Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array, and a control circuit controlling operations of the memory cell array. The control circuit supplies a non-selection voltage of the voltages before a ready/busy signal changes from a ready state to a busy state.

Abstract: A server in an assumed annual income presentation system stores a user skill database for holding information of various parameters obtained by evaluating skills of each user as an engineer, and including, as its functions, a user job category reception module for receiving designation of a job category of a user who receives a presentation of an assumed annual income, and an assumed annual income specification module for specifying the assumed annual income for the user, based on the job category that has been designated by the user, a skill parameter related to the user, experience in the job category of each user, recruitment information of a company, or information of an annual income that has been received from each user, from the job category of the user.

Abstract: A memory device includes a memory cell array, a voltage generation circuit generating one or more voltages supplied to the memory cell array, an input/output circuit receiving an address indicating a region in the memory cell array and a control circuit controlling operations of the memory cell array. The voltage generation circuit generates the voltages before a ready/busy signal changing from a ready state to a busy state.

Abstract: A manufacturing method for a cured substance includes a film forming step of applying a specific photosensitive resin composition onto a base material to form a film, an exposure step of selectively exposing the film, a development step of developing the exposed film with a developer to form a pattern, a treatment step of bringing a treatment liquid into contact with the pattern, and a heating step of heating the pattern after the treatment step, in which at least one of the developer or the treatment liquid contains at least one compound selected from the group consisting of a base and a base generator.

Abstract: A non-white textile printing ink jet ink composition according to the present disclosure contains a pigment, a resin particle, an acetylene-based surfactant having an HLB value of 6 or more and 10 or less, and water, wherein a content of the acetylene-based surfactant is 0.5% by mass or more and 2.0% by mass or less relative to a total amount of the ink composition, and the ink composition is used for a fabric having water absorbency evaluated using a method described below is 1 or more, method: a test fabric cut into 2 cm square is mounted on a water surface in a glass bottle which has a volume of 50 mL and in which 30 mL of pure water is introduced so that a height from a bottom to the water surface is 4 cm, a fabric surface being set to be parallel to the water surface, and a time elapsed from the fabric being mounted until a portion of the fabric reaching the bottom of the glass bottle is denoted as water absorbency in seconds.

Abstract: There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.

Abstract: Provided is a material for molding, without a mold, a highly uniform structure comprising a resin and a non-resin such as metals and ceramic. The molding material provided by this invention is formed of a powder comprising a resin and at least one species of non-resin selected among metals and ceramic. The resin material has a uniformity index N below 0.2. N is determined by depositting the powder in a softened or melted state to form a structure in a temperature range between the resin material's minimum molding temperature and maximum molding tempeature+100° C.; measuring the structure's porosity Rn at 12 locations by image analysis; and dividing the variance of porosity Rn by the average porosity Rn. The minimum and maximum molding temperatures are the lowest and highest heater temperatures at which the resin material can be molded at a pressure of 3500 psi by injection molding, respectively.

Abstract: A thermal spray slurry of the present invention contains ceramic particles having an average particle size of 200 nm or more and 5 ?m or less. Precipitates formed when 700 mL of the thermal spray slurry is placed in a 16.5-cm-high cylindrical vessel having a volume of 1 L and is allowed to stand still at room temperature for 1 week are made to disappear by disposing, at a temperature of 20° C. or higher and 30° C. or lower, the cylindrical vessel so as for the central axis of the cylindrical vessel to be horizontal and by rotating the cylindrical vessel at a rotation speed of 100 rpm for 120 minutes around the central axis of the cylindrical vessel to stir the thermal spray slurry in the cylindrical vessel.

Abstract: To provide a slurry for thermal spraying. In the slurry, even when spray particles precipitate, the precipitates easily disappear. The present invention provides a slurry for thermal spraying including spray particles and a dispersion medium. The spray particles have an average circularity in a plan view of 0.85 or less. The spray particles preferably have an average circularity of 0.6 or more. The spray particles may include yttrium fluoride and an yttrium oxyfluoride.

Abstract: A thermal spray slurry of the present invention contains ceramic particles in a content of 10% by mass or more and 85% by mass or less, and has a viscosity of 3,000 mPa·s or less. The ceramic particles have an average particle size of, for example, 1 nm or more and 5 ?m or less. The thermal spray slurry may further contain a dispersant. The thermal spray slurry may further contain a viscosity modifier. The thermal spray slurry may further contain a flocculant.

