Patents by Inventor Keiichi Yamaoka

Keiichi Yamaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding device
    Patent number: 8168920
    Abstract: A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: May 1, 2012
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventors: Toru Terada, Eiji Tanaka, Yasuhisa Matsumoto, Keiichi Yamaoka
  • BONDING DEVICE
    Publication number: 20090071945
    Abstract: A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 19, 2009
    Applicant: SHIBUYA KOGYO CO., LTD.
    Inventors: Toru TERADA, Eiji TANAKA, Yasuhisa MATSUMOTO, Keiichi YAMAOKA