Abstract: A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

Abstract: A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

Abstract: A lubrication system for a direct injected V-type two-cycle engine is disclosed having a lubricant pump adapted to discharge lubricant into each crankcase chamber of the engine through ports positioned adjacent the downstream side of reed valves of the air intake system. Ports supplying lubricant to cylinders in the right cylinder bank of the engine extend through a left wall of the corresponding crankcase chamber. Ports supplying lubricant to cylinders in the left cylinder bank of the engine extend through a right wall of the corresponding crankcase chamber. During engine assembly, the lubricant pump is manually driven before it is mechanically installed so as to fill the attached supply hoses with lubricant. The pump delivers lubricant to each crankcase chamber at a rate high enough to avoid lubricant carbonization at engine idle and low enough to avoid lubricant resistance to crankshaft rotation, which may make the engine difficult to start.

Abstract: A piston ring comprises a plurality of recesses that are formed in its outer peripheral edge. The recesses have any of a number of profiles such as semicircular, chordal, arcuate, and triangular. The piston ring controls the passage of lubricant between a region defined between the piston ring and an upper compression sealing ring. The recesses can be positioned to pass over an exhaust port formed in a cylinder wall or to pass over other regions of the cylinder wall. By passing over the exhaust port, the piston ring better accommodates fluctuations in dimensions that are induced by temperature changes by passing over other regions of the cylinder wall, the piston ring enhances the distribution of lubricant, especially in cylinders having a generally horizontal or inclined center axis.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: A lubrication system for a direct injected two-cycle engine is disclosed having a lubricant pump adapted to discharge lubricant into each crankcase chamber of the engine through a port positioned immediately adjacent the downstream side of reed valves of the air intake system. The lubricant is injected in a direction generally coincident with the rotational direction of the crankshaft. Drain ports are positioned in the lowermost scavenge passage of each cylinder and communicate lubricant from the scavenge passage to a return port formed through the wall of a crankcase chamber.

Abstract: A piston and piston ring assembly has a compression ring and a lubrication control ring. The compression ring substantially seals a combustion chamber from a crankcase chamber. The lubrication control ring is configured with a reverse-taper end surface and a wiping edge. The reverse-taper end surface allows the lubrication control ring to leave a thin lubricant coat on a cylinder wall during a piston downstroke. The wiping edge pulls lubricant upward toward the compression ring during a piston upstroke. The combination of the elements and the elements on their own result in enhanced lubrication of the compression ring and thereby increase the life of the piston ring and reduce the wear on the ring and the cylinder bore.

Abstract: A piston and piston ring assembly has a compression ring and a compression ring groove configured to allow proper mating between the two following thermal expansion. The groove is provided with a substantially horizontal lower face. The ring has a bottom surface that is contoured to provide a cross-sectional angle that substantially matches the anticipated deflection of the lower face caused by thermal expansion. Thus, when the piston expands due to temperature changes associated with operating the internal combustion engine, the lower face deflects away from the combustion chamber. The deflection is absorbed by the pre-contoured bottom surface of the ring. Thus, localized high points between the piston ring and the piston ring groove are reduced and the friction originating at such locations is also reduced. Accordingly, the ring and the groove experience reduced friction and reduced wear while the sealing function of the compression ring is enhanced.

Abstract: A lubricating system for a reciprocating machine such as a two cycle internal combustion engine having the cylinder bores horizontally disposed. A drain system is provided for draining lubricant from the lowermost crankcase chambers to the upper cylinders so as to maintain uniformity of lubrication and insure even and smooth running. A check valve is provided for precluding reverse flow and the lubricant is delivered both to the crankcase chambers and to the piston through either the piston and/or cylinder liner. The lubricant supplied to the piston is supplied at its upper area so as to insure complete lubrication of its circumference and of the associated cylinder bore.

Abstract: A fuel supply system for a two cycle crankcase compression internal combustion engine embodying direct cylinder injection and carburetors for supplying a fuel air mixture to the crankcase chambers of the engine for high speed cooling. The direct fuel injectors supply the fuel at the low speed operation and a fixed amount of fuel at mid range and high speed, while the carburetor supplies only the mid range and high speed requirements of the engine in combination with the fuel injectors. Fuel is supplied first to the fuel bowls of the carburetors which have a vapor vent and then from the fuel bowls to the fuel injectors so as to avoid the necessity of a separate vapor separator for the fuel injectors.

Abstract: Two embodiments of piston constructions for two-cycle, crankcase compression, internal combustion engines wherein the piston is formed with a blow by passage so that blow by gases escaping past the piston rings will not pass across the skirt portion of the piston to deteriorate the lubricant thereon. In one embodiment, holes formed in the piston permit the blow by gases to flow into the interior of the piston and in another embodiment, the piston pin boss is formed with a relief that permits the blow by gases to exit through one of the scavenge passages.

Abstract: Several embodiments of combined torsional and elastic couplings for transmitting power from an engine output shaft that experiences torque fluctuations and a driveshaft. In each embodiment, the flexible coupling includes an inertial member that is coupled either elastically or by means of a viscous body to the engine output shaft for absorbing the torsional vibrations. In addition, an elastic coupling couples the engine output shaft to the driveshaft for permitting limited relative rotation to absorb torque flux variations in the engine output shaft.

Abstract: An arrangement for purging the cooling jacket of a marine engine from coolant when the engine is stopped. The system comprises an electrically operated pump that is operated for a predetermined period of time once the engine is shut off so as to purge the cooling jacket.

Abstract: A wire bonder is frequently used for assembling the electronic parts of a semiconductor device or the like and exhibits an effect in the electric connections of the aforementioned electronic parts with a fine metal wire. The wire bonder according to the present invention comprises a clamper for clamping a bonding wire, and bonding wire disconnection detecting means for detecting the disconnection of the bonding wire in terms of the wire clamping state of the clamper. In order to detect highly accurately and reliably the disconnection of the bonding wire, the aforementioned bonding wire disconnection detecting means is characterized by the provision of a detecting unit for detecting a quantity which corresponds to the facing gap of the clamper during the clamping operation.