Patents by Inventor Keiichi Honda

Keiichi Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230354593
    Abstract: A semiconductor substrate includes a fuse memory that is a write-once memory, a control unit that writes and reads data to and from the fuse memory, and a digital. A wiring layer includes a wiring conductor that connects the digital and an external connection terminal and a plane conductor provided in between the wiring conductor and a surface of the semiconductor substrate. The wiring conductor overlaps the fuse memory when the wiring conductor and the fuse memory are seen in a stacking direction in which the semiconductor substrate and the wiring layer are stacked on top of each other.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 2, 2023
    Inventor: Keiichi HONDA
  • Patent number: 11588450
    Abstract: Provided is an amplification circuit that includes: a low-noise amplifier that includes an FET as an amplification element and that amplifies a radio-frequency signal inputted to the gate of the FET; an input matching network that matches the input impedance of the low-noise amplifier; and a switch that is serially connected between ground and a node on a line connecting the input matching network and the gate of the FET to each other.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: February 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Keiichi Honda, Masamichi Tokuda
  • Publication number: 20210175862
    Abstract: Provided is an amplification circuit that includes: a low-noise amplifier that includes an FET as an amplification element and that amplifies a radio-frequency signal inputted to the gate of the FET; an input matching network that matches the input impedance of the low-noise amplifier; and a switch that is serially connected between ground and a node on a line connecting the input matching network and the gate of the FET to each other.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 10, 2021
    Inventors: Keiichi HONDA, Masamichi TOKUDA
  • Patent number: 9716386
    Abstract: In a contactless power supply system 10 having a secondary coil 13 receiving electric power generated from a primary coil 12 to be connected to a high-frequency power source 11, and a resonance coil 14 arranged in direct contact with the secondary coil 13 in between the primary coil 12 and the secondary coil 13, respective planarly-viewed areas of the secondary and the resonance coils 13, 14 are equal to or smaller than a planarly-viewed area of the primary coil 12, the primary coil 12 is formed by planarly and spirally winding a first litz wire 25, the resonance coil 14 is formed by tandemly winding coils 27, 28 in a double layer, the coils 27, 28 being formed by planarly and spirally winding a second litz wire 26, and the secondary coil 13 is formed by parallelly arranging and planarly and spirally winding third litz wires 29, 29a.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: July 25, 2017
    Assignee: HEADS CO., LTD.
    Inventors: Keiichi Honda, Yutaka Imoto
  • Publication number: 20150207332
    Abstract: In a contactless power supply system 10 having a secondary coil 13 receiving electric power generated from a primary coil 12 to be connected to a high-frequency power source 11, and a resonance coil 14 arranged in direct contact with the secondary coil 13 in between the primary coil 12 and the secondary coil 13, respective planarly-viewed areas of the secondary and the resonance coils 13, 14 are equal to or smaller than a planarly-viewed area of the primary coil 12, the primary coil 12 is formed by planarly and spirally winding a first litz wire 25, the resonance coil 14 is formed by tandemly winding coils 27, 28 in a double layer, the coils 27, 28 being formed by planarly and spirally winding a second litz wire 26, and the secondary coil 13 is formed by parallelly arranging and planarly and spirally winding third litz wires 29, 29a.
    Type: Application
    Filed: March 5, 2014
    Publication date: July 23, 2015
    Applicant: HEADS Co., Ltd.
