Patents by Inventor Keika HASHIMOTO

Keika HASHIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210116810
    Abstract: Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 ?m or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).
    Type: Application
    Filed: July 25, 2019
    Publication date: April 22, 2021
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Yuki MASUDA, Yuki TAKEYAMA
  • Publication number: 20200192227
    Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
    Type: Application
    Filed: February 25, 2020
    Publication date: June 18, 2020
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Kazuto MIYOSHI, Masao TOMIKAWA
  • Patent number: 10613439
    Abstract: The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: April 7, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Keika Hashimoto, Satoshi Kamemoto, Kazuto Miyoshi
  • Publication number: 20190250511
    Abstract: The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.
    Type: Application
    Filed: August 30, 2017
    Publication date: August 15, 2019
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuki MASUDA, Keika HASHIMOTO, Ryoji OKUDA
  • Publication number: 20180011404
    Abstract: The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.
    Type: Application
    Filed: September 22, 2017
    Publication date: January 11, 2018
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Satoshi KAMEMOTO, Kazuto MIYOSHI
  • Publication number: 20170299965
    Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
    Type: Application
    Filed: October 1, 2015
    Publication date: October 19, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Keika HASHIMOTO, Kazuto MIYOSHI, Masao TOMIKAWA