Abstract: The cleaning composition of the present invention is characterized by containing N-hydroxyformamide. The cleaning composition is capable of easily removing patterned photoresist masks or resist residues remaining on substrates after the etching process or removing resist residues remaining after the etching process and the subsequent ashing process within a short period of time without causing the corrosion of wiring materials and insulating films, thereby ensuring the fine processing to provide high-precision wiring circuits.

Abstract: In the present invention, the concentration of dissolved oxygen in the resist stripping liquid is limited to 3 ppm or lower. Using the resist stripping liquid having such a low dissolved oxygen concentration, resist residues are removed from a substrate containing copper and/or a copper alloy without causing the corrosion of copper.

Abstract: The resist stripping composition of the present invention comprises 0.001 to 0.5% by weight of a fluorine compound, a mixed solvent of an amide solvent and an ether solvent and water. The resist stripping composition completely removes the resist residues remaining after the dry etching and the ashing in the wiring process for manufacturing semiconductor devices and liquid crystal panel devices comprising IC or LSI in a short period of time with a minimized corrosion of a low dielectric film.

Abstract: A resist stripping agent comprising a specific alkanolamine having at least one functional group represented by the following formula (I): wherein R1 and R2 are each hydrogen atom, C1-C8 alkyl or C1-C8 alkenyl. The resist stripping agent easily and efficiently removes resist films and resist residues remaining after etching or after ashing subsequent to etching in manufacturing semiconductor devices at low temperatures in short period of time. The resist stripping agent is resistant to corrosion against materials for substrate, circuits and insulating films.

Abstract: A resist stripping agent comprising a specific alkanolamine having at least one functional group represented by the following formula (I): 1

Abstract: The photoresist stripping composition of the present invention contains at least one oxymethylamine compound represented by the following formula 1: 1

Abstract: The method for removing resists of the present invention comprises a step of contacting a copper-containing substrate having a resist layer thereon with a cleaning composition containing 1% by weight or more of hydrogen peroxide and ammonia or ammonium ion; and a step of contacting the substrate thus contact-treated with an organic solvent-containing resist stripping composition, thereby removing the resist layer. The other method for removing resists of the present invention comprises a step of contacting a substrate having thereon a resist layer, preferably a non-ashed resist layer, with a resist stripping composition of pH 5 or more containing 4 to 30% by weight of hydrogen peroxide, 0.01 to 15% by weight of ammonium ion, and 0.01 to 15% by weight of phosphate ion and/or carbonate ion.

Abstract: A resist stripping composition contains 0.001 to 0.5% by weight of a fluorine compound, 50 to 99% by weight of an ether solvent and the balance being substantially water. With such a specific content range of the ether solvent, the resist stripping composition shows reduced corrosive properties when diluted with water in the rinsing step as well as shows complete removal of resist residues without causing corrosion of wiring materials and substrate materials.

Abstract: A process for preparing a lactate which includes: (a) preparing lactonitrile from prussic acid and acetaldehyde, (b) hydrating the lactonitrile to form lactamide, (c) forming the desired lactate and formamide from lactamide and formate (or methanol and carbon monoxide), (d) separating and collecting components, having a lower boiling point than that of lactate from the reaction liquid in step (c), by distillation under specified conditions, and (e) dehydrating formamide from step (d) to form prussic acid and recycling the prussic acid to step (a). Heretofore, lactates had been manufactured by forming lactonitrile (cyanohydrin) from acetaldehyde and prussic acid, and then esterifying lactonitrile with a mineral acid or the like. However, in this conventional process, ammonium salts were formed as by-products in an amount equal to that of the lactate.