Abstract: A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

Abstract: A cut and clinch unit is provided with pair of slide bodies, and each slide body is configured from movable section and fixed section that slidably holds the movable section. An insertion hole is formed in the movable section. A pair of leads of a leaded component are inserted into the insertion holes of a pair of slide bodies, and the pair of leads are bent into an N shape by each movable section being slid. The cut and clinch unit is movable in the XY directions by operation of a moving device. Also, the distance between the pair of slide bodies can be changed freely. Accordingly, it is possible to mount leads at any position on a board in a state bent into an N shape, and to mount leaded components with various different lead separation distances on a board in a state bent into an N shape.

Abstract: A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

Abstract: A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.

Abstract: In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.

Abstract: In a cut and clinch device, movable section 122 is slidable with respect to main body section 120. Also, a first insertion hole is formed in main body section 210, and a second insertion hole 136 is formed in curved section 133 of movable section 122 in a state overlapping the first insertion hole. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. In such a cut and clinch device, a pair of recognition marks 210 are provided on a bent section opposite each other centered around the second insertion hole. Thus, the recognition marks are imaged, and based on the image data, it is possible to appropriately recognize the opening position of the second insertion hole, to appropriately insert the lead into the second insertion hole, and to appropriately cut the lead.

Abstract: A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

Abstract: A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

Abstract: A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

Abstract: The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

Abstract: A cut and clinch device includes a movable section slidable with respect to a main body section. A first insertion hole is formed in main body section, and a second insertion hole is formed in the movable section. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. A recognition mark is provided on the movable section and the main body section, and the types of the movable section and the main body section are recognized based on image data of the recognition marks. By this, it is possible to appropriately check the type of the portion that cuts a lead.

Abstract: A cut and clinch unit is provided with pair of slide bodies, and each slide body is configured from movable section and fixed section that slidably holds the movable section. An insertion hole is formed in the movable section. A pair of leads of a leaded component are inserted into the insertion holes of a pair of slide bodies, and the pair of leads are bent into an N shape by each movable section being slid. The cut and clinch unit is movable in the XY directions by operation of a moving device. Also, the distance between the pair of slide bodies can be changed freely. Accordingly, it is possible to mount leads at any position on a board in a state bent into an N shape, and to mount leaded components with various different lead separation distances on a board in a state bent into an N shape.

Abstract: In a cut and clinch device, movable section 122 is slidable with respect to main body section 120. Also, a first insertion hole is formed in main body section 210, and a second insertion hole 136 is formed in curved section 133 of movable section 122 in a state overlapping the first insertion hole. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. In such a cut and clinch device, a pair of recognition marks 210 are provided on a bent section opposite each other centered around the second insertion hole. Thus, the recognition marks are imaged, and based on the image data, it is possible to appropriately recognize the opening position of the second insertion hole, to appropriately insert the lead into the second insertion hole, and to appropriately cut the lead.

Abstract: In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.

Abstract: A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

Abstract: In a cut and clinch device, movable section 122 is slidable with respect to main body section 120. The main body section is configured from main body first section 147, and main body second section 148 that is removably attached to the main body first section, and a first insertion hole is formed in the main body second section. The movable section is configured from movable first section 144, and movable second section 146 that is removably attached to the movable first section, and second insertion hole 136 is formed in the movable second section. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. In a device configured as such, recognition mark 230 is provided on the movable second section and the main body second section, and the types of the movable second section and the main body second section are recognized based on image data of the recognition marks.

Abstract: A work machine including a flow device for flowing molten solder from under a circuit board, and a backup pin for supporting the circuit board from below while a lead of a leaded component is being inserted into a through-hole, which are moved separately under the circuit board. Thus, when the circuit board needs to be supported, the backup pin can be moved to any position, and when solder needs to be applied, the backup pin can be moved to a position that does not obstruct operation of the flow device. Accordingly, as well as guaranteeing operation of the flow device, it is possible to support the circuit board with the backup pin as required, thus improving practicality of the work machine.

Abstract: Whether or not a lead wire has been normally cut and clinched can be reliably detected. A contact pipe is arranged in lead wire insertion holes of a pair of fixed pawls in a state of being electrically insulated from the fixed pawls. In a case where the lead wire is shorter than a set length after the lead wire is inserted into the lead wire insertion holes, a clearance of the pair of lead wire insertion holes is widened by a set amount in the event of outward bending of the lead wire and is narrowed by a set amount in the event of inward bending. A cut-and-clinch operation is performed with S4 bypassed in a case where the length of the lead wire is at least the set length.

Abstract: The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

Abstract: Whether or not a lead wire has been normally cut and clinched can be reliably detected. A contact pipe is arranged in lead wire insertion holes of a pair of fixed pawls in a state of being electrically insulated from the fixed pawls. In a case where the lead wire is shorter than a set length after the lead wire is inserted into the lead wire insertion holes, a clearance of the pair of lead wire insertion holes is widened by a set amount in the event of outward bending of the lead wire and is narrowed by a set amount in the event of inward bending. A cut-and-clinch operation is performed with S4 bypassed in a case where the length of the lead wire is at least the set length.