Patents by Inventor Keiju YAMADA

Keiju YAMADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013586
    Abstract: According to an embodiment, an electronic apparatus includes a substrate, a semiconductor device, a non-conductive portion, first and second metal films, and a rechargeable battery. The semiconductor device is mounted on a first surface of the substrate and includes a wireless circuit. The non-conductive portion is formed on the first surface to seal the semiconductor device. The first metal film is provided along a surface of the non-conductive portion and at least one edge surface of the substrate to contact at the edge surface with a first-wire disposed on the substrate. The second metal film is provided along the surface of the non-conductive portion and the edge surface and separately from the first metal film to contact at the edge surface with a second-wire disposed on the substrate. The rechargeable battery includes first and second electrodes electrically connected to the first-wire and to the second-wire, respectively.
    Type: Application
    Filed: February 27, 2020
    Publication date: January 14, 2021
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Keiju YAMADA
  • Patent number: 10775197
    Abstract: According to one embodiment, a sensor includes a sensing element portion and a first magnetic portion. The sensing element portion includes a supporter, a deformable film portion supported by the supporter, and a first element including a magnetic layer and being provided at the film portion. The first magnetic portion is separated from the sensing element portion. The first magnetic portion includes a plurality of first holes. A width of one of the plurality of first holes along a second direction is narrower than a length of the sensing element portion along the second direction and wider than a length of the first element along the second direction. The second direction crosses a first direction from the film portion toward the first element.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 15, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Yoshihiko Fuji, Keiju Yamada, Kei Masunishi, Michiko Hara, Yoshihiro Higashi, Kazuaki Oakamoto, Shiori Kaji
  • Patent number: 10673125
    Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 2, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiju Yamada, Makoto Sano, Makoto Higaki, Koh Hashimoto, Akihiko Happoya
  • Patent number: 10644388
    Abstract: The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: May 5, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Keiju Yamada, Makoto Sano, Makoto Higaki, Koh Hashimoto
  • Patent number: 10553954
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: February 4, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Keiju Yamada, Makoto Sano, Koh Hashimoto, Makoto Higaki
  • Patent number: 10439264
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: October 8, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koh Hashimoto, Makoto Sano, Keiju Yamada
  • Publication number: 20190288375
    Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Keiju YAMADA, Makoto Sano, Makoto Higaki, Koh Hashimoto, Akihiko Happoya
  • Publication number: 20190285436
    Abstract: According to one embodiment, a sensor includes a sensing element portion and a first magnetic portion. The sensing element portion includes a supporter, a deformable film portion supported by the supporter, and a first element including a magnetic layer and being provided at the film portion. The first magnetic portion is separated from the sensing element portion. The first magnetic portion includes a plurality of first holes. A width of one of the plurality of first holes along a second direction is narrower than a length of the sensing element portion along the second direction and wider than a length of the first element along the second direction. The second direction crosses a first direction from the film portion toward the first element.
    Type: Application
    Filed: August 31, 2018
    Publication date: September 19, 2019
    Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Yoshihiko FUJI, Keiju Yamada, Kei Masunishi, Michiko Hara, Yoshihiro Higashi, Kazuaki Okamoto, Shiori Kaji
  • Patent number: 10355338
    Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: July 16, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiju Yamada, Makoto Sano, Makoto Higaki, Koh Hashimoto, Akihiko Happoya
  • Publication number: 20190214716
    Abstract: The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.
