Patents by Inventor KAZUYA SUWA

KAZUYA SUWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220025123
    Abstract: A condensation-curable resin composition which contains: (A) an organosilicon compound containing a structural unit (i) represented by the following formula (i) and a structural unit (ii) represented by the following formula (ii), having a SiOH group at both ends of the molecular chain, and having a weight average molecular weight of 10,000 or more and 10,000,000 or less; and (B) an organometallic compound having three or more condensation-reactive groups. In formula (i), each R1 is independently a hydrocarbon group having 1 to 8 carbon atoms. In formula (ii), each R2 is independently a hydrocarbon group having 1 to 8 carbon atoms.
    Type: Application
    Filed: November 22, 2019
    Publication date: January 27, 2022
    Applicant: JNC CORPORATION
    Inventors: Hironori IKENO, Kazuya SUWA, Keisuke NISHIZAWA, Ayaka KIYA, Kiichi KAWABATA
  • Publication number: 20210301087
    Abstract: A cationically polymerizable composition that provides a cured product and having an excellent balance of adhesion to various substrates, particularly, a silver substrate, and excellent handling properties. A cationically polymerizable composition including a double-decker type silsesquioxane compound having at least one alicyclic epoxy group in one molecule (A), a cationically polymerizable compound (B), a compound having a vinyl group and a cationically polymerizable cyclic ether (C), and a chelate-modified epoxy compound (D).
    Type: Application
    Filed: March 29, 2021
    Publication date: September 30, 2021
    Applicant: JNC CORPORATION
    Inventor: Kazuya SUWA
  • Publication number: 20210238419
    Abstract: To provide a siloxane polymer containing a silsesquioxane unit and a chain siloxane unit in the main chain and having a reactive group. A siloxane polymer containing a repeating unit represented by Formula (1): R0's independently represent C6-20 aryl or C5-6 cycloalkyl; R1 independently represent a hydrogen atom, C6-20 aryl, C5-6 cycloalkyl, C7-40 arylalkyl, or C1-40 alkyl; R2, R4, and R6 independently represent C6-20 aryl, C5-6 cycloalkyl, C7-40 arylalkyl, or C1-40 alkyl; R3 represents a monovalent group having a reactive group; R5's independently represent C6-20 aryl, C5-6 cycloalkyl, C7-40 arylalkyl, C1-40 alkyl, or C1-20 alkoxy; y1, y2, and z are an integer of 0 to 30; g? is 0 or 1; and, in the case of y1=y2=z=0, at least one terminal is the group represented by Formula (2).
    Type: Application
    Filed: January 27, 2021
    Publication date: August 5, 2021
    Applicant: JNC CORPORATION
    Inventor: Kazuya SUWA
  • Publication number: 20190375896
    Abstract: Provided is a new compound which can provide a cured film obtained from a resin composition with low cure shrinkage while suppressing reduction of hardness (scratch resistance) thereof. A silsesquioxane derivative having a radically polymerizable functional group, which is represented by formula (1), (2) or (3). In the formulas (1) to (3), R1 is a group independently selected from alkyl having 1 to 45 carbons, cycloalkyl having 4 to 8 carbons, aryl having 6 to 14 carbons and arylalkyl having 7 to 24 carbons, R2 and R3 are a group independently selected from alkyl having 1 to 10 carbons, cyclopentyl, cyclohexyl and phenyl, and X is independently hydrogen or a monovalent organic group, in which at least one of X is a radically polymerizable functional group represented by formula (4).
    Type: Application
    Filed: January 9, 2018
    Publication date: December 12, 2019
    Inventors: Kazuya SUWA, Hironori IKENO, Tomoyuki OOBA
  • Publication number: 20190185711
    Abstract: An epoxy resin composition which is suppressed in curing shrinkage upon being cured to obtain a cured film having low warpage and high adhesion. The epoxy resin composition contains epoxy resin (A), compound (B) represented by formula (1) and nanosilica filler (C). In formula (1), R1 and R2 are independently an alkyl group having 1 to 10 carbons or a phenyl group, and X is independently hydrogen or a monovalent organic group, and in one molecule of the compound, at least one of X includes an epoxy group.
    Type: Application
    Filed: August 26, 2016
    Publication date: June 20, 2019
    Applicants: JNC CORPORATION, JNC PETROCHEMICAL CORPORATION
    Inventors: Kazuya SUWA, Masaru EGUCHI, Hironori IKENO, Tomoyuki OBA
  • Patent number: 9453105
    Abstract: A silicon compound is described, being obtained by a hydrosilylation reaction of the following compound (a), compound (b) and compound (c). Compound (a) is a silsesquioxane derivative having two or more SiH in one molecule. Compound (b) is a compound having, in one molecule, epoxy and/or oxetanyl and an alkenyl having a carbon number of 2 to 18. Compound (c) is a compound having, in one molecule, an alkoxysilyl and an alkenyl having a carbon number of 2 to 18.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: September 27, 2016
    Assignee: JNC CORPORATION
    Inventors: Kazuya Suwa, Ryota Mineo, Tomoyuki Ooba
  • Publication number: 20150368397
    Abstract: A silicon compound is described, being obtained by a hydrosilylation reaction of the following compound (a), compound (b) and compound (c). Compound (a) is a silsesquioxane derivative having two or more SiH in one molecule. Compound (b) is a compound having, in one molecule, epoxy and/or oxetanyl and an alkenyl having a carbon number of 2 to 18. Compound (c) is a compound having, in one molecule, an alkoxysilyl and an alkenyl having a carbon number of 2 to 18.
    Type: Application
    Filed: September 17, 2013
    Publication date: December 24, 2015
    Inventors: KAZUYA SUWA, RYOTA MINEO, TOMOYUKI OOBA