Abstract: A plasma processor electrode includes a support member disposed to face to an electrode that holds a substrate to be treated, an electrode plate fixed to the support member and equipped with gas injection holes and a screw hole open and facing to the support member to supply a processing gas through the gas discharge hole into a processing space formed between the electrode plate and the electrode to generate a plasma in the processing space, and a fastening unit that clamps the electrode plate on the support member by fastening the electrode plate to the support member with a screw driven into the screw hole from the support member.

Abstract: A heat signal writing device forming a clear writing pattern of a heat signal is provided. A heat signal writing device 10 for writing a heat signal in a medium traveling through a channel, which is secured to an appropriate position on the channel through which the medium flows, includes a Peltier element 11 for writing the heat signal having a temperature change according to a desired pattern by heating or cooling; a channel supporting member 12 shaped as a pyramid formed of a heat conductive material and having a bottom surface in close contact with a surface of the Peltier element 11, the tip of the pyramid being in direct contact with the channel 1; a heat sink 13 in close contact with another surface of the Peltier element 11; and a heat-resistant cover for covering the periphery of the Peltier element 11, excluding a channel contact surface 12a at the tip, and the channel supporting member 12.

Abstract: A heat signal writing device forming a clear writing pattern of a heat signal is provided. A heat signal writing device 10 for writing a heat signal in a medium traveling through a channel, which is secured to an appropriate position on the channel through which the medium flows, includes a Peltier element 11 for writing the heat signal having a temperature change according to a desired pattern by heating or cooling; a channel supporting member 12 shaped as a pyramid formed of a heat conductive material and having a bottom surface in close contact with a surface of the Peltier element 11, the tip of the pyramid being in direct contact with the channel 1; a heat sink 13 in close contact with another surface of the Peltier element 11; and a heat-resistant cover for covering the periphery of the Peltier element 11, excluding a channel contact surface 12a at the tip, and the channel supporting member 12.

Abstract: A flow rate detection method using a heat signal that enables accurate flow rate measurement by eliminating sources of measurement error is provided. The flow rate detection method, using a heat signal, of writing a temperature-change heat signal in a medium traveling through a channel and detecting the heat signal with heat signal detecting means provided at a position away from the writing position, to measure a traveling speed of the medium, wherein first and second temperature sensors 20A and 20B, which are separated by a predetermined distance L, are disposed downstream of the writing position, and the traveling speed is calculated from a time difference at which the two temperature sensors 20A and 20B detecting the heat signal and from the distance L.

Abstract: An attaching and removing unit of a lid for a wafer carrier according to the invention includes: a lid holding plate that can move forward and backward relatively to a lid for a wafer carrier provided with a lock unit having a keyhole exposed outside, on a side of the keyhole; a driver for causing the lid holding plate to move forward and backward; and a key element protruding from the lid holding plate on a side of the lid in a pivotable manner, the key element disposed opposite the keyhole in a direction of the forward and backward movement. The lock unit is adapted to be locked and unlocked by the key element pivoting in the keyhole. In a locked state, the key element can be inserted into and released from the keyhole, and in an unlocked state, the key element is engaged with and can not be released from the keyhole, while the lid holding plate holds the lid. The lid holding plate is provided with a lid-detecting unit for detecting whether the lid holding plate is holding the lid or not.

Abstract: A plasma processor electrode includes a support member disposed to face to an electrode that holds a substrate to be treated, an electrode plate fixed to the support member and equipped with gas injection holes and a screw hole open and facing to the support member to supply a processing gas through the gas discharge hole into a processing space formed between the electrode plate and the electrode to generate a plasma in the processing space, and a fastening unit that clamps the electrode plate on the support member by fastening the electrode plate to the support member with a screw driven into the screw hole from the support member.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: An flow rate measurement method and a ultrasonic flow meter is provided, which can measure a flow velocity accurately by utilizing a ultrasonic wave having a frequency by which a phase difference becomes zero. According to the flow rate measurement method, a reference ultrasonic velocity is prepared such that the fluid is in a standard condition, firstly. Then, an absolute ultrasonic velocity in the fluid and a temporary flow velocity V0 in the fluid are obtained. Then, the temporary flow velocity V0 is corrected by using the difference between the reference ultrasonic velocity and the absolute ultrasonic velocity thereby to determine an accurate flow velocity of the fluid, and to determine a flow rate of the fluid by using the accurate flow velocity and a cross section area of the conduit.

Abstract: Disclosed is a method and apparatus for measuring flow velocity and flow rate of a fluid in a tube member or the like with high precision. A flow vel0ocity measuring method has: a step of allowing a signal sound of ultrasound to propagate through a fluid in a tube member or the like and detecting a phase difference between the signal sound and an original signal; a step of eliminating a phase difference detected in the step to obtain synchronism; a step of detecting time or oscillation frequency required to complete the phase synchronization in the step; and a step of, on the basis of the time or oscillation frequency required to complete phase synchronization in the step, calculating flow velocity by referring to flow velocity which is preset in a table in correspondence with the time or frequency. In the table, flow velocities corresponding to changes in temperature, pressure, and kind of a fluid may be preset together with the time or oscillation frequency.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: Disclosed is a method and apparatus for measuring flow velocity and flow rate of a fluid in a tube member or the like with high precision. A flow vel0ocity measuring method has: a step of allowing a signal sound of ultrasound to propagate through a fluid in a tube member or the like and detecting a phase difference between the signal sound and an original signal; a step of eliminating a phase difference detected in the step to obtain synchronism; a step of detecting time or oscillation frequency required to complete the phase synchronization in the step; and a step of, on the basis of the time or oscillation frequency required to complete phase synchronization in the step, calculating flow velocity by referring to flow velocity which is preset in a table in correspondence with the time or frequency. In the table, flow velocities corresponding to changes in temperature, pressure, and kind of a fluid may be preset together with the time or oscillation frequency.

