Patents by Inventor Keiichi MAKI

Keiichi MAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210058057
    Abstract: A surface acoustic wave (SAW) resonator comprises a plurality of interdigital transducer electrodes disposed on a multilayer piezoelectric substrate (MPS) including a layer of piezoelectric material having a lower surface bonded to an upper surface of a layer of a second material different from the piezoelectric material that improves the temperature stability and reliability of the SAW resonator, and a layer of dielectric material disposed on an upper surface of the interdigital transducer electrodes and MPS.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 25, 2021
    Inventors: Rei Goto, Keiichi Maki, Gong Bin Tang
  • Patent number: 10910539
    Abstract: A light emitting device includes a first light transmissive supportive substrate having a first light transmissive insulator and a conductive circuitry layer provided on a surface of the first light transmissive insulator, a second light transmissive supportive substrate having a second light transmissive insulator and disposed in such a way that a surface of the second light transmissive insulator faces the conductive circuitry layer and so as to have a predetermined gap from the first light transmissive supportive substrate, a light emitting diode having a main body, and first and second electrodes provided on a surface of the main body and electrically connected to the conductive circuitry layer via a conductive bump, and laid out between the first and second light transmissive supportive substrates, and a third light transmissive insulator embedded in a space between the first light transmissive supportive substrate and the second light transmissive supportive substrate.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: February 2, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10854582
    Abstract: Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: December 1, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200366268
    Abstract: Surface acoustic wave resonators are disclosed. In certain embodiments, a surface acoustic wave resonator can include a high impedance layer, a piezoelectric layer over the high impedance layer, an interdigital transducer electrode over the piezoelectric layer, and a low impedance layer between the high impedance layer and the piezoelectric layer. An acoustic impedance of the high impedance layer is greater than an acoustic impedance of the piezoelectric layer. An acoustic impedance of the low impedance layer is lower than the acoustic impedance of the high impedance layer. The piezoelectric layer can have a cut angle in a range from 115° to 135°. The surface acoustic wave resonator is configured to generate a Rayleigh mode surface acoustic wave having a wavelength of ?.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 19, 2020
    Inventors: Rei Goto, Keiichi Maki
  • Patent number: 10777720
    Abstract: A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 15, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200274517
    Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a support layer, a ceramic layer positioned over the support layer, a piezoelectric layer positioned over the ceramic layer, and an interdigital transducer electrode positioned over the piezoelectric layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The acoustic wave device can be a surface acoustic wave device configured to generate a surface acoustic wave.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 27, 2020
    Inventors: Hironori Fukuhara, Rei Goto, Keiichi Maki
  • Publication number: 20200274513
    Abstract: A method of manufacturing an acoustic wave device is disclosed. The method includes attaching a support layer to a ceramic layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The method also includes bonding a piezoelectric layer to a surface of the ceramic layer. The method further includes forming an interdigital transducer electrode over the piezoelectric layer.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 27, 2020
    Inventors: Hironori Fukuhara, Rei Goto, Keiichi Maki
  • Patent number: 10749497
    Abstract: An acoustic wave device that includes a spinel layer, a piezoelectric layer, a temperature compensating layer between the spinel layer and the piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of ?. The piezoelectric layer can have a thickness that is less than ?. In some embodiments, the spinel layer can be a polycrystalline spinel layer.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: August 18, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gong Bin Tang, Rei Goto, Hiroyuki Nakamura, Keiichi Maki
  • Publication number: 20200251630
    Abstract: A light-emitting device includes a pair of light-transmissive insulator sheets disposed opposite to each other and two types of light-transmissive electroconductive layers disposed on a common one of or separately on one and the other of the pair of light-transmissive insulator sheets, and at least one light-emitting semiconductor each provided with a cathode and an anode which are individually and electrically connected to the two types of the light-transmissive electroconductive layers. The electrical connection and mechanical bonding between the members are improved by a light-transmissive elastomer which is between the pair of light-transmissive insulator sheets. A method in which a light-emitting semiconductor element and a light-transmissive electroconductive member are subjected to vacuum hot-pressing.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Patent number: 10734365
    Abstract: A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: August 4, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Publication number: 20200212876
    Abstract: Aspects of this disclosure relate to an acoustic wave device with transverse mode suppression. The acoustic wave device can include a piezoelectric layer, an interdigital transducer electrode, a temperature compensation layer, and a multi-layer mass loading strip. The mass loading strip has a density that is higher than a density of the temperature compensation layer. The mass loading strip can overlap edge portions of fingers of the interdigital transducer electrode. The mass loading strip can include a first layer for adhesion and a second layer for mass loading. The mass loading strip can suppress a transverse mode.
