Patents by Inventor Kei Yamaguchi

Kei Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150352511
    Abstract: A substrate for biochips, in which carboxyl groups are immobilized on a substrate whose surface at least is composed of carbon; and a method for producing the substrate are disclosed. The substrate for biochips comprises a substrate whose surface at least is composed of carbon; and an acrylic polymer having free carboxyl groups in the molecular structure thereof, which acrylic polymer is immobilized on the surface of the substrate. The method for producing the substrate comprises irradiating the substrate whose surface at least is composed of carbon with ultraviolet light during the acrylic polymer having free carboxyl groups in the molecular structure thereof contacts the substrate.
    Type: Application
    Filed: January 7, 2014
    Publication date: December 10, 2015
    Inventors: Yasushi TAKEBAYASHI, Ryo MORISHITA, Kei YAMAGUCHI
  • Publication number: 20150069601
    Abstract: A method of manufacturing a semiconductor device and a semiconductor device that is manufactured by the method. In the method of manufacturing a semiconductor device, a releasing sheet is disposed in close contact with a hole of an aluminum plate having the recessed hole, and a skeleton structure of a semiconductor device is put into the recessed hole. Then, liquid epoxy resin is poured into the recessed hole. After hardening, the epoxy resin body 10 including the skeleton structure is taken out from the recessed hole to complete manufacturing the semiconductor device. Using a simple molding jig including the aluminum plate, and covering the skeleton structure with the epoxy resin body, a highly reliable semiconductor device with a case-less construction can be manufactured.
    Type: Application
    Filed: August 12, 2014
    Publication date: March 12, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kei YAMAGUCHI, Yuji Ichimura, Daisuke Kimijima
  • Publication number: 20140210060
    Abstract: Provided is a method of manufacturing a semiconductor device which includes a semiconductor chip, an insulating board mounted with the semiconductor chip and having a wiring pattern, and a leadframe connected to the wiring pattern, the semiconductor chip, the wiring pattern and the leadframe being partially sealed with a sealing resin, wherein: an epoxy resin composition formed by adding 0.3 to 0.7 mass % of epoxysilane as a silane coupling agent to an epoxy resin is used as the sealing resin; and a copper member made of copper or a copper alloy and having an oxide film formed in the surface with a film thickness in a color indicated by an L* value in the range of 48 to 51, an a* value in the range of 40 to 49 and a b* value in the range of 24 to 40 is used as the leadframe and the wiring pattern.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 31, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuko NAKAMATA, Yuji ICHIMURA, Kei YAMAGUCHI
  • Patent number: 7234358
    Abstract: A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: June 26, 2007
    Assignee: Fuji Electric Device Technology Co., Ltd.
    Inventors: Kazunori Saito, Yuji Ichimura, Kei Yamaguchi, Katsumichi Ueyanagi, Shigeru Shinoda
  • Publication number: 20060243054
    Abstract: A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.
    Type: Application
    Filed: February 16, 2006
    Publication date: November 2, 2006
    Inventors: Kazunori Saito, Yuji Ichimura, Kei Yamaguchi, Katsumichi Ueyanagl, Shigeru Shinoda
  • Publication number: 20060032904
    Abstract: An IC card creation entrusted company server for creating IC card creation data to be loaded on an IC card registers in advance in-advance registration information data including at least one or more application template information mountable on a IC card, receives IC car setting data consisting of card basis information data including personal information and IC card unique information specification data including one or more application specification information, extracts template information registered in advance for each application corresponding to the application specification information contained in the IC card setting data, creates load data of each application, and merges load data of each application, thereby creating IC card creation data.
    Type: Application
    Filed: February 19, 2003
    Publication date: February 16, 2006
    Inventors: Masayoshi Kawamoto, Takashi Deguchi, Hisanori Matsuyama, Masahiro Shibata, Satoru Tanimoto, Kei Yamaguchi, Yumiko Kawato
  • Publication number: 20050074608
    Abstract: An electrophotographic positively charged toner and method for its manufacture. The toner includes a core toner that has a binder resin, a wax, a colorant and a charge control agent as its principal component materials. The core toner is spherified through heat treatment. The toner also includes at least fine silica particles as an external additive. The charge control agent contains a resin having a quaternary ammonium salt group as a functional group and a nigrosine dye. Even if after kneading, pulverization and classification, the toner is made spherical by melting the surfaces of the particles in a hot air current, the charge control agent is not coated and hence the charging ability thereof is not reduced.
    Type: Application
    Filed: November 26, 2003
    Publication date: April 7, 2005
    Inventors: Manabu Sawada, Kei Yamaguchi, Shinichiro Nishimaki, Hiroshi Emori
  • Patent number: 5935746
    Abstract: A photosensitive body comprises a conductive substrate; a photosensitive layer on the conductive substrate, the photosensitive layer includes a charge transport compound wherein the charge transport compound is described by a general formula (I): ##STR1## wherein A is a phenyl or naphthyl group; each of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is a hydrogen atom, a halogen atom, an alkyl group with or without substitution, an alkoxy group, an alkylamino group, a nitro group, a cyano group, an aryl group with or without substitution, or a heterocyclic group with or without substitution; and each of R.sup.5 and R.sup.6 is a cyano group or an alkoxycarbonyl group.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: August 10, 1999
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Masami Kuroda, Motohiro Takeshima, Kei Yamaguchi
  • Patent number: 5935749
    Abstract: A photoconductor for internal irradiation electrophotography includes a substrate which is hollow, cylindrical, and transparent, and which is composed of a synthetic resin; an electroconductive layer which is provided on an outer surface of the substrate and which has a surface resistance of no higher than 2.times.10.sup.6 .OMEGA./square; a photosensitive layer which is composed of organic material, which is provided on the electroconductive layer, and which is dip coated from a liquid including an organic solvent; and a protective layer which is provided on an inner surface of the substrate, wherein the protective layer and the electroconductive layer are resistant to the organic solvent of the liquid for dip coating.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: August 10, 1999
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Noriaki Kawata, Kei Yamaguchi, Yutaka Ikeda