Abstract: An flow rate measurement method and a ultrasonic flow meter is provided, which can measure a flow velocity accurately by utilizing a ultrasonic wave having a frequency by which a phase difference becomes zero. According to the flow rate measurement method, a reference ultrasonic velocity is prepared such that the fluid is in a standard condition, firstly. Then, an absolute ultrasonic velocity in the fluid and a temporary flow velocity V0 in the fluid are obtained. Then, the temporary flow velocity V0 is corrected by using the difference between the reference ultrasonic velocity and the absolute ultrasonic velocity thereby to determine an accurate flow velocity of the fluid, and to determine a flow rate of the fluid by using the accurate flow velocity and a cross section area of the conduit.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: A processing system comprises a plurality of processing vessels (8A to 8D) provided with openings in which a wafer (W) is subjected to predetermined processes, and a common transfer vessel (4) connected to the openings of the processing vessels. A transfer mechanism (14) capable of turning, bending and stretching is installed in the common transfer vessel to transfer the wafer (W) between the common transfer vessel (4) and the processing vessels (8A to 8D). Stand-by spaces (24A to 24D), where the wafer (W) is held temporarily, are determined so as to correspond to the openings of the processing vessels (8A to 8D), respectively. Position sensors (26-1 to 26-5) are assigned in pairs to the stand-by spaces to measure the position of the perimeter of the wafer. The position sensors are arranged so that each stand-by space (24A to 24D) shares one of the pair of position sensors with the adjacent stand-by space for common use.

Abstract: A load port for semiconductor equipment includes a transporting apparatus 18 and/or a moving apparatus 30 for respectively transporting a carrier base 14 and moving a cover 15, using a smaller force until the carrier base 14 and/or the cover 15 reaches a predetermined position that is at a predetermined distance from an opening 16 of the equipment. This position is at a distance where it is no longer possible to catch a hand or other object between the carrier base 14 or cover 15 and the semiconductor equipment. Then, the carrier base 14 and/or the cover 15 is transported or moved towards the opening 16 by the transporting apparatus 18 and/or moving apparatus 30 respectively transporting the carrier base 14 and/or moving the cover 15 towards the opening 16 to completely close the opening 16 using a larger force.

Abstract: In an arm access position sensing method according to the present invention, optical sensors are provided in a cassette chamber. An adjusting cassette holding wafers W in the top slot and bottom slot is placed on a stage in the cassette chamber. The stage is movable. In a calibration process, the reference slot position, map position, and map thickness are calculated using optical sensors. Similarly, in a mapping process, the sampling thickness and map wafer offset value of each slot in the cassette holding the wafers W are calculated. In an arm access position sensing process, the access position of the transfer arm is calculated using the sampling thickness, map wafer offset value, reference slot position, map position, map thickness, and specific values. On the basis of the access position, the transfer arm and stage are actuated to transfer the wafer W.

Abstract: In a starter, a plate that turns with a pinion moving body is disposed behind the pinion moving body. The plate has a receiving part that engages with the lower extension of a rotation restricting member for restricting the rotation of the pinion moving body until a pinion gear engages with a ring gear. In a power supply circuit for a starter motor, a first switch and a second switch are provided. The first switch turns on first to energize the starter motor. When the pinion gear engages with the ring gear thereafter, the second switch turns on to energize further the starter motor by short-circuiting a resistor wire.

Abstract: In a starter having a motor yoke, a housing and an end frame forming a cylindrical starter frame, a cylindrical thermal insulation cover is fitted around the starter frame through rubber-made elastic rings. The rings are tightly fitted in V-shaped grooves formed circumferentially on fitting faces, one being between the housing and the yoke and the other being between the yoke and the end frame. Each ring is pressed radially inward by a large diameter part of the thermal insulation cover to fill in the V-shaped groove and contact the fitting face. Further, in a motor for the starter, a resilient plate sheet is disposed between a commutator and a brush holder to return a brush passing therethrough to the original position when the brush tends to move during sliding contact with the commutator.

Abstract: A cassette transfer mechanism according to the present invention comprises a cassette chamber for containing a cassette for holding a plurality of objects to be processed, a cassette transfer port formed in the cassette chamber, for allowing the cassette to be transferred into and from the cassette chamber, an object transfer port formed in the cassette chamber and opened at a predetermined angle to an opening direction of the cassette transfer port, for allowing the objects to be transferred into and from the cassette chamber, an elevation table provided in the cassette chamber such that the elevation table can be elevated, a shaft installed rotatably on the elevation table and extending in a direction substantially perpendicular to an opening direction of the object transfer port, a cassette support table fixed to the shaft and having a bottom support portion for receiving a bottom surface of the cassette and a back surface support portion for receiving a back surface of the cassette, for orienting the cass

Abstract: The cassette transfer mechanism of the present invention comprises a cassette chamber for housing a cassette storing a plurality of substrates, a liftable stand capable of moving up and down in the cassette chamber, a cassette holder having a bottom-surface supporting portion for supporting a bottom-surface of the cassette and a back-surface supporting portion for supporting a back-surface of the cassette, and a moving mechanism provided outside the cassette chamber and rotatably supporting the cassette holder, for moving the cassette holder between a waiting position outside the cassette chamber and the liftable stand inside the cassette chamber, wherein the moving mechanism has rotation mechanism for rotating the cassette holder around an axis crossed virtually in perpendicular to an axis extending along the moving direction of the liftable stand.