    Type: Application
    Filed: September 10, 2018
    Publication date: July 11, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Keiju YAMADA, Makoto Sano, Makoto Higaki, Koh Hashimoto
  • Publication number: 20190131712
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 2, 2019
    Inventors: Keiju YAMADA, Makoto SANO, Koh HASHIMOTO, Makoto HIGAKI
  • Patent number: 10211541
    Abstract: According to one embodiment, an antenna device includes first and second split ring resonators and a power supply line. The first split ring resonator includes a conductor enclosing a first opening and having a first void separating a part of the conductor. The second split ring resonator is opposed to the first split ring resonator, including a conductor which encloses a second opening and has a second void separating a part of the conductor. The power supply line feeds power to the first or second split ring resonator. The first split ring resonator is not electrically connected to the second split ring resonator. The first void does not overlap with the second void in an opposing direction of the first split ring resonator and the second split ring resonator.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 19, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Makoto Sano, Keiju Yamada, Koh Hashimoto, Makoto Higaki
  • Patent number: 10199736
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 5, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiju Yamada, Makoto Sano, Koh Hashimoto, Makoto Higaki
  • Publication number: 20180283999
    Abstract: According to one embodiment, a specimen test apparatus includes a resonator, a detector, a radiator, and a dielectric. The resonator is configured to house a test container filled with a test solution. The detector detects a detection target substance contained in the test solution in the test container. The radiator is arranged in the resonator and emits electromagnetic waves, which resonate in a specific resonance direction in the resonator, into the resonator. The dielectric is arranged in the resonator at a position near the test container when the test container is placed in the resonator.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 4, 2018
    Applicant: Canon Medical Systems Corporation
    Inventors: Keiju YAMADA, Takayoshi ITOU, Shoichi KANAYAMA, Naru IKEDA, Motoji HARAGASHIRA
  • Publication number: 20180226722
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.
    Type: Application
    Filed: July 31, 2017
    Publication date: August 9, 2018
    Inventors: Keiju YAMADA, Makoto SANO, Koh HASHIMOTO, Makoto HIGAKI
  • Publication number: 20180205133
    Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.
    Type: Application
    Filed: August 21, 2017
    Publication date: July 19, 2018
    Inventors: Koh HASHIMOTO, Makoto SANO, Keiju YAMADA
  • Publication number: 20180123261
    Abstract: According to one embodiment, an antenna device includes first and second split ring resonators and a power supply line. The first split ring resonator includes a conductor enclosing a first opening and having a first void separating a part of the conductor. The second split ring resonator is opposed to the first split ring resonator, including a conductor which encloses a second opening and has a second void separating a part of the conductor. The power supply line feeds power to the first or second split ring resonator. The first split ring resonator is not electrically connected to the second split ring resonator. The first void does not overlap with the second void in an opposing direction of the first split ring resonator and the second split ring resonator.
    Type: Application
    Filed: August 30, 2017
    Publication date: May 3, 2018
    Inventors: Makoto SANO, Keiju YAMADA, Koh HASHIMOTO, Makoto HIGAKI
  • Publication number: 20180053987
    Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.
    Type: Application
    Filed: February 24, 2017
    Publication date: February 22, 2018
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Keiju YAMADA, Makoto SANO, Makoto HIGAKI, Koh HASHIMOTO, Akihiko HAPPOYA
  • Patent number: 9885762
    Abstract: A magnetic shielded package includes a magnetic device, a first magnetic shield member, and a second magnetic shield member. The first magnetic shield member is disposed below the magnetic device. The second magnetic shield member is disposed on the first magnetic shield member so as to cover the magnetic device. An opening portion is formed in the first magnetic shield member (i) at such a position as not to be adjacent to an outer circumference of the first magnetic shield member or (ii) an upper wall of the second magnetic shield member.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: February 6, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keiju Yamada, Mikiya Iida, Kei Masunishi, Kazuo Shimokawa, Hideaki Fukuzawa, Michiko Hara
  • Patent number: 9793202
    Abstract: According to an embodiment, a wireless apparatus includes an interposer substrate, a semiconductor chip, a nonconductive layer, and a conductive film. The interposer substrate includes a conductive portion. The semiconductor chip is mounted on a component mounting face of the interposer substrate. The nonconductive layer is provided on the component mounting face to seal the chip. The conductive film is configured to cover a surface of the nonconductive layer and a side of the interposer substrate and is electrically connected to the conductive portion. The film has a first slot aperture. The conductive portion has a second slot aperture connecting to the first slot aperture. The first and second slot apertures serve as an integrated slot antenna. The antenna has first and second portions. The first portion includes a boundary between the first and second slot apertures and has a width larger than a width of the second portion.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: October 17, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koh Hashimoto, Makoto Sano, Keiju Yamada, Makoto Higaki, Akihiko Happoya