    Type: Application
    Filed: December 20, 2019
    Publication date: July 2, 2020
    Inventors: Rei Goto, Koji Seo, Keiichi Maki
  • Publication number: 20200212875
    Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer positioned over a substrate. The acoustic wave device can also include an interdigital transducer electrode positioned over the piezoelectric layer. The acoustic wave device can also include a grounding structure positioned over the piezoelectric layer. The acoustic wave device can also include a conductive layer positioned between the piezoelectric layer and the substrate. The acoustic wave device can further include an electrical pathway that electrically connects the conductive layer to the grounding structure.
    Type: Application
    Filed: December 20, 2019
    Publication date: July 2, 2020
    Inventors: Rei Goto, Keiichi Maki
  • Publication number: 20200212883
    Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer positioned over a substrate. The acoustic wave device can also include an interdigital transducer electrode positioned over the piezoelectric layer. The acoustic wave device can also include a grounding structure positioned over the piezoelectric layer. The acoustic wave device can also include a conductive layer positioned under the substrate such that the substrate is positioned between the conductive layer and the grounding structure. The acoustic wave device can further include an electrical pathway that electrically connects the conductive layer to the grounding structure.
    Type: Application
    Filed: December 20, 2019
    Publication date: July 2, 2020
    Inventors: Rei Goto, Keiichi Maki
  • Publication number: 20200168588
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Application
    Filed: December 30, 2019
    Publication date: May 28, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200162053
    Abstract: A surface acoustic wave device is disclosed. The surface acoustic wave device can include a ceramic substrate, a piezoelectric layer over the ceramic substrate, and an interdigital transducer electrode over the piezoelectric layer. The ceramic substrate can be a polycrystalline spinel substrate. The surface acoustic wave device can also include a temperature compensating layer over the interdigital transducer electrode.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 21, 2020
    Inventors: Rei Goto, Hironori Fukuhara, Hiroyuki Nakamura, Keiichi Maki
  • Publication number: 20200154564
    Abstract: A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.
    Type: Application
    Filed: January 9, 2020
    Publication date: May 14, 2020
    Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
    Inventor: Keiichi MAKI
  • Publication number: 20200144984
    Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 7, 2020
    Inventors: Hironori Fukuhara, Keiichi Maki, Rei Goto
  • Publication number: 20200136000
    Abstract: A light transmissive first insulating film having light transmissive property to visible light, a second insulating film arranged opposite to the first insulating film, a plurality of conductor patterns formed of, for example, mesh patterns having the light transmissive property to the visible light and formed on a surface of at least one of the first insulating film and the second insulating film, a plurality of first light-emitting devices connected to any two conductor patterns of the plurality of conductor patterns, and a resin layer arranged between the first insulating film and the second insulating film to hold the first light-emitting devices are included.
    Type: Application
    Filed: December 24, 2019
    Publication date: April 30, 2020
    Applicant: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi MAKI
  • Patent number: 10629570
    Abstract: A light emitting module according to an embodiment includes a first insulation film with a light transmissivity, a second insulation film disposed so as to face the first insulation film, a first double-sided light emitting element disposed between the first insulation film and the second insulation film, and comprising an electrode, a second double-sided light emitting element disposed between the first insulation film and the second insulation film adjacent to the first double-sided light emitting element, comprising an electrode, and emitting different light from the first double-sided light emitting element, and a conductor pattern formed on a surface of the first insulation film, and connected to the respective electrodes of the first double-sided light emitting element and the second double-sided light emitting element.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 21, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki
  • Patent number: 10580949
    Abstract: A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: March 3, 2020
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Keiichi Maki