Abstract: A heat exchanger includes a duct, a stacked core, and a coupling plate. The duct includes a first plate that is disposed to face at least one of end faces of the stacked core in a core width direction, and a second plate that is disposed to face at least one of the end faces of the stacked core in a tube stacking direction. The second plate includes a second-plate end plate portion disposed to face the end face of the stacked core in the core width direction and brazed to a wall surface of the first plate, a second-plate center plate portion that is disposed to face the end face of the stacked core in the tube stacking direction, and a flange portion that extends in the tube stacking direction and is brazed to a bottom wall surface of a groove portion of the coupling plate.

Abstract: A heat-pump using apparatus includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is capable of executing a heating operation and a cooling operation. A first expansion device is provided downstream of a reservoir, and a second expansion device is provided upstream of the reservoir, in the flow of refrigerant in the heating operation. A main circuit of the heat medium circuit includes a branching part and a joining part. An overpressure protection device is connected to a connection part which is located between a load-side heat exchanger and one of the branching part and the joining part or at the load-side heat exchanger. A refrigerant leakage detecting device is connected to the other of the branching part and the joining part, or between the other of the branching part and the joining part and the connection part, or to the connection part.

Abstract: An apparatus using a heat pump includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is capable of performing a first operation, in which a load-side heat exchanger is used as a condenser, and a second operation, in which the load-side heat exchanger is used as an evaporator. A main circuit of the heat medium circuit has a branching part and a joining part. An overpressure protection device and a refrigerant leakage detecting device are connected to the main circuit. The overpressure protection device is connected to a connection part located between the load-side heat exchanger and one of the branching part and the joining part, or at the load-side heat exchanger. When leakage of refrigerant is detected, the state of a refrigerant flow switching device is set to a second state, an expansion device is set to a closed state, and a compressor is operated.

Abstract: A plate-type heat exchanger includes a plurality of heat transfer plates stacked on top of each other, a flow passage, formed by each space between the plurality of heat transfer plates, through which a fluid flows in a first direction; an inner fin disposed in the flow passage, a first projecting portion provided on an inflow side of each of the heat transfer plates and configured to prevent the fluid from flowing into gaps between both ends of the inner fin in a second direction and both ends of the heat transfer plate in the second direction, and a second projecting portion formed on an outflow side of each of the heat transfer plates and configured to perform positioning in placing the inner fin into the heat transfer plate. The first direction is a direction of flow of the fluid through the flow passage.

Abstract: A heat pump apparatus includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit performs a first operation using a load-side heat exchanger as a condenser, and a second operation using the load-side heat exchanger as an evaporator. A suction pipe provided between a refrigerant flow switching valve and a compressor has a container. To the heat medium circuit, an overpressure protection relief valve and a refrigerant leakage detector are connected. When leakage of refrigerant into the heat medium circuit is detected, the refrigerant flow switching valve is switched to a second state, an expansion device is set to a closed state, and the compressor is operated. When a requirement for ending the operation of the compressor is satisfied after the leakage is detected, the compressor is stopped, and the refrigerant flow switching valve is switched to a first state.

Abstract: A heat exchanger includes a plurality of cooling plates, a duct plate disposed around the cooling plates and a spacer plate fixed to both the duct plate and the cooling plate to prevent supercharged air from flowing into a gap between the duct plate and the cooling plate. The cooling plate includes cup portions allowing cooling water flow paths of the corresponding two cooling plates to be in communication with each other when the cooling plate is fixed to the adjacent cooling plate. The cooling water flow path formed in the cooling plate includes flow path portions and formed extending in a direction perpendicular to a flow direction of supercharged air from the corresponding cup portions. The cup portions are each formed in a tubular shape having a central axis at a position offset along the flow direction of the supercharged air from a center of the corresponding one of the flow path portions in a flow path width direction.

Abstract: Provided is a position detection sensor. In a first pixel part, as an incident position is closer to a first end of a first pixel pair group in a second direction, an intensity of a first electric signal decreases. In a second pixel part, as the incident position is closer to the first end, an intensity of a second electric signal increases. In a third pixel part, as the incident position is closer to a second end of a second pixel pair group in a first direction, an intensity of a third electric signal decreases. In a fourth pixel part, as the incident position is closer to the second end, an intensity of a fourth electric signal increases. A calculation unit calculates a second position on the basis of the first and second electric signals, and calculates a first position on the basis of the third and fourth electric signals.

Abstract: A heat exchanger includes a plate member, a fixation member, and a brazing material pathway. The plate member has a first side coated with a brazing material, and a second side which is an opposite side of the first side and is not coated with the brazing material. The fixation member is disposed on the second side and configured to fix a position of a pipe. The brazing material pathway extends from the first side to the second side. The brazing material coated on the plate member spreads into the brazing material pathway. The pipe is inserted into an insertion hole formed in the plate member. An entire outer circumference of the pipe is swaged and engaged with an inner side of the insertion hole. The brazing material pathway is formed on at least the outer circumference of the pipe or the inner side of the insertion hole.

Abstract: Provided is a shape measurement sensor including a light-receiving unit and a calculation unit. The light-receiving unit includes a plurality of pixel pairs. Each of the pixel pairs includes a first pixel and a second pixel that is disposed side by side with the first pixel along a first direction. In the first pixel, as an incident position is closer to one end of the light-receiving unit in a second direction, an intensity of a first electric signals decreases. In the second pixel, as the incident position is closer to the one end, an intensity of a second electric signal increases. The calculation unit calculates the incident position in the second direction for each of the pixel pairs on the basis of the intensity of the first electric signal and the intensity of the acquired second electric signal.

