Patents by Inventor Keat Chuan Ng

Keat Chuan Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200126958
    Abstract: A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Applicant: Bench Walk Lighting LLC
    Inventors: Keat Chuan Ng, Bit Tie Chan, Kheng Leng Tan
  • Patent number: 9882094
    Abstract: A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: January 30, 2018
    Assignee: INTELLECTUAL DISCOVERY CO., LTD.
    Inventors: Keat Chuan Ng, Norfidathul Aizar Abdul Karim, Chiau Jin Lee
  • Patent number: 9474116
    Abstract: An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: October 18, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Choon Guan Ko, Kheng Leng Tan
  • Publication number: 20160163935
    Abstract: A semiconductor device comprising a first conductor, a semiconductor die, a second conductor, an encapsulant, a first body, and a second body is disclosed. The semiconductor die may be coupled to the first conductor and the second conductors. The encapsulant may be encapsulating the semiconductor die and may comprise an illumination surface where light emitted and detected by the semiconductor device substantially passes through. The first and second conductors and the first and second bodies are interconnected by the encapsulant. A portion of the encapsulant other than the illumination surface is exposed by a gap between the first and second bodies so as to absorb stress resulting from temperature-induced movement of the encapsulant.
    Type: Application
    Filed: December 3, 2014
    Publication date: June 9, 2016
    Inventors: Eit Thian Yap, Keat Chuan Ng, Kheng Leng Tan
  • Publication number: 20160126430
    Abstract: In one embodiment, a light-emitting device having a light source die, a substantially transparent encapsulant surrounding the light source die, and a second substantially transparent encapsulant at least partially covering the first substantially transparent encapsulant is disclosed. The second substantially transparent encapsulant may expose a portion of the first substantially transparent encapsulant. The second substantially transparent encapsulant may be less tacky, and may be hardened as compared to the first substantially transparent encapsulant. The second substantially transparent encapsulant may comprise a plurality of encapsulant islands that are distanced away from one another. In another embodiment, the light-emitting device may comprise a third substantially transparent encapsulant covering a portion of the first substantially transparent encapsulant that is exposed by the second substantially transparent encapsulant.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 5, 2016
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Patent number: 9209373
    Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: December 8, 2015
    Assignee: Intellectual Discovery Co., Ltd.
    Inventors: Keat Chuan Ng, Kheng Leng Tan, Chaiu Jin Lee
  • Patent number: 9184149
    Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: November 10, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Patent number: 9147813
    Abstract: A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: September 29, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Bit Tie Chan, Kheng Leng Tan
  • Patent number: 9142528
    Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: September 22, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Publication number: 20150228611
    Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Publication number: 20150228608
    Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Applicant: Avago Technologes General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
  • Publication number: 20150211714
    Abstract: In one embodiment, a light-emitting device having a reflector, an emitter and an encapsulant is disclosed. The encapsulant may have a plurality of optical structures. Each of the plurality of optical structures may be configured to attenuate light transmitting towards a first direction by re-directing towards a second direction. In another embodiment, a flashlight having a roughened area with micro-optics is disclosed. Each of the micro-optics is configured to redirect light transmitting towards a direction forming an angle relative to a longitudinal axis to a point along the longitudinal axis. In yet another embodiment, a lighting-emitting device having roughened area to reduce light along a longitudinal axis is disclosed.
    Type: Application
    Filed: January 24, 2014
    Publication date: July 30, 2015
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd
    Inventors: Keat Chuan Ng, Chin Ewe Phang, Kheng Leng Tan, Boon Keat Tan, Kum Soon Wong
  • Patent number: 9062863
    Abstract: An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: June 23, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Keat Chuan Ng, Kheng Leng Tan, Ju Chin Poh
  • Patent number: 8981408
    Abstract: In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: March 17, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Lig Yi Yong, Keat Chuan Ng, Choon Guan Ko
  • Publication number: 20150028370
    Abstract: In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 29, 2015
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Lig Yi Yong, Keat Chuan Ng, Choon Guan Ko
  • Patent number: 8928219
    Abstract: In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: January 6, 2015
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong, Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng
  • Patent number: 8876312
    Abstract: In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 4, 2014
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng, Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong
  • Publication number: 20140254127
    Abstract: In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: Avago Technologies General lP (Singapore) Pte. Ltd.
    Inventors: Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng, Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong
  • Publication number: 20140184096
    Abstract: An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 3, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte., Ltd.
    Inventors: Keat Chuan Ng, Choon Guan Ko, Kheng Leng Tan
  • Publication number: 20140167083
    Abstract: A lighting package is disclosed. The lighting package is disclosed as including a primary light source, such as a Light Emitting Diode, and an additional electrical component that protects the primary light source from electrostatic discharge, for example. The additional electrical component may correspond to a Zener diode and may be treated with at least one material that helps reduce the light absorption of the Zener diode.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Chin Ewe Phang, Keat Chuan Ng, Lig Yi Yong