Abstract: According to an embodiment of the present invention, a semiconductor memory device includes a substrate, a connector, a controller, a plurality of first capacitors, and a plurality of first memory packages. The connector is disposed at a first side of the substrate. The controller is mounted on a first face of the substrate and is disposed near the connector. The first capacitors are mounted on the first face of the substrate and are disposed along a second side opposing the first side. Each of the first memory packages includes a non-volatile semiconductor memory. The first memory packages are mounted on a second face of the substrate.