    Inventors: Keiichi Honda, Yutaka Imoto
  • Patent number: 8857897
    Abstract: A lower garnish arranged adjacent to the lower part of a tailgate includes a surface portion extending along an outer surface of an outer panel and a mounting portion disposed between the outer surface of the outer panel and an inner surface of the surface portion. The mounting portion includes a mounting seat extending along the outer surface of the outer panel and being mounted on the outer panel and a connecting wall connecting the mounting seat and the surface portion. The connecting wall has a first slit extending along a first direction directing from the surface portion toward the mounting seat and a second slit intersecting the first slit at right angles.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: October 14, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: Masayuki Ogawa, Hiroyuki Hazawa, Takenobu Haga, Keiichi Honda, Takashi Yamanaka, Ryuichi Murai
  • Publication number: 20130076070
    Abstract: A lower garnish arranged adjacent to the lower part of a tailgate includes a surface portion extending along an outer surface of an outer panel and a mounting portion disposed between the outer surface of the outer panel and an inner surface of the surface portion. The mounting portion includes a mounting seat extending along the outer surface of the outer panel and being mounted on the outer panel and a connecting wall connecting the mounting seat and the surface portion. The connecting wall has a first slit extending along a first direction directing from the surface portion toward the mounting seat and a second slit intersecting the first slit at right angles.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 28, 2013
    Applicant: HONDA MOTOR CO., LTD
    Inventors: Masayuki Ogawa, Hiroyuki Hazawa, Takenobu Haga, Keiichi Honda, Takashi Yamanaka, Ryuichi Murai
  • Patent number: 7641246
    Abstract: A bumper beam structure for a vehicle includes a height-raising wall provided on an upper portion of a beam body to be fixedly on left and right frames of a vehicle body. The height-raising wall includes: a bottom wall portion fixed to the upper portion of the beam body; a running-up preventing wall portion extending upwardly from the bottom wall portion; a first reinforcing wall portion connecting to the respective one end of the running-up preventing and bottom wall portions; and a second reinforcing wall portion connecting to the respective other ends of the running-up preventing and bottom wall portions. With such a height-raising wall, the bumper beam structure can interfere with another vehicle of a higher height to prevent the other vehicle from running up onto the vehicle provided with the bumper beam structure.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: January 5, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tomoaki Ichikawa, Keiichi Honda, Kojiro Okabe
  • Patent number: 7537252
    Abstract: Bumper beam of a closed sectional shape includes: a vehicle-body-side inner wall portion to be mounted on a vehicle body; upper and lower outwardly-extending wall portions that extend from the upper and lower ends of the inner wall portion toward the outside of the vehicle body; an outer wall portion connecting the outwardly-extending wall portions; and at least one horizontal inner rib connecting the outer wall portion and the inner wall portion, the outer wall portion having a vertical wall portion extending vertically downward from the outer end of the upper outwardly-extending wall portion and a slanted wall portion slanted from the lower end of the vertical wall portion toward the vehicle body. Gusset of a closed sectional shape includes a horizontal rib for dispersing an impact force at least to the slanted wall portion.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: May 26, 2009
    Assignees: Honda Motor Co., Ltd., YKK AP Inc., YKK Corporation
    Inventors: Shigeyuki Nagai, Shigekazu Koga, Keiichi Honda, Kazuyuki Fukagawa, Daisaku Nakazato, Sakae Sato
  • Publication number: 20080315597
    Abstract: A bumper beam structure for a vehicle includes a height-raising wall provided on an upper portion of a beam body to be fixedly on left and right frames of a vehicle body. The height-raising wall includes: a bottom wall portion fixed to the upper portion of the beam body; a running-up preventing wall portion extending upwardly from the bottom wall portion; a first reinforcing wall portion connecting to the respective one end of the running-up preventing and bottom wall portions; and a second reinforcing wall portion connecting to the respective other ends of the running-up preventing and bottom wall portions. With such a height-raising wall, the bumper beam structure can interfere with another vehicle of a higher height to prevent the other vehicle from running up onto the vehicle provided with the bumper beam structure.
