Patents by Inventor Keiichi Nakao
Keiichi Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10309528Abstract: The present invention is configured such that: in a stopped state of an electric oil pump (M/O/P), control of the electric oil pump (M/O/P) is started such that, when a driver has the intention of demanding drive force, a discharge pressure takes on a target hydraulic pressure (PTh) determined in accordance with the demanded drive force from the driver; and a pressure regulation target value of a line pressure regulation valve (101) is set to a value that is higher than or equal to the target hydraulic pressure (PTh). Thus, it is possible to provide a vehicular hydraulic control device capable of suppressing hunting in line pressure (PL) when the line pressure (PL) is regulated so as to take on the target hydraulic pressure (PTh).Type: GrantFiled: March 9, 2016Date of Patent: June 4, 2019Assignee: JATCO LTDInventors: Shusaku Katakura, Yutaka Shimizu, Yusuke Ota, Keiichi Nakao, Shintaro Ohshio, Hirotaka Suzuki
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Publication number: 20180094722Abstract: The present invention is configured such that: in a stopped state of an electric oil pump (M/O/P), control of the electric oil pump (M/O/P) is started such that, when a driver has the intention of demanding drive force, a discharge pressure takes on a target hydraulic pressure (PTh) determined in accordance with the demanded drive force from the driver; and a pressure regulation target value of a line pressure regulation valve (101) is set to a value that is higher than or equal to the target hydraulic pressure (PTh). Thus, it is possible to provide a vehicular hydraulic control device capable of suppressing hunting in line pressure (PL) when the line pressure (PL) is regulated so as to take on the target hydraulic pressure (PTh).Type: ApplicationFiled: March 9, 2016Publication date: April 5, 2018Applicant: JATCO LtdInventors: Shusaku KATAKURA, Yutaka SHIMIZU, Yusuke OTA, Keiichi NAKAO, Shintaro OHSHIO, Hirotaka SUZUKI
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Patent number: 8507076Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: GrantFiled: August 11, 2011Date of Patent: August 13, 2013Assignee: Panasonic CorporationInventors: Keiichi Nakao, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Patent number: 8247474Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: GrantFiled: May 2, 2011Date of Patent: August 21, 2012Assignee: Panasonic CorporationInventors: Keiichi Nakao, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Patent number: 8178188Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: GrantFiled: December 19, 2008Date of Patent: May 15, 2012Assignee: Panasonic CorporationInventors: Keiichi Nakao, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Patent number: 8130499Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.Type: GrantFiled: November 28, 2008Date of Patent: March 6, 2012Assignee: Panasonic CorporationInventors: Tohru Ohnishi, Hitoshi Kouno, Toshiyuki Taniguchi, Koji Nakashima, Toshiyuki Nakata, Tsunetsugu Imanishi, Keiichi Nakao
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Publication number: 20110293901Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Applicant: Panasonic CorporationInventors: Keiichi NAKAO, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Publication number: 20110203482Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: ApplicationFiled: May 2, 2011Publication date: August 25, 2011Applicant: PANASONIC CORPORATIONInventors: Keiichi NAKAO, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Publication number: 20110205286Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: ApplicationFiled: May 2, 2011Publication date: August 25, 2011Applicant: PANASONIC CORPORATIONInventors: Keiichi NAKAO, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Patent number: 7882747Abstract: The invention presents a strain sensor includes a substrate, a crystallized glass laminated on the substrate, a strain sensitive resistor laminated on the crystallized glass, in which the crystallized glass is formed by baking a plurality of types of crystallized glass powder having different thermomechanical constants. As a result, the fluctuation of sensor characteristic is decreased, and the cost is lowered.Type: GrantFiled: December 20, 2005Date of Patent: February 8, 2011Assignee: Panasonic CorporationInventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Koichi Aburata
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Publication number: 20100091464Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.Type: ApplicationFiled: November 28, 2008Publication date: April 15, 2010Applicant: PANASONIC CORPORATIONInventors: Tohru Ohnishi, Hitoshi Kouno, Toshiyuki Taniguchi, Koji Nakashima, Toshiyuki Nakata, Tsunetsugu Imanishi, Keiichi Nakao
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Publication number: 20090104384Abstract: A base layer is formed on the surface of metal plate, metal pipe, unbaked ceramic sheet, laminated ceramic green sheet, etc., the base layer causing a gelling reaction with inkjet-ink. The base layer improves ink acceptability for low viscosity inks such as inkjet-ink, and prevents oozing, draining, uneven thickness of an ink pattern and a resist pattern. Thus, the present invention enables to use an ink jet process for providing resist patterns for etching, etc., which has to fulfill stringent high precision requirements.Type: ApplicationFiled: December 19, 2008Publication date: April 23, 2009Inventors: Keiichi NAKAO, Yukihiro Shimasaki, Atsushi Iwase, Koji Shimoyama
