Patents by Inventor Kee Hon Lee

Kee Hon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110176573
    Abstract: In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.
    Type: Application
    Filed: March 30, 2011
    Publication date: July 21, 2011
    Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Kheng Leng Tan, Keat Chuan Ng, Kee Hon Lee
  • Publication number: 20100289055
    Abstract: In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.
    Type: Application
    Filed: May 14, 2009
    Publication date: November 18, 2010
    Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
    Inventors: Kheng Leng Tan, Keat Chuan Ng, Kee Hon Lee