    Type: Application
    Filed: June 20, 2008
    Publication date: December 25, 2008
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tomoaki Ichikawa, Keiichi Honda, Kojiro Okabe
  • Publication number: 20070246956
    Abstract: Bumper beam of a closed sectional shape includes: a vehicle-body-side inner wall portion to be mounted on a vehicle body; upper and lower outwardly-extending wall portions that extend from the upper and lower ends of the inner wall portion toward the outside of the vehicle body; an outer wall portion connecting the outwardly-extending wall portions; and at least one horizontal inner rib connecting the outer wall portion and the inner wall portion, the outer wall portion having a vertical wall portion extending vertically downward from the outer end of the upper outwardly-extending wall portion and a slanted wall portion slanted from the lower end of the vertical wall portion toward the vehicle body. Gusset of a closed sectional shape includes a horizontal rib for dispersing an impact force at least to the slanted wall portion.
    Type: Application
    Filed: April 23, 2007
    Publication date: October 25, 2007
    Applicants: Honda Motor Co., Ltd., YKK AP INC., YKK CORPORATION
    Inventors: Shigeyuki Nagai, Shigekazu Koga, Keiichi Honda, Kazuyuki Fukagawa, Daisaku Nakazato, Sakae Sato
  • Patent number: 7210719
    Abstract: A bumper beam mounting structure for absorbing an impact at a bumper beam and mounting members thereof in a vehicle minor collision is provided. The mounting structure has the mounting members attached to curved portions of right and left curved ends of the bumper beam. The mounting members are attachable to vehicle body members. The mounting members are in a right triangular shape in a plan view. A sloping portion corresponding to the hypotenuse is formed with a depressed portion for absorbing an impact.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: May 1, 2007
    Assignee: Honda Motor Co., Ltd.
    Inventors: Keiichi Honda, Kazuo Omura, Toshihiko Suzuki
  • Publication number: 20060186680
    Abstract: A bumper beam mounting structure for absorbing an impact at a bumper beam and mounting members thereof in a vehicle minor collision is provided. The mounting structure has the mounting members attached to curved portions of right and left curved ends of the bumper beam. The mounting members are attachable to vehicle body members. The mounting members are in a right triangular shape in a plan view. A sloping portion corresponding to the hypotenuse is formed with a depressed portion for absorbing an impact.
    Type: Application
    Filed: May 18, 2005
    Publication date: August 24, 2006
    Applicant: Honda Motor Co., Ltd.
    Inventors: Keiichi Honda, Kazuo Omura, Toshihiko Suzuki
  • Publication number: 20060017294
    Abstract: A vehicle bumper beam attachment structure includes a shock-absorbing extension member through which a bumper beam is attached to a vehicle body. The extension member is formed from an aluminum extruded hollow profile and includes a rear wall for abutment with the vehicle body, an inner sidewall extending convexly from an inner end the rear wall toward the bumper beam, a central sidewall extending from a central portion of the rear wall in substantially the same direction as the inner sidewall, a first front wall connecting distal ends of the inner and central sidewalls, a branched sidewall branched off from the central sidewall and extending convexly toward the bumper beam, an outer sidewall extending from an outer end of the rear wall toward the bumper beam, and a second front wall connecting distal ends of the branched and outer sidewalls.
    Type: Application
    Filed: July 5, 2005
    Publication date: January 26, 2006
    Applicant: Honda Motor Co., Ltd.
