Patents by Inventor Kazuyuki Kiuchi

Kazuyuki Kiuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170335145
    Abstract: A double-sided pressure-sensitive adhesive tape includes a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer in the stated order, in which the second pressure-sensitive adhesive layer has a pressure-sensitive adhesive strength with respect to a SUS304 steel plate, which is larger than a pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate, in which the pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate is from 0.5 N/20 mm to 5 N/20 mm, and in which the pressure-sensitive adhesive strength of the second pressure-sensitive adhesive layer with respect to the SUS304 steel plate and the pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate have a difference of from 3 N/20 mm to 20 N/20 mm.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 23, 2017
    Inventors: NURUL JANNA BINTI ABDULLAH, NOR FARAH AIN BINTI MOHAMAD NAZRI, KAZUYUKI KIUCHI, TSUNAKI KITAHARA
  • Publication number: 20130273716
    Abstract: In a step of performing dicing by sticking a protective tape for protecting a wafer surface, in order to obtain a dicing method which ensures that there is no paste residue on a chip side face and that the protective tape is prevented from peeling from the wafer during the dicing and which is excellent in productivity, in a step of performing dicing by sticking a surface protective adhesive tape having an energy ray-curable adhesive layer on one surface of a substrate, thereby performing surface protection for the surface of the semiconductor wafer where an integrated circuit is to be formed, the energy ray-curable adhesive layer is cured by radiating energy rays beforehand to an inner circumferential portion of the wafer, and dicing is performed, with the energy ray-curable adhesive layer kept in an uncured condition by ensuring that energy rays are not radiated to an outer peripheral portion.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 17, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: Kazuyuki KIUCHI
  • Publication number: 20130240141
    Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 19, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuki SOEJIMA, Shinji HOSHINO, Takamasa HIRAYAMA, Kazuyuki KIUCHI
  • Patent number: 8502397
    Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: August 6, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yuichiro Yanagi, Kazuyuki Kiuchi, Shinji Hoshino
  • Patent number: 8436481
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Shinji Hoshino, Yukio Arimitsu, Kazuyuki Kiuchi, Akihisa Murata
  • Patent number: 8337656
    Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: December 25, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Akinori Nishio, Kazuyuki Kiuchi
  • Publication number: 20120270036
    Abstract: To provide a pressure-sensitive adhesive tape for an electrochemical device that has an extremely low water content, that is unlikely to lead to “adhesive protrusion”, and that is not removed even when it is in contact with an electrolytic solution. The pressure-sensitive adhesive tape for an electrochemical device of the present invention includes a pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive on at least one side of a plastic base, and is characterized by including the pressure-sensitive adhesive layer having a gel content of 60% or more and a thickness of 1 to 15 ?m, and by having a water absorption rate of 0.2% or less after immersion in water at 23° C. for 24 hours.
    Type: Application
    Filed: October 6, 2011
    Publication date: October 25, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki KIUCHI, Hiroomi HANAI, Shigeki KAWABE, Michirou KAWANISHI
  • Publication number: 20120205030
    Abstract: A spontaneously rolling adhesive sheet that can spontaneously roll from one end in one direction, or two opposed ends towards the center as a result of thermal stimulus to thereby form one or two cylindrical rolled bodies includes: a spontaneously rolling laminated sheet configured by lamination in the order of a shrinkable film layer which has a principal shrinking characteristic in one predetermined axial direction, a bonding adhesive layer and a rigid film layer, an adhesive layer laminated onto the rigid film layer side of the spontaneously rolling laminated sheet, and an organic coating layer disposed between the rigid film layer and the adhesive layer.
    Type: Application
    Filed: February 9, 2012
    Publication date: August 16, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki KIUCHI, Akinori NISHIO
  • Publication number: 20110237050
    Abstract: The present invention provides a method which includes sticking a surface protection sheet for dicing onto a surface of a wafer and cutting the sheet together with the wafer to protect the surface of the wafer from being contaminated by deposition of a dust such as swarf and the like, and picking up a chip without causing cracking or chipping in the chip after a dicing step, in the steps of dicing the wafer and then picking up the chip. The method includes: sticking the surface protection sheet for dicing onto the surface of the wafer; cutting the sheet together with the wafer; subsequently giving a stimulus to the surface protection sheet for dicing to peel the end of the chip from the dicing tape; and then picking up the chip.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 29, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Akinori NISHIO, Kazuyuki KIUCHI
  • Publication number: 20110220268
    Abstract: The present invention aims to provide a surface protection tape for use in a dicing step, which protects a surface of a material to be cut from staining owing to attachment of dust and the like such as shavings by sticking the surface protection tape on the surface of the material to be cut in the dicing step and cutting the tape together with the material to be cut, and which is easily peeled and removed from individual chips after the dicing step.