Abstract: A thermal spray powder of the present invention contains ceramic particles having an average particle size of 1 ?m or more and 20 ?m or less. The ceramic particles have a flowability index value FT of 3 or more measured by using a powder rheometer. The flowability index value FF is determined by measuring the maximum principal stress and the uniaxial collapse stress of the ceramic particles at normal temperature and normal humidity when 9 kPa of shear force is applied to the ceramic particles, and by dividing the measured maximum principal stress by the measured uniaxial collapse stress.

Abstract: Provided is a material for molding, without a mold, a highly uniform structure comprising a resin and a non-resin such as metals and ceramic. The molding material provided by this invention is formed of a powder comprising a resin and at least one species of non-resin selected among metals and ceramic. The resin material has a uniformity index N below 0.2. N is determined by depositting the powder in a softened or melted state to form a structure in a temperature range between the resin material's minimum molding temperature and maximum molding tempeature+100° C.; measuring the structure's porosity Rn at 12 locations by image analysis; and dividing the variance of porosity Rn by the average porosity Rn. The minimum and maximum molding temperatures are the lowest and highest heater temperatures at which the resin material can be molded at a pressure of 3500 psi by injection molding, respectively.

Abstract: Provided is a thermal spray slurry capable of satisfactorily forming a thermal spray coating with superior plasma erosion resistance. The invention provides a thermal spray slurry comprising thermal spray particles and a dispersion medium. The thermal spray particles comprise a compound containing yttrium (Y) and a halogen element (X) as constituent elements, and be present in an amount of 10% by mass or more and 70% by mass or less. The viscosity of the thermal spray slurry is 300 mPa·s or less.

Abstract: To provide a slurry for thermal spraying. In the slurry, even when spray particles precipitate, the precipitates easily disappear. The present invention provides a slurry for thermal spraying including spray particles and a dispersion medium. The spray particles have an average circularity in a plan view of 0.85 or less. The spray particles preferably have an average circularity of 0.6 or more. The spray particles may include yttrium fluoride and an yttrium oxyfluoride.

Abstract: A thermal spray powder, which includes granulated and sintered cermet particles that contain a metal having an indentation hardness of 500 to 5,000 N/mm2, is disclosed. The granulated and sintered cermet particles have an average size of 30 ?m or less. The granulated and sintered cermet particles are composed of primary particles having an average size of 6 ?m or less. The granulated and sintered cermet particles have a compressive strength of from 100 to 600 MPa. It is preferable that the metal contained in the granulated and sintered cermet particles includes at least one selected from the group consisting of cobalt, nickel, iron, aluminum, copper, and silver. The thermal spray powder is usable in a low-temperature thermal spraying process such as cold spraying using nitrogen as a working gas.

Abstract: Disclosed is a thermal spray powder of granulated and sintered cermet particles, which contains tungsten carbide or chromium carbide, and a silicon-containing iron-based alloy. The content of the alloy in the thermal spray powder is preferably 5 to 40% by mass. In this case, the alloy contains silicon in a content of 0.1 to 10% by mass.

Abstract: A thermal spray slurry of the present invention contains ceramic particles having an average particle size of 200 nm or more and 5 ?m or less. Precipitates formed when 700 mL of the thermal spray slurry is placed in a 16.5-cm-high cylindrical vessel having a volume of 1 L and is allowed to stand still at room temperature for 1 week are made to disappear by disposing, at a temperature of 20° C. or higher and 30° C. or lower, the cylindrical vessel so as for the central axis of the cylindrical vessel to be horizontal and by rotating the cylindrical vessel at a rotation speed of 100 rpm for 120 minutes around the central axis of the cylindrical vessel to stir the thermal spray slurry in the cylindrical vessel.

Abstract: A thermal spray slurry of the present invention contains ceramic particles in a content of 10% by mass or more and 85% by mass or less, and has a viscosity of 3,000 mPa·s or less. The ceramic particles have an average particle size of, for example, 1 nm or more and 5 ?m or less. The thermal spray slurry may further contain a dispersant. The thermal spray slurry may further contain a viscosity modifier. The thermal spray slurry may further contain a flocculant.

Abstract: A thermal spray powder of the present invention contains ceramic particles having an average particle size of 1 ?m or more and 20 ?m or less. The ceramic particles have a flowability index value FT of 3 or more measured by using a powder rheometer. The flowability index value FF is determined by measuring the maximum principal stress and the uniaxial collapse stress of the ceramic particles at normal temperature and normal humidity when 9 kPa of shear force is applied to the ceramic particles, and by dividing the measured maximum principal stress by the measured uniaxial collapse stress.

Abstract: A powder material of the present invention contains ceramic-metal composite particles, wherein at least a part of the composite particles exhibit no breaking point in a stress-strain diagram obtained by applying a compressive load that increases up to a maximum value of 10 mN or more at a loading rate of 15.0 mN/s or less.