    Inventors: Kazuo Omura, Keiichi Honda, Toshihiko Suzuki
  • Patent number: 6988753
    Abstract: A vehicle bumper beam attachment structure includes a shock-absorbing extension member through which a bumper beam is attached to a vehicle body. The extension member is formed from an aluminum extruded hollow profile and includes a rear wall for abutment with the vehicle body, an inner sidewall extending convexly from an inner end the rear wall toward the bumper beam, a central sidewall extending from a central portion of the rear wall in substantially the same direction as the inner sidewall, a first front wall connecting distal ends of the inner and central sidewalls, a branched sidewall branched off from the central sidewall and extending convexly toward the bumper beam, an outer sidewall extending from an outer end of the rear wall toward the bumper beam, and a second front wall connecting distal ends of the branched and outer sidewalls.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: January 24, 2006
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazuo Omura, Keiichi Honda, Toshihiko Suzuki
  • Patent number: 6761389
    Abstract: An automobile heel stopper shock-absorbing structure is formed from a receiving plate that on the outside has a heel receiving surface and on the inside faces a dash panel with a space therebetween, a front support plate connected integrally to a front end part of the receiving plate and having its extremity joined to the dash panel, and a rear support plate connected integrally to a rear end part of the receiving plate and having its extremity joined to at least one of the dash panel and a floor panel. The rear support plate is made weaker than the receiving plate and the front support plate so that the rear support plate will buckle when a pushing-in load acting on the receiving plate is equal to or greater than a predetermined value.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: July 13, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Kosuke Akasaka, Shinji Kumagai, Keiichi Honda, Yuji Kikuchi
  • Publication number: 20030222478
    Abstract: An automobile heel stopper shock-absorbing structure is formed from a receiving plate that on the outside has a heel receiving surface and on the inside faces a dash panel with a space therebetween, a front support plate connected integrally to a front end part of the receiving plate and having its extremity joined to the dash panel, and a rear support plate connected integrally to a rear end part of the receiving plate and having its extremity joined to at least one of the dash panel and a floor panel. The rear support plate is made weaker than the receiving plate and the front support plate so that the rear support plate will buckle when a pushing-in load acting on the receiving plate is equal to or greater than a predetermined value.
    Type: Application
    Filed: April 11, 2003
    Publication date: December 4, 2003
    Applicant: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Kosuke Akasaka, Shinji Kumagai, Keiichi Honda, Yuji Kikuchi
  • Patent number: 5945867
    Abstract: A first FET is connected between first and third nodes, a second FET is connected between second and fourth nodes, a third FET is connected between third and fifth nodes and a fourth FET is connected between fourth and fifth nodes. A fifth FET is connected between first and sixth nodes and a sixth FET is connected between second and sixth nodes. The gates of the first, fourth and sixth FETs are connected to a first control terminal and the gates of the second, third and fifth FETs are connected to a second control terminal. A power-supply terminal is connected to the fifth and sixth nodes. The first and second nodes are connected to a common terminal through first and second capacitors, respectively. The fifth and sixth FETs form a pull-up switching circuit. The pull-up switching circuit pulls up the source of an FET in an OFF state to the power-supply voltage and isolates the source of an FET in an ON state from the power-supply voltage.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: August 31, 1999
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Hisanori Uda, Keiichi Honda
  • Patent number: 5590412
    Abstract: A communication apparatus for use in a portable telephone is disclosed which has a transmit-receive common amplifier for amplifying a transmitted signal or received signal, and a mixer for frequency-mixing the transmitted signal or the received signal with a local oscillator output, wherein connection between the mixer and an input side of the amplifier and connection between the mixer and an output side of the amplifier are made by means of respective signal-path selector switches. During reception, a deep bias is applied to an FET of the transmit-receive common amplifier to reduce current consumption, and during transmission, a shallow bias is applied to the FET of the transmit-receive common amplifier for increased output.
    Type: Grant
    Filed: November 18, 1994
    Date of Patent: December 31, 1996
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tetsuro Sawai, Hisanori Uda, Toshikazu Hirai, Toshikazu Imaoka, Yasoo Harada, Keiichi Honda, Masao Nishida
  • Patent number: 4313888
    Abstract: A novel N-3-(cis-9-octadecenoyloxy)-2-hydroxypropylamine derivative, useful as a nonionic surface active agent, especially, an emulsifying agent and dispersing agent for cosmetics, is of the general formula: ##STR1## in which R represents a member selected from the group consisting of ##STR2##
    Type: Grant
    Filed: September 15, 1980
    Date of Patent: February 2, 1982
    Assignee: Kanebo Ltd.
    Inventors: Keiichi Honda, Yasushi Nishijima