Patents by Inventor Kazuyuki Saito

Kazuyuki Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10988092
    Abstract: A vehicular circuit body includes a trunk line that includes a power source line and a communication line, and that is routed in a vehicle body; and a plurality of control boxes that are disposed in a distribution manner along the trunk line. The trunk line includes a first trunk line portion extending in a front-and-rear direction of the vehicle body and a second trunk line portion extending in a leftward-and-rightward direction of the vehicle body. The plurality of control boxes include a branch control box that connects the first trunk line portion and the second trunk line portion, and distributes power from one of the first trunk line portion and the second trunk line portion to the other one.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: April 27, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Masahiro Takamatsu, Koichi Uezono, Kousuke Kinoshita, Atsushi Nakata, Yasuyuki Saito, Kazuyuki Oiwa, Terumitsu Sugimoto, Taku Furuta, Noriaki Sasaki, Yukinari Naganishi, Sadaharu Okuda, Kunihiko Yamada
  • Publication number: 20210007799
    Abstract: A treatment method and medical device for enhancing peristalsis are provided. The treatment method comprises enhancing the peristaltic movement of the gastrointestinal tract by performing a treatment to reduce the activity of the autonomic nerve in a blood vessel V having a surrounding nerve Sa innervating the gastrointestinal tract of the patient.
    Type: Application
    Filed: September 25, 2020
    Publication date: January 14, 2021
    Inventors: Tomoyuki Tajima, Kazuyuki Saito, Shohei Matsuhara, Yoshiki Watanabe
  • Publication number: 20200356314
    Abstract: An image forming apparatus including a detailed print setting UI and a simple print setting UI as print extension applications. The image forming apparatus restricts display of the detailed print setting UI based on whether or not a CPU satisfies a predetermined condition for the display of the detailed print setting UI, and thus enables to display an appropriate print setting UI even when processing capacity of the CPU is low.
    Type: Application
    Filed: May 1, 2020
    Publication date: November 12, 2020
    Inventor: Kazuyuki Saito
  • Patent number: 10737356
    Abstract: A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6: Strength ratio=ultimate strength/0.2% offset yield strength.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: August 11, 2020
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Patent number: 10610976
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: April 7, 2020
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Patent number: 10525555
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: January 7, 2020
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Publication number: 20200004478
    Abstract: An information processing apparatus generates print data by executing a printer driver based on an instruction issued by an application operating in an operating system. The information processing apparatus includes an eliminating unit configured to eliminate conflict or inconsistency of a print setting based on conflict eliminating information for eliminating conflict of a setting to be input to the printer driver under control of an application which processes the print setting, and an input unit configured to input a print setting obtained after conflict is eliminated by the eliminating unit to the printer driver using the application.
    Type: Application
    Filed: June 24, 2019
    Publication date: January 2, 2020
    Inventor: Kazuyuki Saito
  • Publication number: 20190339915
    Abstract: A non-transitory recording medium storing a computer program for an application providing a Graphical User Interface (GUI) causing a computer to perform each step of a control method of the computer, the method including: a reception step of receiving a print ticket including a print setting according to activation of the program for the application by an operating system after a print instruction is given by a user; and a display control step of displaying a screen for authenticated printing based on the received print ticket in which the authenticated printing has been set.
    Type: Application
    Filed: April 12, 2019
    Publication date: November 7, 2019
    Inventors: Kazuyuki Saito, Shinya Suzuki
  • Patent number: 10414002
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: September 17, 2019
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Patent number: 10137534
    Abstract: A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 ?m or more and 1.3 ?m or less.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: November 27, 2018
    Assignees: Nippon Micrometal Corporation, Nippon Steel & Sumikin Materials Co., Ltd.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo Oishi, Kazuyuki Saito, Tomohiro Uno
  • Patent number: 10121758
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer on a surface of the Cu alloy core material, and contains Ga and Ge of 0.011 to 1.2% by mass in total, which is able to increase bonding longevity of the ball bonded part in the high-temperature, high-humidity environment, and thus to improve the bonding reliability. The thickness of the Pd coating layer is preferably 0.015 to 0.150 ?m. When the bonding wire further contains one or more elements of Ni, Ir, and Pt in an amount, for each element, of 0.011 to 1.2% by mass, it is able to improve the reliability of the ball bonded part in a high-temperature environment at 175° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 6, 2018
    Assignees: Nippon Micrometal Corporation, Nippon Steel & Sumikin Materials Co., Ltd.
    Inventors: Daizo Oda, Motoki Eto, Kazuyuki Saito, Teruo Haibara, Ryo Oishi, Takashi Yamada, Tomohiro Uno
  • Patent number: 9995954
    Abstract: A conductive film stuck to a transparent conductive film of a liquid crystal panel is protruded along a display surface and the protruded part is formed as non-adhesive so that the protruded part is not stuck to the members other than the liquid crystal panel. The protruded part contacts with a conductor on the front frame side so as to electrically connect the transparent conductive film of the liquid crystal panel and the front frame. When the liquid crystal panel moves, the conductive film can move in a direction in parallel to the display surface by following the liquid crystal panel, which prevents deterioration of the conductive film. Therefore, no excessive force works on the stuck part between the transparent conductive film and the conductive film. It solves the exfoliation issue of the conductive film, and the transparent conductive film can be electrically connected to the front frame stably.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: June 12, 2018
    Assignee: NLT TECHNOLOGIES, LTD.
