrusion portion. The second end part is higher than the first end part.