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Publication number: 20080233370Abstract: The invention presents a strain sensor includes a substrate, a crystallized glass laminated on the substrate, a strain sensitive resistor laminated on the crystallized glass, in which the crystallized glass is formed by baking a plurality of types of crystallized glass powder having different thermomechanical constants. As a result, the fluctuation of sensor characteristic is decreased, and the cost is lowered.Type: ApplicationFiled: December 20, 2005Publication date: September 25, 2008Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Koichi Aburata
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Patent number: 7397340Abstract: A load sensor includes a substrate, a glass layer provided on the substrate, a wiring provided on the glass layer, an adjusting layer provided on the glass layer, and a strain-sensitive resistor element provided on the adjusting layer and connected to the wiring. A thermal expansion coefficient of the adjusting layer is closer to that of the strain-sensitive resistor element than that of the glass layer. In this load sensor, a stress remaining inside the resistor element is reduced, and the change over time of the resistance of the element is accordingly suppressed. Therefore, a single kind of the resistor element can be formed on substrates having respective thermal expansion coefficients, shapes, and thicknesses, thereby providing various load sensors having respective specifications.Type: GrantFiled: October 28, 2004Date of Patent: July 8, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami
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Patent number: 7181831Abstract: A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.Type: GrantFiled: September 10, 2004Date of Patent: February 27, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Toshiro Otobe
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Patent number: 7164342Abstract: The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, makes a glass layer of composite type as needed, and reduces uneven printing in printing multiple layers with use of hardening type paste.Type: GrantFiled: August 7, 2003Date of Patent: January 16, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Masaaki Katsumata
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Patent number: 7097287Abstract: Here disclosed is an ink jet apparatus having an ink-circulating/dispersing function. The apparatus provides ink with dispersion as required, and circulates the ink through a tube to an ink-collecting tank. During this circulation, a required amount of the ink is fed to a printer head to form a predetermined pattern on a surface of a substrate. By virtue of the circulating/dispersing function, the apparatus can cope well with easy-to-aggregate ink having poor stability in terms of printing, thereby protecting a printer head or an ink-spouting section from clogging during ink jet printing. Such stabilized ink jet printing contributes to manufacturing highly reliable electronic components with an increased yield of products.Type: GrantFiled: May 8, 2002Date of Patent: August 29, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Hideyuki Okinaka
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Patent number: 7043996Abstract: A strain sensor includes a metal plate, a first glass layer on the metal plate, a second glass layer provided on the first glass layer and having a color different from that of the first glass layer, an electrode on the second glass layer, a strain-sensitive resistor on the second glass layer, a circuit pattern on the second glass layer for connecting the electrode to the strain-sensitive resistor, and an overcoat glass layer for covering the strain-sensitive resistor and the circuit pattern. The strain sensor allows the layers to be identified while being manufactured, hence being controlled easily in its manufacturing processes.Type: GrantFiled: September 17, 2002Date of Patent: May 16, 2006Assignee: Matsushita Electric Industrial Co., Inc.Inventors: Yukio Mizukami, Hiroaki Ishida, Toshiro Otobe, Keiichi Nakao
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Patent number: 7010986Abstract: A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.Type: GrantFiled: October 2, 2002Date of Patent: March 14, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Nakao, Yukio Mizukami, Hiroaki Ishida, Toshiro Otobe
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Publication number: 20060001521Abstract: A load sensor includes a substrate, a glass layer provided on the substrate, a wiring provided on the glass layer, an adjusting layer provided on the glass layer, and a strain-sensitive resistor element provided on the adjusting layer and connected to the wiring. A thermal expansion coefficient of the adjusting layer is closer to that of the strain-sensitive resistor element than that of the glass layer. In this load sensor, a stress remaining inside the resistor element is reduced, and the change over time of the resistance of the element is accordingly suppressed. Therefore, a single kind of the resistor element can be formed on substrates having respective thermal expansion coefficients, shapes, and thicknesses, thereby providing various load sensors having respective specifications.Type: ApplicationFiled: October 28, 2004Publication date: January 5, 2006Inventors: Keiichi Nakao, Yukio Mizukami