Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.

Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.

Abstract: Defects of substrates are inspected when executing a job in which a treatment recipe for substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates. An imaging step successively images substrates. A first determination step decomposes, in order from the substrate as head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into pixel value distribution components using a Zernike polynomial, calculates Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determines presence or absence of a defect based on the calculated Zernike coefficients. A second determination step determines, from predetermined timing after one or more substrates is determined to have no defect at the first determination step, presence or absence of a defect based on the substrate image determined to have no defect at the first determination step.

Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a plurality of films is formed, and an inspection recipe; and an edge detector configured to detect a target edge as an edge of an inspection target film among the films on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage. Each of edges of the films extends along the periphery of the substrate. The inspection recipe is configured by combining parameters each of which has one option specified among a plurality of options.

Abstract: A substrate processing apparatus includes a holder configured to hold a combined substrate in which a first substrate and a second substrate are bonded to each other; a first detector configured to detect an outer end portion of the first substrate; a second detector configured to detect a boundary between a bonding region where the first substrate and a second substrate are bonded and a non-bonding region located at an outside of the bonding region; a periphery removing device configured to remove a peripheral portion of the first substrate as a removing target from the combined substrate held by the holder.

Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.

Abstract: A substrate inspection method includes: acquiring a feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the feature amount.

Abstract: A substrate processing system includes a pre-alignment apparatus having a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus having a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. The pre-alignment apparatus is disposed above the laser processing apparatus.

Abstract: A method for inspecting defects of substrates when executing a job in which a treatment recipe for the substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates, includes: an imaging step of successively imaging the substrates; a first determination step of decomposing, in order from the substrate being a head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into a plurality of pixel value distribution components using a Zernike polynomial, calculating Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determining presence or absence of a defect of the substrate based on the calculated Zernike coefficients; and a second determination step of determining, from predetermined timing after at least one substrate is determined to have no defect at the first determination step, presence or absence of a defect of the substrate being a determinat

Abstract: A laser processing device configured to form an irradiation point of a laser beam for processing a substrate on a main surface of the substrate held on a substrate holder and configured to form processing traces by moving the radiation point on dividing target lines of the substrate includes a processing unit configured to repeat, while switching the dividing target lines, moving the substrate holder in a first axis direction to move the irradiation point on the dividing target lines and configured to rotate the substrate holder around a third axis during the moving of the substrate holder to change a direction of the substrate held on the substrate holder by 180°.

Abstract: A laser processing device includes a height measurement unit configured to measure a vertical direction position of an irradiation point of a processing laser beam on an upper surface of a substrate; and a controller configured to control a vertical direction position of a light condensing unit based on the vertical direction position of the irradiation point while moving the irradiation point along multiple dividing target lines. The height measurement unit includes a coaxial laser displacement meter and a separate-axis laser displacement meter. The controller controls the vertical direction position of the light condensing unit by using only one of the coaxial or the separate-axis laser displacement meter for each of the multiple dividing target lines while the substrate is processed and performs a switchover of a laser displacement meter for controlling the vertical direction position of the light condensing unit between the coaxial and the separate-axis laser displacement meters.

Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a plurality of films is formed, and an inspection recipe; and an edge detector configured to detect a target edge as an edge of an inspection target film among the films on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage. Each of edges of the films extends along the periphery of the substrate. The inspection recipe is configured by combining parameters each of which has one option specified among a plurality of options.

Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.

Abstract: A substrate inspection method includes: acquiring a feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the feature amount.

Abstract: In one embodiment, a substrate inspection apparatus performs, in its maintenance mode, operations including: guiding a light emitted from an illuminating unit to an imaging device via a light-guiding member disposed in a casing; judging whether or not a level of a brightness signal obtained by the imaging device falls within a predetermined allowable range when a light emitted from the illuminating unit falls on the imaging device via the light-guiding member; and alarming, if it is judged that the value of the brightness signal is out of the predetermined allowable range, that replacement of the illuminating unit is required.

Abstract: An image creation method of creating a filter image for removing a pseudo defect to inspect presence/absence of a defect on a substrate includes a filter image creation step of creating the filter image by replacing a picture element value of any one of picture elements located on a circumference of a circle about a center position of a registered image with a maximum value of picture element values of a plurality of picture elements selected from among the picture elements located on the circumference.

Abstract: A method of removing a coating film of a substrate peripheral portion, is provided with holding and supporting a circular substrate by allowing a transfer body to transfer a rear surface of the substrate to a supporting part; removing a coating film in the shape of a ring by a predetermined width size by supplying a solvent from a solvent nozzle to a peripheral portion of the coating film formed on the surface of the substrate; transferring the substrate to an inspection module for inspecting a state of the coating film by imaging the entire surface of the substrate; detecting a removal region of the coating film based on image data acquired by the inspection module; and correcting a delivery position of a succeeding substrate with respect to the supporting part by the transfer body based on the detection result of the removal region of the coating film.

Abstract: In one embodiment, a substrate inspection apparatus performs, in its maintenance mode, operations including: guiding a light emitted from an illuminating unit to an imaging device via a light-guiding member disposed in a casing; judging whether or not a level of a brightness signal obtained by the imaging device falls within a predetermined allowable range when a light emitted from the illuminating unit falls on the imaging device via the light-guiding member; and alarming, if it is judged that the value of the brightness signal is out of the predetermined allowable range, that replacement of the illuminating unit is required.

Abstract: An image creation method of creating a filter image for removing a pseudo defect to inspect presence/absence of a defect on a substrate includes a filter image creation step of creating the filter image by replacing a picture element value of any one of picture elements located on a circumference of a circle about a center position of a registered image with a maximum value of picture element values of a plurality of picture elements selected from among the picture elements located on the circumference.

Abstract: A substrate inspection method capable of accurately inspecting a substrate is provided. A jig having reference points represented by known coordinates in a three-dimensional world coordinate system is photographed by a camera and coordinates of the reference points in a pixel image coordinate system defined by pixels of an image forming device is determined. The coordinates in the pixel image coordinate system are transformed into those in a camera coordinate system set on the camera, and world-camera coordinate system transformation parameters are calculated. Image data in the pixel image coordinate system obtained by photographing a substrate to be inspected is transformed into image data in a world coordinate system for inspection. The accurate inspection of the substrate to be inspected can be achieved because distortion in the image of the substrate to be inspected in the world coordinate system attributable to the position and attitude of the camera is reduced.