Patents by Inventor Kean Seong Hooi

Kean Seong Hooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for reducing stresses applied to bonded interconnects between substrates
    Patent number: 7642136
    Abstract: A method (200) is provided for reducing stresses applied to one or more bonded interconnects (106) of a substrate (103) and a PCB (Printed Circuit Board) (104). The method comprises the steps of coupling (204) a compound (108) on a top surface of the substrate, wherein the compound has the property of expanding when a heat profile is applied thereto, coupling (206) a cover (102) to the PCB that overhangs at least a portion of the compound, and applying (208) the heat profile to the compound and optionally the cover and/or PCB. More than one apparatus implementing the method is also included.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: January 5, 2010
    Assignee: Motorola, Inc.
    Inventor: Kean Seong Hooi
  • METHOD AND APPARATUS FOR REDUCING STRESSES APPLIED TO BONDED INTERCONNECTS BETWEEN SUBSTRATES
    Publication number: 20080119014
    Abstract: A method (200) is provided for reducing stresses applied to one or more bonded interconnects (106) of a substrate (103) and a PCB (Printed Circuit Board) (104). The method comprises the steps of coupling (204) a compound (108) on a top surface of the substrate, wherein the compound has the property of expanding when a heat profile is applied thereto, coupling (206) a cover (102) to the PCB that overhangs at least a portion of the compound, and applying (208) the heat profile to the compound and optionally the cover and/or PCB. More than one apparatus implementing the method is also included.
    Type: Application
    Filed: May 17, 2007
    Publication date: May 22, 2008
    Applicant: MOTOROLA, INC.
    Inventor: KEAN SEONG HOOI
  • Apparatus and method for operating a communication unit using a default channel
    Patent number: 6751461
    Abstract: A method (30) for operating a communication unit on a default channel that is selected from a plurality of communication channels is disclosed. The method (30) includes providing (34) communication on a default channel. The method further includes temporarily switching (36) to a selected second channel for communication and monitoring (38) communication activity on the selected second channel. The method (30) also includes reverting (40) automatically to the default channel when communication activity is undetected for a predetermined time period. An apparatus (2) embodying the above method (30) is also disclosed.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: June 15, 2004
    Assignee: Motorola, Inc.
    Inventors: Chong Meng Lee, Kean Seong Hooi, Ah Kow Mah
  • Surface mountable electronic device
    Patent number: 6324066
    Abstract: A surface mountable electronic device (1) includes a mount (2), an electrical component (3) supported by the mount and two external terminals (5, 5a) electrically coupled to the component, the external terminals being mounted on the mount at diagonally opposite corners. The device is orientation dependent relative to solder pads (6) on a substrate (7) in that the device can be rotated through 90° about a central axis (8) in either direction and still allow alignment between the external terminals of the device and the substrate solder pads.
    Type: Grant
    Filed: July 19, 1999
    Date of Patent: November 27, 2001
    Assignee: Motorola, Inc.
    Inventors: Ban Choong Poh, Kean Seong Hooi, Lay Choo Ch'ng