    Inventors: Hideki Nishimura, Masato Maki, Kazuyuki Saito
  • Patent number: 9982402
    Abstract: A longitudinal groove forming instrument 11 is provided on a base plate bottom face of a screed 7, 8. The longitudinal groove forming instrument 11 comprises a plurality of beam members 12. The beam members 12 are disposed in parallel with the direction of travel of the screed as the axial direction. A longitudinal groove 20 is formed by the beam members 12 pressing into a leveled face when leveling a pavement face and moving in the direction of travel for leveling while the beam members are being pressed down.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: May 29, 2018
    Assignee: GAEART CO., LTD.
    Inventors: Toshihiko Maeyama, Masanobu Sadayasu, Shinji Oba, Kazuyuki Saito, Katsuji Suzuki
  • Publication number: 20180133843
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Application
    Filed: December 21, 2017
    Publication date: May 17, 2018
    Inventors: Takashi YAMADA, Daizo ODA, Teruo HAIBARA, Ryo OISHI, Kazuyuki SAITO, Tomohiro UNO
  • Publication number: 20180130763
    Abstract: A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6: Strength ratio=ultimate strength/0.2% offset yield strength.
    Type: Application
    Filed: June 14, 2016
    Publication date: May 10, 2018
    Inventors: Takashi YAMADA, Daizo ODA, Teruo HAIBARA, Ryo OISHI, Kazuyuki SAITO, Tomohiro UNO
  • Publication number: 20180122765
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer on a surface of the Cu alloy core material, and contains Ga and Ge of 0.011 to 1.2% by mass in total, which is able to increase bonding longevity of the ball bonded part in the high-temperature, high-humidity environment, and thus to improve the bonding reliability. The thickness of the Pd coating layer is preferably 0.015 to 0.150 ?m. When the bonding wire further contains one or more elements of Ni, Ir, and Pt in an amount, for each element, of 0.011 to 1.2% by mass, it is able to improve the reliability of the ball bonded part in a high-temperature environment at 175° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Application
    Filed: December 22, 2017
    Publication date: May 3, 2018
    Inventors: Daizo ODA, Motoki ETO, Kazuyuki SAITO, Teruo HAIBARA, Ryo OISHI, Takashi YAMADA, Tomohiro UNO
  • Patent number: 9922092
    Abstract: Systems, devices, and methods for contextual management extract context information and content information from a collection of stored digital content items; generate an index of the extracted context information and content information; store the indexed context information and content information; receive a query from a computing device, wherein the query is associated with a user; determine a context of the user; determine a context of a user activity; determine contents of the query; generate a recommendation in response to the query based on the context of the user, the context of the user activity, and the contents of the query; and return the recommendation to the computing device.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: March 20, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventors: Quentin Dietz, Jeremy Serfling, Edward Smith, Ahmad Abiri, Kazuyuki Saito, Craig Mazzagatte, Dariusz T. Dusberger
  • Patent number: 9887172
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer on a surface of the Cu alloy core material, and contains Ga and Ge of 0.011 to 1.2% by mass in total, which is able to increase bonding longevity of the ball bonded part in the high-temperature, high-humidity environment, and thus to improve the bonding reliability. The thickness of the Pd coating layer is preferably 0.015 to 0.150 ?m. When the bonding wire further contains one or more elements of Ni, Ir, and Pt in an amount, for each element, of 0.011 to 1.2% by mass, it is able to improve the reliability of the ball bonded part in a high-temperature environment at 175° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: February 6, 2018
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    Inventors: Daizo Oda, Motoki Eto, Kazuyuki Saito, Teruo Haibara, Ryo Oishi, Takashi Yamada, Tomohiro Uno
  • Publication number: 20170216974
    Abstract: A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof. Containing an element that provides bonding reliability in a high-temperature environment improves the bonding reliability of the ball bonded part in high temperature. Furthermore, making an orientation proportion of a crystal orientation <100> angled at 15 degrees or less to a wire longitudinal direction among crystal orientations in the wire longitudinal direction 30% or more when measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, and making an average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire 0.9 to 1.5 ?m provides a strength ratio of 1.6 or less.
    Type: Application
    Filed: May 19, 2016
    Publication date: August 3, 2017
    Applicants: NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD., NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    Inventors: Takashi YAMADA, Daizo ODA, Teruo HAIBARA, Ryo OISHI, Kazuyuki SAITO, Tomohiro UNO
  • Publication number: 20170200689
    Abstract: A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <100> angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 ?m or more and 1.3 ?m or less.
    Type: Application
    Filed: July 22, 2015
    Publication date: July 13, 2017
    Inventors: Takashi YAMADA, Daizo ODA, Teruo HAIBARA, Ryo OISHI, Kazuyuki SAITO, Tomohiro UNO