    Type: Application
    Filed: November 19, 2009
    Publication date: September 15, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori Nishio, Kazuyuki Kiuchi, Tomokazu Takahashi
  • Publication number: 20110200744
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki Kiuchi, Masaaki Sato, Yukio Arimitsu, Daisuke Shimokawa, Tomoko Kishimoto
  • Publication number: 20110195248
    Abstract: The pressure-sensitive adhesive sheet with spontaneously rolling property of the invention is a pressure-sensitive adhesive sheet comprising a contractible film layer, an elastic layer, a rigid film layer, an intermediate layer, and a pressure-sensitive adhesive layer satisfying the following requirements and laminated in this order, which is capable of undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when a stimulus causing a contraction is applied: the elastic layer having a thickness of from 15 to 150 ?m and a shear modulus at 80° C. of from 1×104 Pa to 5×106 Pa, the intermediate layer having a shear modulus at 23° C. of from 1×104 Pa to 4×107 Pa, and the pressure-sensitive adhesive layer having a pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesion reducing treatment (180° peeling, vs.
    Type: Application
    Filed: October 15, 2009
    Publication date: August 11, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Kazuyuki Kiuchi, Akinori Nishio
  • Publication number: 20110151625
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Yukio ARIMITSU, Kazuyuki KIUCHI, Akihisa MURATA
  • Publication number: 20110143552
    Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 16, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuichiro YANAGI, Kazuyuki KIUCHI, Shinji HOSHINO
  • Publication number: 20110117706
    Abstract: A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape.
    Type: Application
    Filed: October 9, 2009
    Publication date: May 19, 2011
    Inventors: Akinori Nishio, Kazuyuki Kiuchi, Masayuki Yamamoto, Naoki Ishii
  • Publication number: 20110067808
    Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C.
    Type: Application
    Filed: May 1, 2009
    Publication date: March 24, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori Nishio, Kazuyuki Kiuchi
  • Patent number: 7910206
    Abstract: The present invention relates to a self-rolling pressure-sensitive adhesive sheet, including a shrinkable film layer; a restriction layer disposed on a side of the shrinkable film layer; and a pressure-sensitive adhesive layer disposed on the side of the restriction layer which is opposite to the side on which the shrinkable film layer is disposed. The self-rolling pressure-sensitive adhesive sheet is a releasable pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesiveness decreasing treatment has a pressure-sensitive adhesive power (180° C. peeling, against a silicon mirror wafer, tensile speed: 300 mm/min) of 6.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: March 22, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Kazuyuki Kiuchi, Akira Shoji, Akinori Nishio, Kunio Nagasaki
  • Publication number: 20110048641
    Abstract: The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by bonding a surface protection tape to the surface of the object to be cut, and cutting the surface protection tape together with the object to be cut in a dicing process and, after the dicing process, easily separating and removing the protection tape from individual chips. To this end, there is provided a method in which a dicing surface protection tape is bonded to a surface of an object to be cut, the tape is cut together with the object to be cut, and then the dicing surface protection tape is removed with the object to be cut inclined.
    Type: Application
    Filed: August 30, 2010
    Publication date: March 3, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Akinori Nishio, Kazuyuki Kiuchi
  • Publication number: 20100279491
    Abstract: The present invention provides a die attach film-provided dicing tape, which includes a dicing tape, a supporting tape and a die attach film laminated in this order, wherein the supporting tape is a tape having a self-rolling peelability, and a process for producing a semiconductor device by using the die attach film-provided dicing tape.
    Type: Application
    Filed: April 29, 2010
    Publication date: November 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki KIUCHI, Akinori NISHIO
  • Publication number: 20100252185
    Abstract: The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 7, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuyuki Kiuchi, Akinori Nishio