Abstract: A semiconductor storage device includes a first chip bonded to a second chip. The first chip includes electrode layers stacked in a first direction, a pillar extending through the stacked electrode layers and including a semiconductor film, and a memory film between the semiconductor film and the electrode layers. The second chip includes a semiconductor substrate having transistors formed thereon, a wiring connected to the transistors and between the semiconductor substrate and the first chip, bonding pads at a level closer to the first chip than the transistors. The bonding pads have a bonding surface facing away from the first chip. An opening extends through the semiconductor substrate to the bonding surface of the bonding pad.

Abstract: Provided is a position detection sensor. In a first pixel part, as an incident position is closer to a first end of a first pixel pair group in a second direction, an intensity of a first electric signal decreases. In a second pixel part, as the incident position is closer to the first end, an intensity of a second electric signal increases. In a third pixel part, as the incident position is closer to a second end of a second pixel pair group in a first direction, an intensity of a third electric signal decreases. In a fourth pixel part, as the incident position is closer to the second end, an intensity of a fourth electric signal increases. A calculation unit calculates a second position on the basis of the first and second electric signals, and calculates a first position on the basis of the third and fourth electric signals.

Abstract: A semiconductor storage device includes a first stacked body, a second stacked body, a first division film, a second division film, and a plurality of discrete films. The a first stacked body includes first electrode layers stacked in a first direction. The second stacked body, above the first stacked body, includes second electrode layers stacked in the first direction. The second semiconductor layer is electrically connected to the first semiconductor layer. The first division film, extending in the first direction through the first stacked body, divides the first stacked body in a second direction crossing the first direction. The second division film, extending in the first direction through the second stacked body, divides the second stacked body in the second direction. The discrete films, extending in the first direction through the second stacked body, are disposed above the first division film.

Abstract: An X-ray generation device includes an X-ray tube including an electron gun that generates an electron beam and a target that generates an X-ray by incidence of the electron beam; a power supply portion including a booster that boosts an input voltage from outside to generate a high voltage and an insulating block that seals the booster with an insulating material; and a control unit that performs control to generate the X-ray. The control unit includes a first information processing element that performs at least part of the control using a digital signal at a high potential based on the high voltage. The first information processing element is sealed with the insulating material in the insulating block.

Abstract: Provided is an indoor unit for a heat pump use apparatus, the indoor unit being a part of the heat pump use apparatus including a refrigerant circuit configured to circulate refrigerant, a heat medium circuit configured to allow a heat medium to flow through the heat medium circuit, and a heat exchanger configured to exchange heat between the refrigerant and the heat medium. The indoor unit is connectable to an outdoor unit accommodating the refrigerant circuit and the heat exchanger. The indoor unit accommodates a part of the heat medium circuit. The indoor unit includes a pressure protection device connected to the heat medium circuit, and an on-off device provided to be interposed between the heat medium circuit and the pressure protection device.

Abstract: An air-conditioning apparatus includes an outdoor unit, a heat medium relay unit, and an indoor unit. The outdoor unit is installed in an outdoor space, which is a space outside a building including an air-conditioned space. The heat medium relay unit is installed in the outdoor space, and includes a housing that accommodates an intermediate heat exchanger. The indoor unit includes a load heat exchanger configured to exchange heat between air and a heat medium. The housing is installed to the outer wall of the building.

Abstract: A semiconductor storage device includes a substrate having a surface, a first conductive layer 25 disposed on a substrate and extending in an X direction parallel to the surface of the substrate; a second conductive layer 25 that disposed on the first conductive layer 25 and extending in the X direction; an insulation plug 30 disposed on the substrate, extends in a Z direction intersecting with the X direction, and intersects with the first conductive layer 25; and a contact plug CC disposed on the first insulation plug 30, extends in the Z direction, and intersects with the second conductive layer 25.

Abstract: A light beam irradiation device includes a light source unit that emits a light beam, a reflection mirror and a driving unit that swings the reflection mirror under supply of a driving signal, and comprises the light deflection unit receiving and reflecting the light beam emitted from the light source unit using the reflection mirror, a light deflection angle detection unit that includes a light reception surface that receives the light beam reflected by the reflection mirror, the light deflection angle detection unit detecting a position of the light beam on the light reception surface at a frequency equal to or higher than four times a resonance frequency of the light deflection unit and outputting a detection signal indicating the position, and an operation control unit that corrects the driving signal on the basis of the detection signal and outputs the corrected driving signal to the light deflection unit.

Abstract: An X-ray tube includes: a vacuum housing configured to include an internal space which is vacuum; a target unit configured to be disposed in the internal space, and include a target that generates an X-ray by using an electron beam incident therein, and a target support unit that supports the target, the X-ray generated by the target being transmitted through the target support unit; and an X-ray emission window configured to be so provided as to face the target support unit, and seal an opening of the vacuum housing, the X-rays transmitted through the target support unit being transmitted through the X-ray emission window. At least a part of the X-ray emission window is in contact with the target support unit.

Abstract: An eye movement feature amount calculating system includes: a moving state input unit that inputs moving state values in a time series indicating a moving state of an eye of an examinee; a saccade period extracting unit that extracts a saccade period in which the eye performs saccadic movement based on time-series variation of the moving state values; and a feature amount calculating unit that divides a period including at least a part of the extracted saccade period into a plurality of periods and calculates a feature amount of eye movement of the subject based on the separate periods.

Abstract: In one embodiment, a semiconductor device includes a first insulator, a plurality of interconnections provided in the first insulator. The device further includes a second insulator provided on the first insulator and the plurality of interconnections, and a conductor provided on a first interconnection among the plurality of interconnections and having a shape that is projected upwardly with respect to the first interconnection in the second insulator. The device further includes a plug provided on the first interconnection via the conductor. The device further includes a first pad provided above the plug and electrically connected to the plug, and a second pad provided on the first pad and electrically connected to the first pad.