Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A manufacturing apparatus for an optical waveguide structure including a clad structure having grooves in a curved surface thereof and a clad film attached to the curved surface includes a clad film shape retaining portion that has a curved surface along which the clad film is held. a position checking portion that checks the position of the clad film on the clad film shape retaining portion, and a first position adjusting portion that adjusts the position of the clad film shape retaining portion so that the clad film on the clad film shape retaining portion is disposed at a reference position while checking the position of the clad film with the position checking portion.

Abstract: An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.

Abstract: A manufacturing apparatus for an optical waveguide structure including a clad structure having grooves in a curved surface thereof and a clad film attached to the curved surface includes a clad film shape retaining portion that has a curved surface along which the clad film is held. a position checking portion that checks the position of the clad film on the clad film shape retaining portion, and a first position adjusting portion that adjusts the position of the clad film shape retaining portion so that the clad film on the clad film shape retaining portion is disposed at a reference position while checking the position of the clad film with the position checking portion.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

Abstract: A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.

Abstract: A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath.

Abstract: An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Abstract: A pressure-heating apparatus includes: a stage configured to place an object to be pressure-heated thereon; a pressure-heating head arranged to oppose to the stage; and a pressure drive mechanism configured to movably support the pressure-heating head relative to said stage. The pressure-heating head includes: a plurality of pressure-heating tools; a holder configured to independently accommodate each of the pressure-heating tools; a single heater block configured to contact with ends of the pressure-heating tools to transmit a heat; and a plurality of supporters configured to independently and movably support the pressure-heating tools relative to the holder, respectively.

Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

Abstract: A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting unit 12; an electronic part supplying step supplying the electronic part 11 to the mounting unit 12; a mounting step mounting the electronic part 11 to the substrate by the mounting unit 12; and a substrate return transporting step transporting the substrate 10 to a substrate discharge position on which the electronic part has been mounted in the mounting step, wherein in the substrate feed transporting step, a carrier 100 is heated during a period when transported over a predetermined distance from the substrate transport start position; and the substrate feed transporting step, the mounting step, and the substrate return transporting step are performed while the substrate 10 is held by the carrier 100 heated during the predetermined distance.

Abstract: A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.

Abstract: An apparatus 1 for mounting an electronic part to a substrate according to the present invention includes: a mounting unit 12 for mounting an electronic part 11 to a substrate 10; a substrate supplying unit 17 for supplying the substrate 10 to a predetermined position; an electronic part supplying unit 14 for supplying the electronic part 11 to the unit 12; a substrate return transporting unit 32 for transporting the substrate 10, on which the electronic part 11 has been mounted by the unit 12, to a predetermined position; a carrier 100 which detachably holds the substrate supplied from the unit 17 and has a heat capacity of a predetermined value or higher; and a carrier heating and moving unit 101 for moving the carrier 100 from a substrate transport start position 13a of a substrate feed transporting unit 13 to a predetermined position while heating the carrier 100.